TABLE OF CONTENTS
1 INTRODUCTION 26
1.1 OBJECTIVES OF THE STUDY 26
1.2 MARKET DEFINITION 26
1.3 OVERVIEW OF GLOBAL SIC POWER SEMICONDUCTOR MARKET 26
1.4 CURRENCY AND PRICING 28
1.5 LIMITATIONS 28
1.6 MARKETS COVERED 28
2 MARKET SEGMENTATION 32
2.1 MARKETS COVERED 32
2.2 GEOGRAPHICAL SCOPE 33
2.3 YEARS CONSIDERED FOR THE STUDY 34
2.4 DBMR TRIPOD DATA VALIDATION MODEL 35
2.5 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 38
2.6 DBMR MARKET POSITION GRID 39
2.7 VENDOR SHARE ANALYSIS 40
2.8 MULTIVARIATE MODELING 41
2.9 PRODUCT TIMELINE CURVE 41
2.10 MARKET APPLICATION COVERAGE GRID 42
2.11 SECONDARY SOURCES 43
2.12 ASSUMPTIONS 43
3 EXECUTIVE SUMMARY 44
4 PREMIUM INSIGHTS 46
5 MARKET OVERVIEW 49
5.1 DRIVERS 51
5.1.1 BENEFIT OF SILICON CARBIDE (SIC) OVER SILICON (SI) 51
5.1.2 INCREASING ADOPTION OF BATTERY ELECTRIC VEHICLES AND HYBRID ELECTRIC VEHICLES 51
5.1.3 INCREASING USAGE OF POWER ELECTRONICS 52
5.1.4 INCREASING GROWTH OF SEMICONDUCTOR INDUSTRY 52
5.1.5 INCREASE IN DEMAND OF SOLAR PANEL 52
5.2 RESTRAINTS 53
5.2.1 INCREASE IN COST OF MANUFACTURING USING SIC SUBSTRATES 53
5.2.2 ENTRANCE OF NEW ALTERNATIVE ‘GAN' OVER SIC 53
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5.3 OPPORTUNITIES 54
5.3.1 IMPLEMENTATION OF 5G NETWORK 54
5.3.2 GROWTH OF DATA CENTERS 54
5.4 CHALLENGE 55
5.4.1 SHORTAGE OF SUPPLY FOR SIC 55
6 GLOBAL SIC POWER SEMICONDUCTOR MARKET, BY TYPE 56
6.1 OVERVIEW 57
6.2 MOSFETS 58
6.3 HYBRID MODULES 59
6.4 BIPOLAR JUNCTION TRANSISTOR (BJT) 59
6.5 SCHOTTKY BARRIER DIODES (SBDS) 60
6.6 SIC BARE DIE 60
6.7 PIN DIODE 61
6.8 JUNCTION FET (JFET) 61
6.9 OTHERS 62
7 GLOBAL SIC POWER SEMICONDUCTOR MARKET, BY VOLTAGE RANGE 63
7.1 OVERVIEW 64
7.2 901-1700V 65
7.3 301-900V 66
7.4 1701V AND ABOVE 66
7.5 LESS THAN 300V 67
8 GLOBAL SIC POWER SEMICONDUCTOR MARKET, BY APPLICATION 68
8.1 OVERVIEW 69
8.2 POWER SUPPLIES 70
8.3 INDUSTRIAL MOTOR DRIVES 70
8.4 ELECTRIC VEHICLES (EV) 71
8.5 INVERTERS 71
8.6 RF DEVICES 72
8.7 OTHERS 73
9 GLOBAL SIC POWER SEMICONDUCTOR MARKET, BY WAFER SIZE 74
9.1 OVERVIEW 75
9.2 6 INCH AND ABOVE 77
9.3 4 INCH 77
9.4 2 INCH 78
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10 GLOBAL SIC POWER SEMICONDUCTOR MARKET, BY WAFER TYPE 79
10.1 OVERVIEW 80
10.2 SIC EPITAXIAL WAFERS 81
10.3 BLANK SIC WAFERS 82
11 GLOBAL SIC POWER SEMICONDUCTOR MARKET, BY VERTICAL 83
11.1 OVERVIEW 84
11.2 INDUSTRIAL 85
11.3 AUTOMOTIVE 85
11.4 UTILITIES & ENERGY 86
11.5 CONSUMER ELECTRONICS 86
11.6 COMMERCIAL 87
11.7 IT & TELECOMMUNICATION 87
11.8 AEROPSACE & DEFENSE 88
11.9 MEDICAL 89
11.10 OTHERS 89
12 GLOBAL SIC POWER SEMICONDUCTOR MARKET, BY GEOGRAPHY 90
12.1 OVERVIEW 91
12.2 ASIA-PACIFIC 96
12.2.1 CHINA 102
12.2.2 JAPAN 105
12.2.3 SOUTH KOREA 108
12.2.4 INDIA 111
12.2.5 SINGAPORE 114
12.2.6 AUSTRALIA 117
12.2.7 THAILAND 120
12.2.8 MALAYSIA 123
12.2.9 INDONESIA 126
12.2.10 PHILIPPINES 129
12.2.11 REST OF ASIA-PACIFIC 132
12.3 NORTH AMERICA 133
12.3.1 U.S. 139
12.3.2 CANADA 141
12.3.3 MEXICO 144
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12.4 EUROPE 147
12.4.1 GERMANY 153
12.4.2 U.K. 156
12.4.3 FRANCE 158
12.4.4 ITALY 161
12.4.5 SPAIN 164
12.4.6 RUSSIA 167
12.4.7 NETHERLANDS 170
12.4.8 SWITZERLAND 173
12.4.9 TURKEY 176
12.4.10 BELGIUM 179
12.4.11 REST OF EUROPE 182
12.5 MIDDLE EAST & AFRICA 183
12.5.1 ISRAEL 189
12.5.2 SOUTH AFRICA 192
12.5.3 EGYPT 195
12.5.4 SAUDI ARABIA 198
12.5.5 U.A.E. 201
12.5.6 REST OF MIDDLE EAST & AFRICA 204
12.6 SOUTH AMERICA 205
12.6.1 BRAZIL 211
12.6.2 ARGENTINA 214
12.6.3 REST OF SOUTH AMERICA 217
13 GLOBAL SIC POWER SEMICONDUCTOR MARKET, COMPANY LANDSCAPE 218
13.1 COMPANY SHARE ANALYSIS: GLOBAL 218
13.2 COMPANY SHARE ANALYSIS: NORTH AMERICA 219
13.3 COMPANY SHARE ANALYSIS: EUROPE 220
13.4 COMPANY SHARE ANALYSIS: ASIA- PACIFIC 221
14 COMPANY PROFILES 222
14.1 CREE, INC. 222
14.1.1 COMPANY SNAPSHOT 222
14.1.2 REVENUE ANALYSIS 223
14.1.3 COMPANY SHARE ANALYSIS 223
14.1.4 PRODUCT PORTFOLIO 224
14.1.5 RECENT DEVELOPMENTS 225
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14.2 STMICROELECTRONICS 226
14.2.1 COMPANY SNAPSHOT 226
14.2.2 REVENUE ANALYSIS 227
14.2.3 COMPANY SHARE ANALYSIS 227
14.2.4 PRODUCT PORTFOLIO 228
14.2.5 RECENT DEVELOPMENTS 229
14.3 INFINEON TECHNOLOGIES AG 230
14.3.1 COMPANY SNAPSHOT 230
14.3.2 REVENUE ANALYSIS 231
14.3.3 COMPANY SHARE ANALYSIS 231
14.3.4 PRODUCT PORTFOLIO 232
14.3.5 RECENT DEVELOPMENTS 233
14.4 MITSUBISHI ELECTRIC CORPORATION 234
14.4.1 COMPANY SNAPSHOT 234
14.4.2 REVENUE ANALYSIS 235
14.4.3 COMPANY SHARE ANALYSIS 235
14.4.4 PRODUCT PORTFOLIO 236
14.4.5 RECENT DEVELOPMENTS 236
14.5 ROHM CO., LTD. 237
14.5.1 COMPANY SNAPSHOT 237
14.5.2 REVENUE ANALYSIS 238
14.5.3 COMPANY SHARE ANALYSIS 238
14.5.4 PRODUCT PORTFOLIO 239
14.5.5 RECENT DEVELOPMENTS 239
14.6 FUJI ELECTRIC CO., LTD. 240
14.6.1 COMPANY SNAPSHOT 240
14.6.2 REVENUE ANALYSIS 241
14.6.3 PRODUCT PORTFOLIO 241
14.6.4 RECENT DEVELOPMENTS 242
14.7 GE (GE AVIATION) 243
14.7.1 COMPANY PORTFOLIO 243
14.7.2 REVENUE ANALYSIS 244
14.7.3 PRODUCT PORTFOLIO 244
14.7.4 RECENT DEVELOPMENT 245
14.8 GENESIC SEMICONDUCTOR, INC. 246
14.8.1 COMPANY SNAPSHOT 246
14.8.2 PRODUCT PORTFOLIO 246
14.8.3 RECENT DEVELOPMENT 248
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14.9 GLOBAL POWER TECHNOLOGIES GROUP 249
14.9.1 COMPANY SNAPSHOT 249
14.9.2 PRODUCT PORTFOLIO 249
14.9.3 RECENT DEVELOPMENTS 255
14.10 HITACHI POWER SEMICONDUCTOR DEVICE, LTD. (A SUBSIDIARY OF HITACHI, LTD) 256
14.10.1 COMPANY SNAPSHOT 256
14.10.2 REVENUE ANALYSIS 257
14.10.3 PRODUCT PORTFOLIO 257
14.10.4 RECENT DEVELOPMENT 258
14.11 LITTELFUSE, INC. 259
14.11.1 COMPANY SNAPSHOT 259
14.11.2 REVENUE ANALYSIS 260
14.11.3 PRODUCT PORTFOLIO 260
14.11.4 RECENT DEVELOPMENTS 261
14.12 MICROSEMI (A SUBSIDIARY OF MICROCHIP TECHNOLOGY) 262
14.12.1 COMPANY SNAPSHOT 262
14.12.2 REVENUE ANALYSIS 262
14.12.3 PRODUCT PORTFOLIO 263
14.12.4 RECENT DEVELOPMENTS 263
14.13 NXP SEMICONDUCTORS 264
14.13.1 COMPANY SNAPSHOT 264
14.13.2 REVENUE ANALYSIS 265
14.13.3 PRODUCT PORTFOLIO 265
14.13.4 RECENT DEVELOPMENTS 266
14.14 RENESAS ELECTRONICS CORPORATION 267
14.14.1 COMPANY SNAPSHOT 267
14.14.2 REVENUE ANALYSIS 268
14.14.3 PRODUCT PORTFOLIO 268
14.14.4 RECENT DEVELOPMENTS 269
14.15 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 270
14.15.1 COMPANY SNAPSHOT 270
14.15.2 REVENUE ANALYSIS 271
14.15.3 PRODUCT PORTFOLIO 271
14.15.4 RECENT DEVELOPMENTS 272
14.16 SEMIKRON 273
14.16.1 COMPANY SNAPSHOT 273
14.16.2 PRODUCT PORTFOLIO 273
14.16.3 RECENT DEVELOPMENTS 274
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14.17 TEXAS INSTRUMENTS INCORPORATED. 275
14.17.1 COMPANY SNAPSHOT 275
14.17.2 REVENUE ANALYSIS 276
14.17.3 PRODUCT PORTFOLIO 276
14.17.4 RECENT DEVELOPMENT 277
14.18 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION (A SUBSIDIARY OF TOSHIBA CORPORATION) 278
14.18.1 COMPANY SNAPSHOT 278
14.18.2 REVENUE ANALYSIS 279
14.18.3 PRODUCT PORTFOLIO 279
14.18.4 RECENT DEVELOPMENTS 280
14.19 UNITEDSIC 281
14.19.1 COMPANY SNAPSHOT 281
14.19.2 PRODUCT PORTFOLIO 281
14.19.3 RECENT DEVELOPMENTS 283
14.20 XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD. 284
14.20.1 COMPANY SNAPSHOT 284
14.20.2 PRODUCT PORTFOLIO 284
14.20.3 RECENT DEVELOPMENTS 284
15 SWOT & DBMR ANALYSIS 285
15.1 DATA BRIDGE MARKET RESEARCH ANALYSIS 287
16 CONCLUSION 288
17 QUESTIONNAIRE 289
18 RELATED REPORTS 291