CHAPTER 1:INTRODUCTION
1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology
1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
2.1.Key findings
2.1.1.Top impacting factors
2.1.2.Top investment pockets
2.2.CXO perspective
CHAPTER 3:MARKET OVERVIEW
3.1.Market definition and scope
3.2.Key forces shaping GaN power device market
3.3.Market dynamICs
3.3.1.Drivers
3.3.1.1.Decrease in prices of GaN devices
3.3.1.2.Rise in demand for GaN devices for wireless charging
3.3.1.3.Increase in adoption of GaN devices in electric vehicle
3.3.1.4.Increase in requirement of GaN devices for commercial RF applications
3.3.2.Restraint
3.3.2.1.Lack of availability of GaN material
3.3.3.Opportunities
3.3.3.1.Government initiatives in HVDC and smart grid
CHAPTER 4:GAN POWER DEVICE MARKET, BY DEVICE
4.1.Overview
4.2.GaN power discrete devices
4.2.1.Key market trends, growth factors, and opportunities
4.2.2.Market size and forecast, by region
4.2.3.Market analysis, by country
4.3.GaN power ICs
4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market analysis, by country
4.4.GaN power module
4.4.1.Key market trends, growth factors, and opportunities
4.4.2.Market size and forecast, by region
4.4.3.Market analysis, by country
CHAPTER 5:GAN POWER DEVICE MARKET, BY INDUSTRIAL VERTICAL
5.1.Overview
5.2.Consumer electronICs
5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market analysis, by country
5.3.IT & telecommunication
5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market analysis, by country
5.4.Automotive
5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market analysis, by country
5.5.Aerospace & defense
5.5.1.Key market trends, growth factors, and opportunities
5.5.2.Market size and forecast, by region
5.5.3.Market analysis, by country
5.6.Other
5.6.1.Key market trends, growth factors, and opportunities
5.6.2.Market size and forecast, by region
5.6.3.Market analysis, by country
CHAPTER 6:GAN POWER DEVICE MARKET, BY REGION
6.1.Overview
6.2.North America
6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by device
6.2.3.Market size and forecast, by industry vertical
6.2.4.Market analysis, by region
6.2.4.1.U.S.
6.2.4.1.1.Market size and forecast, by device
6.2.4.1.2.Market size and forecast, by industry vertical
6.2.4.2.Canada
6.2.4.2.1.Market size and forecast, by device
6.2.4.2.2.Market size and forecast, by industry vertical
6.2.4.3.Mexico
6.2.4.3.1.Market size and forecast, by device
6.2.4.3.2.Market size and forecast, by industry vertical
6.3.Europe
6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by device
6.3.3.Market size and forecast, by industry vertical
6.3.4.Market analysis, by region
6.3.4.1.UK
6.3.4.1.1.Market size and forecast, by device
6.3.4.1.2.Market size and forecast, by industry vertical
6.3.4.2.Germany
6.3.4.2.1.Market size and forecast, by device
6.3.4.2.2.Market size and forecast, by industry vertical
6.3.4.3.France
6.3.4.3.1.Market size and forecast, by device
6.3.4.3.2.Market size and forecast, by industry vertical
6.3.4.4.Rest of Europe
6.3.4.4.1.Market size and forecast, by device
6.3.4.4.2.Market size and forecast, by industry vertical
6.4.Asia-Pacific
6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by device
6.4.3.Market size and forecast, by industry vertical
6.4.4.Market analysis, by region
6.4.4.1.China
6.4.4.1.1.Market size and forecast, by device
6.4.4.1.2.Market size and forecast, by industry vertical
6.4.4.2.Japan
6.4.4.2.1.Market size and forecast, by device
6.4.4.2.2.Market size and forecast, by industry vertical
6.4.4.3.Taiwan
6.4.4.3.1.Market size and forecast, by device
6.4.4.3.2.Market size and forecast, by industry vertical
6.4.4.4.South Korea
6.4.4.4.1.Market size and forecast, by device
6.4.4.4.2.Market size and forecast, by industry vertical
6.4.4.5.Rest of Asia-Pacific
6.4.4.5.1.Market size and forecast, by device
6.4.4.5.2.Market size and forecast, by industry vertical
6.5.LAMEA
6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by device
6.5.3.Market size and forecast, by industry vertical
6.5.4.Market analysis, by region
6.5.4.1.Latin America
6.5.4.1.1.Market size and forecast, by device
6.5.4.1.2.Market size and forecast, by industry vertical
6.5.4.2.Middle East
6.5.4.2.1.Market size and forecast, by device
6.5.4.2.2.Market size and forecast, by application
6.5.4.3.Africa
6.5.4.3.1.Market size and forecast, by type
6.5.4.3.2.Market size and forecast, by application
CHAPTER 7:COMPETITIVE LANDSCAPE
7.1.Introduction
7.2.Top winning strategies
7.2.1.Top winning strategies, by year
7.2.2.Top winning strategies, by development
7.2.3.Top winning strategies, by company
CHAPTER 8:COMPANY PROFILES
8.1.Efficient Power Conversion Corporation Inc.
8.1.1.Company overview
8.1.2.Key Executives
8.1.3.Company snapshot
8.1.4.Product portfolio
8.1.5.Key strategic moves and developments
8.2.FUJITSU limited
8.2.1.Company overview
8.2.2.Key Executives
8.2.3.Company snapshot
8.2.4.Product portfolio
8.2.5.Business performance
8.2.6.Key strategic moves and developments
8.3.GaN Systems Inc.
8.3.1.Company overview
8.3.2.Company snapshot
8.3.3.Product portfolio
8.3.4.Key strategic moves and developments
8.4.Infineon Technologies AG
8.4.1.Company overview
8.4.2.Company snapshot
8.4.3.Operating business segments
8.4.4.Product portfolio
8.4.5.Business performance
8.4.6.Key strategic moves and developments
8.5.ON SEMICONDUCTOR CORPORATION
8.5.1.Company overview
8.5.2.Company snapshot
8.5.3.Product portfolio
8.5.4.Business performance
8.5.5.Key strategic moves and developments
8.6.PANASONIC CORPORATION
8.6.1.Company overview
8.6.2.Company snapshot
8.6.3.Operating business segments
8.6.4.Product portfolio
8.6.5.R&D Expenditure
8.6.6.Business performance
8.7.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8.7.1.Company overview
8.7.2.Company snapshot
8.7.3.Product portfolio
8.7.4.Business performance
8.7.5.Key strategic moves and developments
8.8.TEXAS INSTRUMENTS INC.
8.8.1.Company overview
8.8.2.Company snapshot
8.8.3.Operating business segments
8.8.4.Product portfolio
8.8.5.Business performance
8.8.6.Key strategic moves and developments
8.9.Toshiba Corporation
8.9.1.Company overview
8.9.2.Key Executives
8.9.3.Company snapshot
8.9.4.Business Segment
8.9.5.Product portfolio
8.9.6.Business performance
8.10.VISIC TECHNOLOGIES LTD
8.10.1.Company overview
8.10.2.Company snapshot
8.10.3.Product portfolio
8.10.4.Key strategic moves and developments