TABLE OF CONTENTS
1 INTRODUCTION 39
1.1 OBJECTIVES OF THE STUDY 39
1.2 MARKET DEFINITION 39
1.3 OVERVIEW OF GLOBAL SEMICONDUCTOR IP MARKET 39
1.4 CURRENCY AND PRICING 40
1.5 LIMITATIONS 41
1.6 MARKETS COVERED 41
2 MARKET SEGMENTATION 45
2.1 MARKETS COVERED 45
2.2 YEARS CONSIDERED FOR THE STUDY 46
2.3 DBMR TRIPOD DATA VALIDATION MODEL 47
2.4 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 50
2.5 DBMR MARKET POSITION GRID 51
2.6 TIME LINE GRID 52
2.7 MULTIVARIATE MODELLING 53
2.8 SECONDARY SOURCES 54
2.9 ASSUMPTIONS 54
3 EXECUTIVE SUMMARY 55
4 PREMIUM INSIGHTS 58
5 MARKET OVERVIEW 60
5.1 DRIVERS 62
5.1.1 INCREASING DEMAND FOR CONNECTED DEVICES 62
5.1.2 RISING DEMAND FOR SEMICONDUCTORS IN AUTOMOBILE INDUSTRY 63
5.1.3 GROWING ACCEPTANCE OF THIRD PARTY IP 63
5.1.4 INCRESING POPULARITY OF MODERN SOC DESIGNS 64
5.2 RESTRAINT 64
5.2.1 SEMICONDUCTOR IP THEFT 64
5.3 OPPORTUNITIES 65
5.3.1 ADVANCEMENTS IN SEMICONDUCTOR IP MARKET 65
5.3.2 INCREASING USE OF SEMICONDUCTORS IN DEFENSE SECTOR 65
5.4 CHALLENGE 66
5.4.1 INTEGRATION OF IP INTO SEMICONDUCTOR 66
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6 GLOBAL SEMICONDUCTOR IP MARKET, BY TYPE 67
6.1 OVERVIEW 68
6.2 CPU SIP 69
6.3 WIRED SIP 70
6.4 GPU SIP 70
6.5 MEMORY SIP 71
6.6 DSP SIP 71
6.7 LIBRARY SIP 72
6.8 INFRASTRUCTURE SIP 72
6.9 DIGITAL SIP 73
6.10 ANALOG SIP 73
6.11 WIRELESS SIP 74
6.12 OTHERS 74
7 GLOBAL SEMICONDUCTOR IP MARKET, BY FORM 75
7.1 OVERVIEW 76
7.2 SOFT FORM 77
7.3 HARD FORM 78
8 GLOBAL SEMICONDUCTOR IP MARKET, BY IP SOURCE 79
8.1 OVERVIEW 80
8.2 LICENSING 81
8.2.1 SOFT IP CORES 81
8.2.2 HARD IP CORES 82
8.3 ROYALTY 82
9 GLOBAL SEMICONDUCTOR IP MARKET, BY CHANNEL 83
9.1 OVERVIEW 84
9.2 DIRECT SOURCES 85
9.2.1 EDA VENDORS 85
9.2.2 FOUNDRIES 86
9.3 INTERNET CATALOGUE 86
9.3.1 SILICON IP 86
9.3.2 SOFTWARE IP 86
9.3.3 VERIFICATION IP 87
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10 GLOBAL SEMICONDUCTOR IP MARKET, BY END USER 88
10.1 OVERVIEW 89
10.2 AUTOMOTIVE 91
10.2.1 CPU SIP 91
10.2.2 WIRED SIP 91
10.2.3 GPU SIP 91
10.2.4 MEMORY SIP 92
10.2.5 DSP SIP 92
10.2.6 LIBRARY SIP 92
10.2.7 INFRASTRUCTURE SIP 92
10.2.8 DIGITAL SIP 92
10.2.9 ANALOG SIP 92
10.2.10 WIRELESS SIP 92
10.2.11 OTHERS 92
10.3 TELECOM 93
10.3.1 CPU SIP 93
10.3.2 WIRED SIP 93
10.3.3 GPU SIP 93
10.3.4 MEMORY SIP 93
10.3.5 DSP SIP 94
10.3.6 LIBRARY SIP 94
10.3.7 INFRASTRUCTURE SIP 94
10.3.8 DIGITAL SIP 94
10.3.9 ANALOG SIP 94
10.3.10 WIRELESS SIP 94
10.3.11 OTHERS 94
10.4 CONSUMER ELECTRONICS 95
10.4.1 CPU SIP 95
10.4.2 WIRED SIP 95
10.4.3 GPU SIP 95
10.4.4 MEMORY SIP 96
10.4.5 DSP SIP 96
10.4.6 LIBRARY SIP 96
10.4.7 INFRASTRUCTURE SIP 96
10.4.8 DIGITAL SIP 96
10.4.9 ANALOG SIP 96
10.4.10 WIRELESS SIP 96
10.4.11 OTHERS 96
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10.5 INDUSTRIAL 97
10.5.1 CPU SIP 97
10.5.2 WIRED SIP 97
10.5.3 GPU SIP 97
10.5.4 MEMORY SIP 98
10.5.5 DSP SIP 98
10.5.6 LIBRARY SIP 98
10.5.7 INFRASTRUCTURE SIP 98
10.5.8 DIGITAL SIP 98
10.5.9 ANALOG SIP 98
10.5.10 WIRELESS SIP 98
10.5.11 OTHERS 98
10.6 DEFENSE 99
10.6.1 CPU SIP 99
10.6.2 WIRED SIP 99
10.6.3 GPU SIP 99
10.6.4 MEMORY SIP 99
10.6.5 DSP SIP 100
10.6.6 LIBRARY SIP 100
10.6.7 INFRASTRUCTURE SIP 100
10.6.8 DIGITAL SIP 100
10.6.9 ANALOG SIP 100
10.6.10 WIRELESS SIP 100
10.6.11 OTHERS 100
10.7 COMMERCIAL 101
10.7.1 CPU SIP 101
10.7.2 WIRED SIP 101
10.7.3 GPU SIP 101
10.7.4 MEMORY SIP 101
10.7.5 DSP SIP 102
10.7.6 LIBRARY SIP 102
10.7.7 INFRASTRUCTURE SIP 102
10.7.8 DIGITAL SIP 102
10.7.9 ANALOG SIP 102
10.7.10 WIRELESS SIP 102
10.7.11 OTHERS 102
10.8 MEDICAL 103
10.8.1 CPU SIP 103
10.8.2 WIRED SIP 103
10.8.3 GPU SIP 103
10.8.4 MEMORY SIP 103
10.8.5 DSP SIP 104
10.8.6 LIBRARY SIP 104
10.8.7 INFRASTRUCTURE SIP 104
10.8.8 DIGITAL SIP 104
10.8.9 ANALOG SIP 104
10.8.10 WIRELESS SIP 104
10.8.11 OTHERS 104
10.9 OTHERS 105
11 GLOBAL SEMICONDUCTOR IP MARKET, BY GEOGRAPHY 106
11.1 OVERVIEW 107
11.2 NORTH AMERICA 112
11.2.1 U.S 122
11.2.2 CANADA 128
11.2.3 MEXICO 134
11.3 EUROPE 140
11.3.1 U.K. 150
11.3.2 GERMANY 156
11.3.3 FRANCE 162
11.3.4 NETHERLANDS 168
11.3.5 RUSSIA 174
11.3.6 BELGIUM 180
11.3.7 ITALY 186
11.3.8 SPAIN 192
11.3.9 SWITZERLAND 198
11.3.10 TURKEY 204
11.3.11 REST OF EUROPE 210
11.4 ASIA-PACIFIC 211
11.4.1 CHINA 221
11.4.2 JAPAN 227
11.4.3 TAIWAN 233
11.4.4 SOUTH KOREA 239
11.4.5 INDIA 245
11.4.6 AUSTRALIA 251
11.4.7 SINGAPORE 257
11.4.8 THAILAND 263
11.4.9 MALAYSIA 269
11.4.10 INDONESIA 275
11.4.11 PHILIPPINES 281
11.4.12 REST OF ASIA-PACIFIC 287
11.5 SOUTH AMERICA 288
11.5.1 BRAZIL 298
11.5.2 ARGENTINA 304
11.5.3 REST OF SOUTH AMERICA 310
11.6 MIDDLE EAST & AFRICA 311
11.6.1 ISRAEL 321
11.6.2 SOUTH AFRICA 327
11.6.3 EGYPT 333
11.6.4 SAUDI ARABIA 339
11.6.5 U.A.E 345
11.6.6 REST OF MIDDLE EAST & AFRICA 351
12 GLOBAL SEMICONDUCTOR IP MARKET, COMPANY LANDSCAPE 352
12.1 COMPANY SHARE ANALYSIS: GLOBAL 352
12.2 COMPANY SHARE ANALYSIS: NORTH AMERICA 353
12.3 COMPANY SHARE ANALYSIS: EUROPE 354
12.4 COMPANY SHARE ANALYSIS: ASIA-PACIFIC 355
13 SWOT ANALYSIS 356
14 COMPANY PROFILES 359
14.1 ARM LIMITED (A SUBSIDIARY OF SOFTBANK GROUP CORP.) 359
14.1.1 COMPANY SNAPSHOT 359
14.1.2 REVENUE ANALYSIS 359
14.1.3 COMPANY SHARE ANYALYSIS 360
14.1.4 PRODUCT PORTFOLIO 360
14.1.5 RECENT DEVELOPMENTS 362
14.2 SYNOPSYS, INC. 363
14.2.1 COMPANY SNAPSHOT 363
14.2.2 REVENUE ANALYSIS 363
14.2.3 COMPANY SHARE ANYALYSIS 364
14.2.4 PRODUCT PORTFOLIO 364
14.2.5 RECENT DEVELOPMENTS 365
14.3 XILINX 366
14.3.1 COMPANY SNAPSHOT 366
14.3.2 REVENUE ANALYSIS 366
14.3.3 COMPANY SHARE ANYALYSIS 367
14.3.4 PRODUCT PORTFOLIO 367
14.3.5 RECENT DEVELOPMENT 367
14.4 CADENCE DESIGN SYSTEMS, INC. 368
14.4.1 COMPANY SNAPSHOT 368
14.4.2 REVENUE ANALYSIS 368
14.4.3 COMPANY SHARE ANALYSIS 369
14.4.4 PRODUCT PORTFOLIO 369
14.4.5 RECENT DEVELOPMENTS 370
14.5 SIEMENS 371
14.5.1 COMPANY SNAPSHOT 371
14.5.2 REVENUE ANALYSIS 371
14.5.3 COMPANY SHARE ANALYSIS 372
14.5.4 PRODUCT PORTFOLIO 372
14.5.5 RECENT DEVELOPMENT 373
14.6 ACHRONIX SEMICONDUCTOR CORPORATION 374
14.6.1 COMPANY SNAPSHOT 374
14.6.2 PRODUCT PORTFOLIO 374
14.6.3 RECENT DEVELOPMENTS 374
14.7 CEVA, INC. 375
14.7.1 COMPANY SNAPSHOT 375
14.7.2 REVENUE ANALYSIS 375
14.7.3 PRODUCT PORTFOLIO 376
14.7.4 RECENT DEVELOPMENTS 376
14.8 DIGITAL CORE DESIGN 377
14.8.1 COMPANY SNAPSHOT 377
14.8.2 PRODUCT PORTFOLIO 377
14.8.3 RECENT DEVELOPMENT 378
14.9 DOLPHIN DESIGN SAS 379
14.9.1 COMPANY SNAPSHOT 379
14.9.2 PRODUCT PORTFOLIO 379
14.9.3 RECENT DEVELOPMENTS 380
14.10 DREAM CHIP TECHNOLOGIES GMBH 381
14.10.1 COMPANY SNAPSHOT 381
14.10.2 PRODUCT PORTFOLIO 381
14.10.3 RECENT DEVELOPMENT 381
14.11 EMEMORY TECHNOLOGY INC. 382
14.11.1 COMPANY SNAPSHOT 382
14.11.2 REVENUE ANALYSIS 382
14.11.3 PRODUCT PORTFOLIO 383
14.11.4 RECENT DEVELOPMENTS 383
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14.12 FARADAY TECHNOLOGY CORPORATION 384
14.12.1 COMPANY SNAPSHOT 384
14.12.2 REVENUE ANALYSIS 384
14.12.3 PRODUCT PORTFOLIO 385
14.12.4 RECENT DEVELOPMENT 386
14.13 IMAGINATION TECHNOLOGIES LIMITED 387
14.13.1 COMPANY SNAPSHOT 387
14.13.2 PRODUCT PORTFOLIO 387
14.13.3 RECENT DEVELOPMENT 388
14.14 LATTICE SEMICONDUCTOR 389
14.14.1 COMPANY SNAPSHOT 389
14.14.2 REVENUE ANALYSIS 389
14.14.3 PRODUCT PORTFOLIO 390
14.14.4 RECENT DEVELOPMENTS 391
14.15 RAMBUS.COM 392
14.15.1 COMPANY SNAPSHOT 392
14.15.2 REVENUE ANALYSIS 392
14.15.3 PRODUCT PORTFOLIO 393
14.15.4 RECENT DEVELOPMENTS 393
14.16 VERISILICON 394
14.16.1 COMPANY SNAPSHOT 394
14.16.2 PRODUCT PORTFOLIO 394
14.16.3 RECENT DEVELOPMENTS 395
14.17 WAVE COMPUTING, INC. 396
14.17.1 COMPANY SNAPSHOT 396
14.17.2 PRODUCT PORTFOLIO 396
14.17.3 RECENT DEVELOPMENTS 397
15 CONCLUSION 398
16 RELATED REPORTS 399