1 Introduction 6
1.1 Industry Definition and Research Scope 6
1.1.1 Industry Definition 6
1.1.2 Research Scope 7
1.2 Research Methodology 10
1.2.1 Overview of Market Research Methodology 10
1.2.2 Market Assumption 11
1.2.3 Secondary Data 11
1.2.4 Primary Data 11
1.2.5 Data Filtration and Model Design 12
1.2.6 Market Size/Share Estimation 13
1.2.7 Research Limitations 14
1.3 Executive Summary 15
2 Market Overview and Dynamics 17
2.1 Market Size and Forecast 17
2.1.1 Impact of COVID-19 on World Economy 18
2.1.2 Impact of COVID-19 on the Market 20
2.2 Major Growth Drivers 22
2.3 Market Restraints and Challenges 25
2.4 Emerging Opportunities and Market Trends 28
2.5 Porters Fiver Forces Analysis 32
3 Segmentation of North America Market by Product Type 36
3.1 Market Overview by Product Type 36
3.2 Active Packaging 38
3.3 Smart and Intelligent Packaging 39
4 Segmentation of North America Market by Packaging Platform 40
4.1 Market Overview by Packaging Platform 40
4.2 Flip-Chip Ball Grid Array 42
4.3 Flip Chip CSP 43
4.4 Wafer Level CSP 44
4.5 2.5D/3D Integrated Circuit 45
4.6 Fan Out Wafer Level Package (Fo-WLP) 46
4.7 Embedded Die 47
4.8 Fan In Wafer Level Package (Fi-WLP) 48
4.9 Other Packaging Platforms 49
5 Segmentation of North America Market by End User 50
5.1 Market Overview by End User 50
5.2 Consumer Electronics 52
5.3 IT and Telecom 53
5.4 Automotive and Transportation 54
5.5 Industrial Sector 55
5.6 Healthcare and Life Science 56
5.7 Aerospace and Defense 57
5.8 Other End Users 58
6 North America Market 2021-2031 by Country 59
6.1 Overview of North America Market 59
6.2 U.S. 62
6.3 Canada 65
6.4 Mexico 67
7 Competitive Landscape 69
7.1 Overview of Key Vendors 69
7.2 New Product Launch, Partnership, Investment, and M&A 72
7.3 Company Profiles 73
Advanced Semiconductor Engineering Inc. 73
Amkor Technology, Inc. 75
Brewer Science, Inc. 76
Chipbond Technology Corporation 77
Intel Corporation 78
International Business Machines Corporation (IBM) 79
Microchip Technology, Inc. 80
Qualcomm Technologies, Inc. 81
Renesas Electronics Corporation 82
Samsung Electronics Co., Ltd. 83
STATS ChipPAC Pte. Ltd 84
SSS Microtec Se 85
Taiwan Semiconductor Manufacturing Company, Limited 86
Texas Instruments, Inc. 87
Universal Instruments Corporation 88
RELATED REPORTS 89