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Power Discrete and Modules Market By Type (Power Discrete and Power Module), Component (Thyristor, Diodes, Rectifier, MOSFET, IGBT, and Others), Material (SiC, GaN, and Others), and Industry Vertical (Telecommunication, Industrial, Automotive, Renewable, Consumer & Enterprise, Military, Defense & Aerospace, and Medical): Global Opportunity Analysis and Industry Forecast, 2019-2026

Power Discrete and Modules Market By Type (Power Discrete and...

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Power Discrete and Modules Market By Type (Power Discrete and Power Module), Component (Thyristor, Diodes, Rectifier, MOSFET, IGBT, and Others), Material (SiC, GaN, and Others), and Industry Vertical (Telecommunication, Industrial, Automotive, Renewable, Consumer & Enterprise, Military, Defense & Aerospace, and Medical): Global Opportunity Analysis and Industry Forecast, 2019-2026
Power Discrete and Modules Market...
Report Code
RO11/113/1222

Publish Date
05/Feb/2020

Pages
333
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Chapter 1: Introduction
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
Chapter 2: Executive summary
2.1. CXO perspective
Chapter 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.4. Porter's five forces analysis
3.4.1. Moderate to high bargaining power of suppliers
3.4.2. Moderate threat of new entrants
3.4.3. Moderate threat of substitutes
3.4.4. Moderate to high intensity of rivalry
3.4.5. Moderate to high bargaining power of buyers
3.5. Patent Analysis
3.5.1. By Region (2012-2019)
3.5.2. By applicant
3.6. Market dynamics
3.6.1. Drivers
3.6.1.1. Increase in demand of power electronics modules across various industry verticals
3.6.1.2. Increasing emphasis on power saving.
3.6.1.3. Growth in demand of electric vehicles, plug-in electric vehicles, and hybrid electric vehicles.
3.6.2. Restraint
3.6.2.1. Lack of availability of GaN material
3.6.3. Opportunities
3.6.3.1. Government initiatives in HVDC and smart grid
3.6.3.1. Technological advancement in power MOSFET
Chapter 4: Power discrete and modules Market, BY type
4.1. Overview
4.2. Power discrete
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3. Power modules
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
Chapter 5: Power discrete and modules Market, BY Component
5.1. Overview
5.2. Thyristor
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. Diodes
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. Rectifier
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5. MOSFET
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country
5.6. IGBT
5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis, by country
5.7. Others
5.7.1. Key market trends, growth factors, and opportunities
5.7.2. Market size and forecast, by region
5.7.3. Market analysis, by country
Chapter 6: Power discrete and modules Market, BY Material
6.1. Overview
6.2. SiC
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country
6.3. GaN
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis, by country
6.4. Others
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis, by country
Chapter 7: Power discrete and modules Market, BY Industry vertical
7.1. Overview
7.2. Telecommunication
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market analysis, by country
7.3. Industrial
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market analysis, by country
7.4. Automotive
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market analysis, by country
7.5. Renewable
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market analysis, by country
7.6. Consumer Electronics
7.6.1. Key market trends, growth factors, and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market analysis, by country
7.7. Military & Defense
7.7.1. Key market trends, growth factors, and opportunities
7.7.2. Market size and forecast, by region
7.7.3. Market analysis, by country
7.8. Medical
7.8.1. Key market trends, growth factors, and opportunities
7.8.2. Market size and forecast, by region
7.8.3. Market analysis, by country
Chapter 8: Power discrete and modules market, BY Region
8.1. Overview
8.2. North America
8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by type
8.2.3. Market size and forecast, by component
8.2.4. Market size and forecast, by material
8.2.5. Market size and forecast, by industry vertical
8.2.6. Market analysis, by country
8.2.6.1. U.S.
8.2.6.1.2. Market size and forecast, by type
8.2.6.1.3. Market size and forecast, by component
8.2.6.1.4. Market size and forecast, by material
8.2.6.1.5. Market size and forecast, by industry vertical
8.2.6.2. Canada
8.2.6.2.2. Market size and forecast, by type
8.2.6.2.3. Market size and forecast, by component
8.2.6.2.4. Market size and forecast, by material
8.2.6.2.5. Market size and forecast, by industry vertical
8.2.6.3. Mexico
8.2.6.3.2. Market size and forecast, by type
8.2.6.3.3. Market size and forecast, by component
8.2.6.3.4. Market size and forecast, by material
8.2.6.3.5. Market size and forecast, by industry vertical
8.3. Europe
8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by type
8.3.3. Market size and forecast, by component
8.3.4. Market size and forecast, by material
8.3.5. Market size and forecast, by industry vertical
8.3.6. Market analysis, by country
8.3.6.1. Germany
8.3.6.1.2. Market size and forecast, by type
8.3.6.1.3. Market size and forecast, by component
8.3.6.1.4. Market size and forecast, by material
8.3.6.1.5. Market size and forecast, by industry vertical
8.3.6.2. France
8.3.6.2.2. Market size and forecast, by type
8.3.6.2.3. Market size and forecast, by component
8.3.6.2.4. Market size and forecast, by material
8.3.6.2.5. Market size and forecast, by industry vertical
8.3.6.3. UK
8.3.6.3.2. Market size and forecast, by type
8.3.6.3.3. Market size and forecast, by component
8.3.6.3.4. Market size and forecast, by material
8.3.6.3.5. Market size and forecast, by industry vertical
8.3.6.4. Rest of Europe
8.3.6.4.2. Market size and forecast, by type
8.3.6.4.3. Market size and forecast, by component
8.3.6.4.4. Market size and forecast, by material
8.3.6.4.5. Market size and forecast, by industry vertical
8.4. Asia-Pacific
8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by type
8.4.3. Market size and forecast, by component
8.4.4. Market size and forecast, by material
8.4.5. Market size and forecast, by industry vertical
8.4.6. Market analysis, by country
8.4.6.1. Japan
8.4.6.1.2. Market size and forecast, by type
8.4.6.1.3. Market size and forecast, by component
8.4.6.1.4. Market size and forecast, by material
8.4.6.1.5. Market size and forecast, by industry vertical
8.4.6.2. China
8.4.6.2.1. Market size and forecast, by type
8.4.6.2.2. Market size and forecast, by component
8.4.6.2.3. Market size and forecast, by material
8.4.6.2.4. Market size and forecast, by industry vertical
8.4.6.3. India
8.4.6.3.2. Market size and forecast, by type
8.4.6.3.3. Market size and forecast, by component
8.4.6.3.4. Market size and forecast, by material
8.4.6.3.5. Market size and forecast, by industry vertical
8.4.6.4. South Korea
8.4.6.4.2. Market size and forecast, by type
8.4.6.4.3. Market size and forecast, by component
8.4.6.4.4. Market size and forecast, by material
8.4.6.4.5. Market size and forecast, by industry vertical
8.4.6.5. Rest of Asia-Pacific
8.4.6.5.2. Market size and forecast, by type
8.4.6.5.3. Market size and forecast, by component
8.4.6.5.4. Market size and forecast, by material
8.4.6.5.5. Market size and forecast, by industry vertical
8.5. LAMEA
8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by type
8.5.3. Market size and forecast, by component
8.5.4. Market size and forecast, by material
8.5.5. Market size and forecast, by industry vertical
8.5.6. Market analysis, by country
8.5.6.1. Latin America
8.5.6.1.2. Market size and forecast, by type
8.5.6.1.3. Market size and forecast, by component
8.5.6.1.4. Market size and forecast, by material
8.5.6.1.5. Market size and forecast, by industry vertical
8.5.6.2. Middle East
8.5.6.2.2. Market size and forecast, by type
8.5.6.2.3. Market size and forecast, by component
8.5.6.2.4. Market size and forecast, by material
8.5.6.2.5. Market size and forecast, by industry vertical
8.5.6.3. Africa
8.5.6.3.2. Market size and forecast, by type
8.5.6.3.3. Market size and forecast, by component
8.5.6.3.4. Market size and forecast, by material
8.5.6.3.5. Market size and forecast, by industry vertical
Chapter 9: COMPETITIVE LANDSCAPE
9.1. Introduction
9.1.1. Market player positioning, 2019
9.2. Top winning strategies
9.3. Product Mapping Of Top 10 Player
9.4. Competitive Dashboard
9.5. Competitive Heatmap
Chapter 10: Company profiles
10.1. Infineon Technologies AG
10.1.1. Company overview
10.1.2. Company snapshot
10.1.3. Operating business segments
10.1.4. Product portfolio
10.1.5. Business performance
10.1.6. Key strategic moves and developments
10.2. Mitsubishi Electric Corporation
10.2.1. Company overview
10.2.2. Company snapshot
10.2.3. Operating business segments
10.2.4. Product portfolio
10.2.5. Business performance
10.2.6. Key strategic moves and developments
10.3. NXP Semiconductor
10.3.1. Company overview
10.3.2. Company snapshot
10.3.3. Product portfolio
10.3.4. Product portfolio
10.3.5. R&D Expenditure
10.3.6. Business performance
10.3.7. Key strategic moves and developments
10.4. ON Semiconductor
10.4.1. Company overview
10.4.2. Company snapshot
10.4.3. Operating business segments
10.4.4. Product portfolio
10.4.5. Business performance
10.4.6. Key strategic moves and developments
10.5. ROHM Semiconductors
10.5.1. Company overview
10.5.2. Company snapshot
10.5.3. Operating business segments
10.5.4. Product portfolio
10.5.5. R&D Expenditure
10.5.6. Business performance
10.5.7. Key strategic moves and developments
10.6. Renesas Electronics
10.6.1. Company overview
10.6.2. Company snapshot
10.6.3. Operating business segments
10.6.4. Product portfolio
10.6.5. R&D Expenditure
10.6.6. Business performance
10.6.7. Key strategic moves and developments
10.7. STMicroelectronics
10.7.1. Company overview
10.7.2. Company snapshot
10.7.3. Operating business segments
10.7.4. Product portfolio
10.7.5. R&D Expenditure
10.7.6. Business performance
10.7.7. Key strategic moves and developments
10.8. Semtech Corporation
10.8.1. Company overview
10.8.2. Company snapshot
10.8.3. Operating business segments
10.8.4. Product portfolio
10.8.5. Business performance
10.8.6. Key strategic moves and developments
10.9. Texas Instruments
10.9.1. Company overview
10.9.2. Company snapshot
10.9.3. Operating business segments
10.9.4. Product portfolio
10.9.5. R&D Expenditure
10.9.6. Business performance
10.9.7. Key strategic moves and developments
10.10. Toshiba Corporation
10.10.1. Company overview
10.10.2. Company snapshot
10.10.3. Operating business segments
10.10.4. Product portfolio
10.10.5. Business performance
10.10.6. Key strategic moves and developments

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