1 Introduction 8
1.1 Industry Definition and Research Scope 8
1.1.1 Industry Definition 8
1.1.2 Research Scope 9
1.2 Research Methodology 12
1.2.1 Overview of Market Research Methodology 12
1.2.2 Market Assumption 13
1.2.3 Secondary Data 13
1.2.4 Primary Data 13
1.2.5 Data Filtration and Model Design 14
1.2.6 Market Size/Share Estimation 15
1.2.7 Research Limitations 16
1.3 Executive Summary 17
2 Market Overview and Dynamics 20
2.1 Market Size and Forecast 20
2.1.1 Impact of COVID-19 on World Economy 21
2.1.2 Impact of COVID-19 on the Market 23
2.2 Major Growth Drivers 25
2.3 Market Restraints and Challenges 28
2.4 Emerging Opportunities and Market Trends 31
2.5 Porters Fiver Forces Analysis 35
3 Segmentation of Global Market by Product Type 39
3.1 Market Overview by Product Type 39
3.2 Active Packaging 41
3.3 Smart and Intelligent Packaging 42
4 Segmentation of Global Market by Packaging Platform 43
4.1 Market Overview by Packaging Platform 43
4.2 Flip-Chip Ball Grid Array 45
4.3 Flip Chip CSP 46
4.4 Wafer Level CSP 47
4.5 2.5D/3D Integrated Circuit 48
4.6 Fan Out Wafer Level Package (Fo-WLP) 49
4.7 Embedded Die 50
4.8 Fan In Wafer Level Package (Fi-WLP) 51
4.9 Other Packaging Platforms 52
5 Segmentation of Global Market by End User 53
5.1 Market Overview by End User 53
5.2 Consumer Electronics 55
5.3 IT and Telecom 56
5.4 Automotive and Transportation 57
5.5 Industrial Sector 58
5.6 Healthcare and Life Science 59
5.7 Aerospace and Defense 60
5.8 Other End Users 61
6 Segmentation of Global Market by Region 62
6.1 Geographic Market Overview 2021-2031 62
6.2 North America Market 2021-2031 by Country 66
6.2.1 Overview of North America Market 66
6.2.2 U.S. 70
6.2.3 Canada 73
6.2.4 Mexico 75
6.3 European Market 2021-2031 by Country 77
6.3.1 Overview of European Market 77
6.3.2 Germany 81
6.3.3 U.K. 83
6.3.4 France 85
6.3.5 Spain 87
6.3.6 Italy 89
6.3.7 Russia 91
6.3.8 Rest of European Market 93
6.4 Asia-Pacific Market 2021-2031 by Country 95
6.4.1 Overview of Asia-Pacific Market 95
6.4.2 Japan 99
6.4.3 China 102
6.4.4 Australia 104
6.4.5 India 106
6.4.6 South Korea 108
6.4.7 Rest of APAC Region 110
6.5 South America Market 2021-2031 by Country 112
6.5.1 Argentina 115
6.5.2 Brazil 117
6.5.3 Chile 119
6.5.4 Rest of South America Market 121
6.6 MEA Market 2021-2031 by Country 122
6.6.1 Turkey 125
6.6.2 Iran 127
6.6.3 South Africa 129
6.6.4 Other National Markets 131
7 Competitive Landscape 132
7.1 Overview of Key Vendors 132
7.2 New Product Launch, Partnership, Investment, and M&A 135
7.3 Company Profiles 136
Advanced Semiconductor Engineering Inc. 136
Amkor Technology, Inc. 138
Brewer Science, Inc. 139
Chipbond Technology Corporation 140
Intel Corporation 141
International Business Machines Corporation (IBM) 142
Microchip Technology, Inc. 143
Qualcomm Technologies, Inc. 144
Renesas Electronics Corporation 145
Samsung Electronics Co., Ltd. 146
STATS ChipPAC Pte. Ltd 147
SSS Microtec Se 148
Taiwan Semiconductor Manufacturing Company, Limited 149
Texas Instruments, Inc. 150
Universal Instruments Corporation 151
RELATED REPORTS 152