CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. Key findings
2.1.1. Top impacting factors
2.1.2. Top investment pockets
2.2. CXO perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key forces shaping premise cable market
3.3. Market dynamics
3.3.1. Drivers
3.3.1.1. Rise in demand for AR/VR chip in gaming vertical
3.3.1.2. Surge in need for the adoption of AR/VR in various applications
3.3.2. Restrains
3.3.2.1. Resistance to adopt the augmented and virtual reality technology
3.3.2.2. Lack of investments in R&D
3.3.3. Opportunities
3.3.3.1. Advancement in technology
3.3.3.1. Introduction of industry-specific solution
CHAPTER 4: AR/VR CHIP MARKET, BY CHIP TYPE
4.1. Overview
4.1.1. Market size and forecast, by chip type
4.2. Processor ICs
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3. User Interface ICs
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
4.4. Power Management ICs
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis, by country
CHAPTER 5: AR/VR CHIP MARKET, BY DEVICE TYPE
5.1. Overview
5.1.1. Market size and forecast, by device type
5.2. Head Mounted Display
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. Head Up Display
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. Handheld Device
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5. Gesture Tracking Device
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market analysis, by region
5.5.3. Market analysis, by country
5.6. Projector & Display Wall
5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market analysis, by Region
5.6.3. Market analysis, by country
CHAPTER 6: AR/VR CHIP MARKET, BY END USER
6.1. Overview
6.1.1. Market size and forecast, by end user
6.2. Gaming
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country
6.3. Entertainment & Media
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis, by country
6.4. Aerospace & Defense
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis, by country
6.5. Healthcare
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market analysis, by region
6.5.3. Market analysis, by country
6.6. Others
6.6.1. Key market trends, growth factors, and opportunities
6.6.2. Market analysis, by region
6.6.3. Market analysis, by country
CHAPTER 7: AR/VR CHIP MARKET, BY REGION
7.1. Overview
7.2. North America
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by chip type
7.2.3. Market size and forecast, by device type
7.2.4. Market size and forecast, by End User
7.2.5. Market analysis, by country
7.2.5.1. U.S.
7.2.5.1.1. Market size and forecast, by chip type
7.2.5.1.2. Market size and forecast, by device type
7.2.5.1.3. Market size and forecast, by end user
7.2.5.2. Canada
7.2.5.2.1. Market size and forecast, by chip type
7.2.5.2.2. Market size and forecast, by device type
7.2.5.2.3. Market size and forecast, by end user
7.2.5.3. Mexico
7.2.5.3.1. Market size and forecast, by chip type
7.2.5.3.2. Market size and forecast, by device type
7.2.5.3.3. Market size and forecast, by end user
7.2.5.3.4. Europe
7.2.6. Key market trends, growth factors, and opportunities
7.2.7. Market size and forecast, by chip type
7.2.8. Market size and forecast, by device type
7.2.9. Market size and forecast, by end user
7.2.10. Market analysis, by country
7.2.10.1. Germany
7.2.10.1.1. Market size and forecast, by chip type
7.2.10.1.2. Market size and forecast, by device type
7.2.10.1.3. Market size and forecast, by end user
7.2.10.2. UK
7.2.10.2.1. Market size and forecast, by chip type
7.2.10.2.2. Market size and forecast, by device type
7.2.10.2.3. Market size and forecast, by end user
7.2.10.3. France
7.2.10.3.1. Market size and forecast, by chip type
7.2.10.3.2. Market size and forecast, by device type
7.2.10.3.3. Market size and forecast, by end user
7.2.10.3.4. Russia
7.2.10.3.5. Market size and forecast, by chip type
7.2.10.3.6. Market size and forecast, by device type
7.2.10.3.7. Market size and forecast, by end user
7.2.10.4. Rest of Europe
7.2.10.4.1. Market size and forecast, by chip type
7.2.10.4.2. Market size and forecast, by device type
7.2.10.4.3. Market size and forecast, by end user
7.3. Asia-Pacific
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by chip type
7.3.3. Market size and forecast, by device type
7.3.4. Market size and forecast, by End User
7.3.5. Market analysis, by country
7.3.5.1. China
7.3.5.1.1. Market size and forecast, by chip type
7.3.5.1.2. Market size and forecast, by device type
7.3.5.1.3. Market size and forecast, by end user
7.3.5.2. Japan
7.3.5.2.1. Market size and forecast, by chip type
7.3.5.2.2. Market size and forecast, by device type
7.3.5.2.3. Market size and forecast, by end user
7.3.5.3. South Korea
7.3.5.3.1. Market size and forecast, by chip type
7.3.5.3.2. Market size and forecast, by device type
7.3.5.3.3. Market size and forecast, by end user
7.3.5.4. Rest of Asia-Pacific
7.3.5.4.1. Market size and forecast, by chip type
7.3.5.4.2. Market size and forecast, by device type
7.3.5.4.3. Market size and forecast, by end user
7.4. LAMEA
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by chip type
7.4.3. Market size and forecast, by device type
7.4.4. Market size and forecast, by End User
7.4.5. Market analysis, by country
7.4.5.1. Latin America
7.4.5.1.1. Market size and forecast, by chip type
7.4.5.1.2. Market size and forecast, by device type
7.4.5.1.3. Market size and forecast, by end user
7.4.5.1.4. Middle East
7.4.5.1.5. Market size and forecast, by chip type
7.4.5.1.6. Market size and forecast, by device type
7.4.5.1.7. Market size and forecast, by end user
7.4.5.1.8. Africa
7.4.5.1.9. Market size and forecast, by chip type
7.4.5.1.10. Market size and forecast, by device type
7.4.5.1.11. Market size and forecast, by end user
CHAPTER 8: COMPANY PROFILES
8.1. Qualcomm Technologies, Inc.
8.1.1. Company overview
8.1.2. Company snapshot
8.1.3. Operating business segments
8.1.4. Product portfolio
8.1.5. R&D Expenditure
8.1.6. Business performance
8.1.7. Key strategic moves and developments
8.2. NVIDIA Corporation
8.2.1. Company overview
8.2.2. Company snapshot
8.2.3. Operating business segments
8.2.4. Product portfolio
8.2.5. R&D Expenditure
8.2.6. Business performance
8.3. Imagination Technologies Limited
8.3.1. Company overview
8.3.3. Product portfolio
8.4. MEDIATEK INC
8.4.1. Company overview
8.4.2. Company snapshot
8.4.3. Product portfolio
8.4.4. R&D Expenditure
8.4.5. Business performance
8.5. Intel Corporation
8.5.1. Company overview
8.5.2. Company snapshot
8.5.3. Operating business segments
8.5.4. Product portfolio
8.5.5. R&D Expenditure
8.5.6. Business performance
8.6. Spectra7
8.6.1. Company overview
8.6.2. Company snapshot
8.6.3. Product portfolio
8.6.4. Key strategic moves and developments
8.7. Advanced Micro Devices, Inc.
8.7.1. Company overview
8.7.2. Company snapshot
8.7.3. Operating business segments
8.7.4. Product portfolio
8.7.5. Business performance
8.8. International Business Machines Corporation (IBM)
8.8.1. Company overview
8.8.2. Key Executive
8.8.3. Company snapshot
8.8.4. Operating business segments
8.8.5. Product portfolio
8.8.6. R&D Expenditure
8.8.7. Business performance
8.9. SAMSUNG ELECTRONICS CO. LTD.
8.9.1. Company overview
8.9.2. Key Executive
8.9.3. Company snapshot
8.9.4. Operating business segments
8.9.5. Product portfolio
8.9.6. R&D Expenditure
8.9.7. Business performance
8.10. Huawei Technologies Co., Ltd.
8.10.1. Company overview
8.10.2. Company snapshot
8.10.3. Operating business segments
8.10.4. Product portfolio
8.10.5. R&D Expenditure
8.10.6. Business performance