1 Introduction 7
1.1 Industry Definition and Research Scope 7
1.1.1 Industry Definition 7
1.1.2 Research Scope 8
1.2 Research Methodology 11
1.2.1 Overview of Market Research Methodology 11
1.2.2 Market Assumption 12
1.2.3 Secondary Data 12
1.2.4 Primary Data 12
1.2.5 Data Filtration and Model Design 13
1.2.6 Market Size/Share Estimation 14
1.2.7 Research Limitations 15
1.3 Executive Summary 16
2 Market Overview and Dynamics 19
2.1 Market Size and Forecast 19
2.1.1 Impact of COVID-19 on World Economy 20
2.1.2 Impact of COVID-19 on the Market 22
2.2 Major Growth Drivers 24
2.3 Market Restraints and Challenges 27
2.4 Emerging Opportunities and Market Trends 30
2.5 Porters Fiver Forces Analysis 34
3 Segmentation of Asia Pacific Market by Product Type 38
3.1 Market Overview by Product Type 38
3.2 Active Packaging 40
3.3 Smart and Intelligent Packaging 41
4 Segmentation of Asia Pacific Market by Packaging Platform 42
4.1 Market Overview by Packaging Platform 42
4.2 Flip-Chip Ball Grid Array 44
4.3 Flip Chip CSP 45
4.4 Wafer Level CSP 46
4.5 2.5D/3D Integrated Circuit 47
4.6 Fan Out Wafer Level Package (Fo-WLP) 48
4.7 Embedded Die 49
4.8 Fan In Wafer Level Package (Fi-WLP) 50
4.9 Other Packaging Platforms 51
5 Segmentation of Asia Pacific Market by End User 52
5.1 Market Overview by End User 52
5.2 Consumer Electronics 54
5.3 IT and Telecom 55
5.4 Automotive and Transportation 56
5.5 Industrial Sector 57
5.6 Healthcare and Life Science 58
5.7 Aerospace and Defense 59
5.8 Other End Users 60
6 Asia-Pacific Market 2021-2031 by Country 61
6.1 Overview of Asia-Pacific Market 61
6.2 Japan 64
6.3 China 67
6.4 Australia 69
6.5 India 71
6.6 South Korea 73
6.7 Rest of APAC Region 75
7 Competitive Landscape 77
7.1 Overview of Key Vendors 77
7.2 New Product Launch, Partnership, Investment, and M&A 80
7.3 Company Profiles 81
Advanced Semiconductor Engineering Inc. 81
Amkor Technology, Inc. 83
Brewer Science, Inc. 84
Chipbond Technology Corporation 85
Intel Corporation 86
International Business Machines Corporation (IBM) 87
Microchip Technology, Inc. 88
Qualcomm Technologies, Inc. 89
Renesas Electronics Corporation 90
Samsung Electronics Co., Ltd. 91
STATS ChipPAC Pte. Ltd 92
SSS Microtec Se 93
Taiwan Semiconductor Manufacturing Company, Limited 94
Texas Instruments, Inc. 95
Universal Instruments Corporation 96
RELATED REPORTS 97