CHAPTER 1:INTRODUCTION
1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology
1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
2.1.CXO perspective
CHAPTER 3:MARKET OVERVIEW
3.1.Market definition and scope
3.2.Key findings
3.2.1.Top impacting factors
3.2.2.Top investment pockets
3.3.Porter's five forces analysis
3.4.Patent analysis
3.4.1.By Region (2012-2020)
3.4.2.By applicant (2012-2020)
3.5.Market dynamics
3.5.1.Drivers
3.5.1.1.Empowering high-performance computing in the cloud sector
3.5.1.2.Government Initiatives
3.5.1.3.Increase in need for flexible computing services
3.5.2.Restraint
3.5.2.1.High cost of high-performance computing
3.5.3.Opportunity
3.5.3.1.Increasing focus towards the hybrid HPC infrastructure
3.6.Impact of COVID-19 on HPC chipset market
3.6.1.COVID-19 Outbreak
3.6.2.Impact on Market Size
3.6.3.End User Trends, Preference, and Budget Impact
3.6.4.Key Player Strategy
3.7.GPU-STYLE ACCELERATORS: PRICING ANALYSIS (ASP)
3.8.AVERAGE MEMORY SIZE OF GPU ACCELERATOR
3.8.1.ASP VS GPU Memory Size (Capacity)
CHAPTER 4:GLOBAL HPC CHIPSET MARKET, BY CHIP TYPE
4.1.Overview
4.2.COMPARATIVE ANALYSIS
4.3.CPU
4.3.1.Key market trends, growth factors and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market analysis by country
4.4.GPU
4.4.1.Key market trends, growth factors and opportunities
4.4.2.Market size and forecast, by region
4.4.3.Market analysis by country
4.5.FPGA
4.5.1.Key market trends, growth factors and opportunities
4.5.2.Market size and forecast, by region
4.5.3.Market analysis by country
4.6.ASIC
4.6.1.Key market trends, growth factors and opportunities
4.6.2.Market size and forecast, by region
4.6.3.Market analysis by country
CHAPTER 5:HPC CHIPSET MARKET, BY REGION
5.1.Overview
5.2.North America
5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by chip type
5.2.2.1.U.S.
5.2.2.1.1.Market size and forecast, by chip type
5.2.2.2.Canada
5.2.2.2.1.Market size and forecast, by chip type
5.2.2.3.Mexico
5.2.2.3.1.Market size and forecast, by chip type
5.3.Europe
5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by chip type
5.3.3.Market analysis by country
5.3.3.1.UK
5.3.3.1.1.Market size and forecast, by chip type
5.3.3.2.Germany
5.3.3.2.1.Market size and forecast, by chip type
5.3.3.3.Italy
5.3.3.3.1.Market size and forecast, by chip type
5.3.3.4.France
5.3.3.4.1.Market size and forecast, by chip type
5.3.3.5.Spain
5.3.3.5.1.Market size and forecast, by chip type
5.3.3.6.Rest of Europe
5.3.3.6.1.Market size and forecast, by chip type
5.4.Asia-Pacific
5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by chip type
5.4.3.Market analysis by country
5.4.3.1.China
5.4.3.1.1.Market size and forecast, by chip type
5.4.3.2.Japan
5.4.3.2.1.Market size and forecast, by chip type
5.4.3.3.India
5.4.3.3.1.Market size and forecast, by chip type
5.4.3.4.South Korea
5.4.3.4.1.Market size and forecast, by chip type
5.4.3.5.Rest of Asia-Pacific
5.4.3.5.1.Market size and forecast, by chip type
5.5.LAMEA
5.5.1.Key market trends, growth factors, and opportunities
5.5.2.Market size and forecast, by chip type
5.5.3.Market analysis by country
5.5.3.1.Latin America
5.5.3.1.1.Market size and forecast, by chip type
5.5.3.2.Middle East
5.5.3.2.1.Market size and forecast, by chip type
5.5.3.3.Africa
5.5.3.3.1.Market size and forecast, by chip type
CHAPTER 6:COMPETITIVE LANDSCAPE
6.1.Introduction
6.1.1.Market player positioning, 2020
6.2.Top winning strategies
6.3.Product mapping of top 10 player
6.4.Competitive dashboard
6.5.Competitive heatmap
CHAPTER 7:COMPANY PROFILES
7.1.ADVANCED MICRO DEVICES, INC.
7.1.1.Company overview
7.1.2.Company snapshot
7.1.3.Operating business segments
7.1.4.Product portfolio
7.1.5.Research and Development
7.1.6.Business performance
7.1.7.Key strategic moves and developments
7.2.INTEL CORPORATION
7.2.1.Company overview
7.2.2.Company snapshot
7.2.3.Operating business segments
7.2.4.Product portfolio
7.2.5.R&D Expenditure
7.2.6.Business performance
7.2.7.Key strategic moves and developments
7.3.INTERNATIONAL BUSINESS MACHINES CORPORATION (IBM)
7.3.1.Company overview
7.3.2.Company snapshot
7.3.3.Operating business segments
7.3.4.Product portfolio
7.3.5.R&D
7.3.6.Business performance
7.3.7.Key strategic moves and developments
7.4.CISCO SYSTEMS, INC.
7.4.1.Company overview
7.4.2.Key executives
7.4.3.Company snapshot
7.4.4.Operating business segments
7.4.5.Product portfolio
7.4.6.R&D Expenditure
7.4.7.Business performance
7.4.8.Key strategic moves and developments
7.5.Hewlett Packard Enterprise Development LP
7.5.1.Company overview
7.5.2.Key executives
7.5.3.Company snapshot
7.5.4.Operating business segments
7.5.5.Product portfolio
7.5.6.R&D expenditure
7.5.7.Business performance
7.5.8.Key strategic moves and developments
7.6.NVIDIA CORPORATION
7.6.1.Company overview
7.6.2.Company snapshot
7.6.3.Operating business segments
7.6.4.Product portfolio
7.6.5.Research and Development
7.6.6.Business performance
7.6.7.Key strategic moves and developments
7.7.MEDIATEK INC
7.7.1.Company overview
7.7.2.Company snapshot
7.7.3.Product portfolio
7.7.4.Research & Development
7.7.5.Business performance
7.7.6.Key strategic moves and developments
7.8.Achronix Semiconductor Corp.
7.8.1.Company overview
7.8.2.Key Executives
7.8.3.Company snapshot
7.8.4.Operating business segments
7.8.5.Product portfolio
7.8.6.Key strategic moves and developments
7.9.Alphabet Inc.
7.9.1.Company overview
7.9.2.Key Executives
7.9.3.Company snapshot
7.9.4.Operating business segments
7.9.5.Product portfolio
7.9.6.R&D Expenditure
7.9.7.Business performance
7.9.8.Key strategic moves and developments
7.10.Lattice Semiconductor Corporation.
7.10.1.Company overview
7.10.2.Key Executives
7.10.3.Company snapshot
7.10.4.Operating business segments
7.10.5.Product portfolio
7.10.6.R&D Expenditure
7.10.7.Business performance
7.10.8.Key strategic moves and developments
