CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research Methodology
1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. Key findings of the study
2.2. CXO Perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top investment pockets
3.3. Porter’s five forces analysis
3.4. Top player positioning
3.5. Market dynamics
3.5.1. Drivers
3.5.2. Restraints
3.5.3. Opportunities
3.6. COVID-19 Impact Analysis on the market
CHAPTER 4: SPACE ELECTRONICS MARKET, BY PLATFORM
4.1 Overview
4.1.1 Market size and forecast
4.2 Satellite
4.2.1 Key market trends, growth factors and opportunities
4.2.2 Market size and forecast, by region
4.2.3 Market analysis by country
4.3 Launch Vehicles
4.3.1 Key market trends, growth factors and opportunities
4.3.2 Market size and forecast, by region
4.3.3 Market analysis by country
4.4 Deep Space Probes
4.4.1 Key market trends, growth factors and opportunities
4.4.2 Market size and forecast, by region
4.4.3 Market analysis by country
CHAPTER 5: SPACE ELECTRONICS MARKET, BY APPLICATION
5.1 Overview
5.1.1 Market size and forecast
5.2 Communication
5.2.1 Key market trends, growth factors and opportunities
5.2.2 Market size and forecast, by region
5.2.3 Market analysis by country
5.3 Earth Observation
5.3.1 Key market trends, growth factors and opportunities
5.3.2 Market size and forecast, by region
5.3.3 Market analysis by country
5.4 Navigation, Global Positioning System (GPS) and Surveillance
5.4.1 Key market trends, growth factors and opportunities
5.4.2 Market size and forecast, by region
5.4.3 Market analysis by country
5.5 Technology Development and Education
5.5.1 Key market trends, growth factors and opportunities
5.5.2 Market size and forecast, by region
5.5.3 Market analysis by country
5.6 Others
5.6.1 Key market trends, growth factors and opportunities
5.6.2 Market size and forecast, by region
5.6.3 Market analysis by country
CHAPTER 6: SPACE ELECTRONICS MARKET, BY TYPE
6.1 Overview
6.1.1 Market size and forecast
6.2 Radiation Hardened
6.2.1 Key market trends, growth factors and opportunities
6.2.2 Market size and forecast, by region
6.2.3 Market analysis by country
6.3 Radiation Tolerant
6.3.1 Key market trends, growth factors and opportunities
6.3.2 Market size and forecast, by region
6.3.3 Market analysis by country
CHAPTER 7: SPACE ELECTRONICS MARKET, BY COMPONENT
7.1 Overview
7.1.1 Market size and forecast
7.2 Microprocessors and Controllers
7.2.1 Key market trends, growth factors and opportunities
7.2.2 Market size and forecast, by region
7.2.3 Market analysis by country
7.3 Sensors
7.3.1 Key market trends, growth factors and opportunities
7.3.2 Market size and forecast, by region
7.3.3 Market analysis by country
7.4 Application Specific Integrated Circuits (ASIC)
7.4.1 Key market trends, growth factors and opportunities
7.4.2 Market size and forecast, by region
7.4.3 Market analysis by country
7.5 Memory Chips
7.5.1 Key market trends, growth factors and opportunities
7.5.2 Market size and forecast, by region
7.5.3 Market analysis by country
7.6 Power Source and Cables
7.6.1 Key market trends, growth factors and opportunities
7.6.2 Market size and forecast, by region
7.6.3 Market analysis by country
7.7 Discrete Semiconductors
7.7.1 Key market trends, growth factors and opportunities
7.7.2 Market size and forecast, by region
7.7.3 Market analysis by country
7.8 Other
7.8.1 Key market trends, growth factors and opportunities
7.8.2 Market size and forecast, by region
7.8.3 Market analysis by country
CHAPTER 8: SPACE ELECTRONICS MARKET, BY REGION
8.1 Overview
8.1.1 Market size and forecast
8.2 North America
8.2.1 Key trends and opportunities
8.2.2 North America Market size and forecast, by Platform
8.2.3 North America Market size and forecast, by Application
8.2.4 North America Market size and forecast, by Type
8.2.5 North America Market size and forecast, by Component
8.2.6 North America Market size and forecast, by country
8.2.6.1 U.S.
8.2.6.1.1 Market size and forecast, by Platform
8.2.6.1.2 Market size and forecast, by Application
8.2.6.1.3 Market size and forecast, by Type
8.2.6.1.4 Market size and forecast, by Component
8.2.6.2 Canada
8.2.6.2.1 Market size and forecast, by Platform
8.2.6.2.2 Market size and forecast, by Application
8.2.6.2.3 Market size and forecast, by Type
8.2.6.2.4 Market size and forecast, by Component
8.2.6.3 Mexico
8.2.6.3.1 Market size and forecast, by Platform
8.2.6.3.2 Market size and forecast, by Application
8.2.6.3.3 Market size and forecast, by Type
8.2.6.3.4 Market size and forecast, by Component
8.3 Europe
8.3.1 Key trends and opportunities
8.3.2 Europe Market size and forecast, by Platform
8.3.3 Europe Market size and forecast, by Application
8.3.4 Europe Market size and forecast, by Type
8.3.5 Europe Market size and forecast, by Component
8.3.6 Europe Market size and forecast, by country
8.3.6.1 Germany
8.3.6.1.1 Market size and forecast, by Platform
8.3.6.1.2 Market size and forecast, by Application
8.3.6.1.3 Market size and forecast, by Type
8.3.6.1.4 Market size and forecast, by Component
8.3.6.2 France
8.3.6.2.1 Market size and forecast, by Platform
8.3.6.2.2 Market size and forecast, by Application
8.3.6.2.3 Market size and forecast, by Type
8.3.6.2.4 Market size and forecast, by Component
8.3.6.3 Italy
8.3.6.3.1 Market size and forecast, by Platform
8.3.6.3.2 Market size and forecast, by Application
8.3.6.3.3 Market size and forecast, by Type
8.3.6.3.4 Market size and forecast, by Component
8.3.6.4 Spain
8.3.6.4.1 Market size and forecast, by Platform
8.3.6.4.2 Market size and forecast, by Application
8.3.6.4.3 Market size and forecast, by Type
8.3.6.4.4 Market size and forecast, by Component
8.3.6.5 Russia
8.3.6.5.1 Market size and forecast, by Platform
8.3.6.5.2 Market size and forecast, by Application
8.3.6.5.3 Market size and forecast, by Type
8.3.6.5.4 Market size and forecast, by Component
8.3.6.6 U.K.
8.3.6.6.1 Market size and forecast, by Platform
8.3.6.6.2 Market size and forecast, by Application
8.3.6.6.3 Market size and forecast, by Type
8.3.6.6.4 Market size and forecast, by Component
8.3.6.7 Rest of Europe
8.3.6.7.1 Market size and forecast, by Platform
8.3.6.7.2 Market size and forecast, by Application
8.3.6.7.3 Market size and forecast, by Type
8.3.6.7.4 Market size and forecast, by Component
8.4 Asia-Pacific
8.4.1 Key trends and opportunities
8.4.2 Asia-Pacific Market size and forecast, by Platform
8.4.3 Asia-Pacific Market size and forecast, by Application
8.4.4 Asia-Pacific Market size and forecast, by Type
8.4.5 Asia-Pacific Market size and forecast, by Component
8.4.6 Asia-Pacific Market size and forecast, by country
8.4.6.1 China
8.4.6.1.1 Market size and forecast, by Platform
8.4.6.1.2 Market size and forecast, by Application
8.4.6.1.3 Market size and forecast, by Type
8.4.6.1.4 Market size and forecast, by Component
8.4.6.2 India
8.4.6.2.1 Market size and forecast, by Platform
8.4.6.2.2 Market size and forecast, by Application
8.4.6.2.3 Market size and forecast, by Type
8.4.6.2.4 Market size and forecast, by Component
8.4.6.3 Japan
8.4.6.3.1 Market size and forecast, by Platform
8.4.6.3.2 Market size and forecast, by Application
8.4.6.3.3 Market size and forecast, by Type
8.4.6.3.4 Market size and forecast, by Component
8.4.6.4 South Korea
8.4.6.4.1 Market size and forecast, by Platform
8.4.6.4.2 Market size and forecast, by Application
8.4.6.4.3 Market size and forecast, by Type
8.4.6.4.4 Market size and forecast, by Component
8.4.6.5 Rest of Asia-Pacific
8.4.6.5.1 Market size and forecast, by Platform
8.4.6.5.2 Market size and forecast, by Application
8.4.6.5.3 Market size and forecast, by Type
8.4.6.5.4 Market size and forecast, by Component
8.5 LAMEA
8.5.1 Key trends and opportunities
8.5.2 LAMEA Market size and forecast, by Platform
8.5.3 LAMEA Market size and forecast, by Application
8.5.4 LAMEA Market size and forecast, by Type
8.5.5 LAMEA Market size and forecast, by Component
8.5.6 LAMEA Market size and forecast, by country
8.5.6.1 Latin America
8.5.6.1.1 Market size and forecast, by Platform
8.5.6.1.2 Market size and forecast, by Application
8.5.6.1.3 Market size and forecast, by Type
8.5.6.1.4 Market size and forecast, by Component
8.5.6.2 Middle East
8.5.6.2.1 Market size and forecast, by Platform
8.5.6.2.2 Market size and forecast, by Application
8.5.6.2.3 Market size and forecast, by Type
8.5.6.2.4 Market size and forecast, by Component
8.5.6.3 Africa
8.5.6.3.1 Market size and forecast, by Platform
8.5.6.3.2 Market size and forecast, by Application
8.5.6.3.3 Market size and forecast, by Type
8.5.6.3.4 Market size and forecast, by Component
CHAPTER 9: COMPANY LANDSCAPE
9.1. Introduction
9.2. Top winning strategies
9.3. Product Mapping of Top 10 Player
9.4. Competitive Dashboard
9.5. Competitive Heatmap
9.6. Key developments
CHAPTER 10: COMPANY PROFILES
10.1 BAE System
10.1.1 Company overview
10.1.2 Company snapshot
10.1.3 Operating business segments
10.1.4 Product portfolio
10.1.5 Business performance
10.1.6 Key strategic moves and developments
10.2 Cobham Limited
10.2.1 Company overview
10.2.2 Company snapshot
10.2.3 Operating business segments
10.2.4 Product portfolio
10.2.5 Business performance
10.2.6 Key strategic moves and developments
10.3 Honeywell International Inc.
10.3.1 Company overview
10.3.2 Company snapshot
10.3.3 Operating business segments
10.3.4 Product portfolio
10.3.5 Business performance
10.3.6 Key strategic moves and developments
10.4 Microchip Technology Inc
10.4.1 Company overview
10.4.2 Company snapshot
10.4.3 Operating business segments
10.4.4 Product portfolio
10.4.5 Business performance
10.4.6 Key strategic moves and developments
10.5 RUAG Group
10.5.1 Company overview
10.5.2 Company snapshot
10.5.3 Operating business segments
10.5.4 Product portfolio
10.5.5 Business performance
10.5.6 Key strategic moves and developments
10.6 STMicroelectronics
10.6.1 Company overview
10.6.2 Company snapshot
10.6.3 Operating business segments
10.6.4 Product portfolio
10.6.5 Business performance
10.6.6 Key strategic moves and developments
10.7 Teledyne Technologies Incorporated
10.7.1 Company overview
10.7.2 Company snapshot
10.7.3 Operating business segments
10.7.4 Product portfolio
10.7.5 Business performance
10.7.6 Key strategic moves and developments
10.8 Texas Instruments Incorporated
10.8.1 Company overview
10.8.2 Company snapshot
10.8.3 Operating business segments
10.8.4 Product portfolio
10.8.5 Business performance
10.8.6 Key strategic moves and developments
10.9 TT Electronics
10.9.1 Company overview
10.9.2 Company snapshot
10.9.3 Operating business segments
10.9.4 Product portfolio
10.9.5 Business performance
10.9.6 Key strategic moves and developments
10.10 Xilinx, Inc
10.10.1 Company overview
10.10.2 Company snapshot
10.10.3 Operating business segments
10.10.4 Product portfolio
10.10.5 Business performance
10.10.6 Key strategic moves and developments