Chapter 1:Introduction

1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology

1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models

Chapter 2:Executive summary

2.1.CXO perspective

Chapter 3:MARKET OVERVIEW

3.1.Market definition and scope
3.2.Key findings

3.2.1.Top impacting factors
3.2.2.Top investment pockets

3.3.Porter's five forces analysis
3.4.Market dynamics

3.4.1.Drivers

3.4.1.1.Surge in usage of SoI wafers in consumer electronics
3.4.1.2.Enhances operational performance with low operating voltage
3.4.1.3.Increasing investments by wafer manufacturers and foundry players in emerging economies

3.4.2.Restraint

3.4.2.1.Self-heating effects in SoI based devices

3.4.3.Opportunities

3.4.3.1.Increasing use of SoI technology in IoT devices and applications
3.4.3.2.Implementing automation solutions across the retail industry to avoid human intervention

3.4.4.Challenges

3.4.4.1.Volatility in cost of raw materials

3.5.COVID-19 impact analysis

3.5.1.Impact on market size
3.5.2.End user trends, preferences, and budget impact
3.5.3.Parent industry impact

Chapter 4:silicon on insulator Market, By wafer size

4.1.Overview
4.2.200 mm

4.2.1.Key market trends, growth factors, and opportunities
4.2.2.Market size and forecast, by region
4.2.3.Market analysis, by country

4.3.300 mm

4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market analysis, by country

Chapter 5:silicon on insulator Market, BY wafer type

5.1.Overview
5.2.RF-SOI

5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market analysis, by country

5.3.FD-SOI

5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market analysis, by country

5.4.PD-SOI

5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market analysis, by country

5.5.Others

5.5.1.Key market trends, growth factors, and opportunities
5.5.2.Market size and forecast, by region
5.5.3.Market analysis, by country

Chapter 6:silicon on insulator Market, BY Technology

6.1.Overview
6.2.BESOI

6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by region
6.2.3.Market analysis, by country

6.3.SiMOX

6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by region
6.3.3.Market analysis, by country

6.4.Smart Cut

6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by region
6.4.3.Market analysis, by country

6.5.ELTRAN

6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by region
6.5.3.Market analysis, by country

6.6.SoS

6.6.1.Key market trends, growth factors, and opportunities
6.6.2.Market size and forecast, by region
6.6.3.Market analysis, by country

Chapter 7:silicon on insulator Market, BY product

7.1.Overview
7.2.RF FEM

7.2.1.Key market trends, growth factors, and opportunities
7.2.2.Market size and forecast, by region
7.2.3.Market analysis, by country

7.3.MEMS

7.3.1.Key market trends, growth factors, and opportunities
7.3.2.Market size and forecast, by region
7.3.3.Market analysis, by country

7.4.Power

7.4.1.Key market trends, growth factors, and opportunities
7.4.2.Market size and forecast, by region
7.4.3.Market analysis, by country

7.5.Optical Communication

7.5.1.Key market trends, growth factors, and opportunities
7.5.2.Market size and forecast, by region
7.5.3.Market analysis, by country

7.6.Image Sensing

7.6.1.Key market trends, growth factors, and opportunities
7.6.2.Market size and forecast, by region
7.6.3.Market analysis, by country

Chapter 8:silicon on insulator Market, BY Application

8.1.Overview
8.2.Consumer electronics

8.2.1.Key market trends, growth factors, and opportunities
8.2.2.Market size and forecast, by region
8.2.3.Market analysis, by country

8.3.Automotive

8.3.1.Key market trends, growth factors, and opportunities
8.3.2.Market size and forecast, by region
8.3.3.Market analysis, by country

8.4.Datacom & Telecom

8.4.1.Key market trends, growth factors, and opportunities
8.4.2.Market size and forecast, by region
8.4.3.Market analysis, by country

8.5.Industrial

8.5.1.Key market trends, growth factors, and opportunities
8.5.2.Market size and forecast, by region
8.5.3.Market analysis, by country

8.6.Photonics

8.6.1.Key market trends, growth factors, and opportunities
8.6.2.Market size and forecast, by region
8.6.3.Market analysis, by country

8.7.Others

8.7.1.Key market trends, growth factors, and opportunities
8.7.2.Market size and forecast, by region
8.7.3.Market analysis, by country

Chapter 9:silicon on insulator Market, BY Region

9.1.Overview
9.2.North America

9.2.1.Key market trends, growth factors, and opportunities
9.2.2.Market size and forecast, by wafer size
9.2.3.Market size and forecast, by wafer type
9.2.4.Market size and forecast, by technology
9.2.5.Market size and forecast, by product
9.2.6.Market size and forecast, by application
9.2.7.Market analysis, by country

9.2.7.1.U.S.

9.2.7.1.2.Market size and forecast, by wafer size
9.2.7.1.3.Market size and forecast, by wafer type
9.2.7.1.4.Market size and forecast, by technology
9.2.7.1.5.Market size and forecast, by product
9.2.7.1.6.Market size and forecast, by application

9.2.7.2.Canada

9.2.7.2.2.Market size and forecast, by wafer size
9.2.7.2.3.Market size and forecast, by wafer type
9.2.7.2.4.Market size and forecast, by technology
9.2.7.2.5.Market size and forecast, by product
9.2.7.2.6.Market size and forecast, by application

9.2.7.3.Mexico

9.2.7.3.2.Market size and forecast, by wafer size
9.2.7.3.3.Market size and forecast, by wafer type
9.2.7.3.4.Market size and forecast, by technology
9.2.7.3.5.Market size and forecast, by product
9.2.7.3.6.Market size and forecast, by application

9.3.Europe

9.3.1.Key market trends, growth factors, and opportunities
9.3.2.Market size and forecast, by wafer size
9.3.3.Market size and forecast, by wafer type
9.3.4.Market size and forecast, by technology
9.3.5.Market size and forecast, by product
9.3.6.Market size and forecast, by application
9.3.7.Market analysis, by country

9.3.7.1.UK

9.3.7.1.2.Market size and forecast, by wafer size
9.3.7.1.3.Market size and forecast, by wafer type
9.3.7.1.4.Market size and forecast, by technology
9.3.7.1.5.Market size and forecast, by product
9.3.7.1.6.Market size and forecast, by application

9.3.7.2.Germany

9.3.7.2.2.Market size and forecast, by wafer size
9.3.7.2.3.Market size and forecast, by wafer type
9.3.7.2.4.Market size and forecast, by technology
9.3.7.2.5.Market size and forecast, by product
9.3.7.2.6.Market size and forecast, by application

9.3.7.3.France

9.3.7.3.2.Market size and forecast, by wafer size
9.3.7.3.3.Market size and forecast, by wafer type
9.3.7.3.4.Market size and forecast, by technology
9.3.7.3.5.Market size and forecast, by product
9.3.7.3.6.Market size and forecast, by application

9.3.7.4.Russia

9.3.7.4.2.Market size and forecast, by wafer size
9.3.7.4.3.Market size and forecast, by wafer type
9.3.7.4.4.Market size and forecast, by technology
9.3.7.4.5.Market size and forecast, by product
9.3.7.4.6.Market size and forecast, by application

9.3.7.5.Rest of Europe

9.3.7.5.2.Market size and forecast, by wafer size
9.3.7.5.3.Market size and forecast, by wafer type
9.3.7.5.4.Market size and forecast, by technology
9.3.7.5.5.Market size and forecast, by product
9.3.7.5.6.Market size and forecast, by application

9.4.Asia-Pacific

9.4.1.Key market trends, growth factors, and opportunities
9.4.2.Market size and forecast, by wafer size
9.4.3.Market size and forecast, by wafer type
9.4.4.Market size and forecast, by technology
9.4.5.Market size and forecast, by product
9.4.6.Market size and forecast, by application
9.4.7.Market analysis, by country

9.4.7.1.China

9.4.7.1.2.Market size and forecast, by wafer size
9.4.7.1.3.Market size and forecast, by wafer type
9.4.7.1.4.Market size and forecast, by technology
9.4.7.1.5.Market size and forecast, by product
9.4.7.1.6.Market size and forecast, by application

9.4.7.2.Japan

9.4.7.2.2.Market size and forecast, by wafer size
9.4.7.2.3.Market size and forecast, by wafer type
9.4.7.2.4.Market size and forecast, by technology
9.4.7.2.5.Market size and forecast, by product
9.4.7.2.6.Market size and forecast, by application

9.4.7.3.Taiwan

9.4.7.3.2.Market size and forecast, by wafer size
9.4.7.3.3.Market size and forecast, by wafer type
9.4.7.3.4.Market size and forecast, by technology
9.4.7.3.5.Market size and forecast, by product
9.4.7.3.6.Market size and forecast, by application

9.4.7.4.South Korea

9.4.7.4.2.Market size and forecast, by wafer size
9.4.7.4.3.Market size and forecast, by wafer type
9.4.7.4.4.Market size and forecast, by technology
9.4.7.4.5.Market size and forecast, by product
9.4.7.4.6.Market size and forecast, by application

9.4.7.5.Rest of Asia-Pacific

9.4.7.5.2.Market size and forecast, by wafer size
9.4.7.5.3.Market size and forecast, by wafer type
9.4.7.5.4.Market size and forecast, by technology
9.4.7.5.5.Market size and forecast, by product
9.4.7.5.6.Market size and forecast, by application

9.5.LAMEA

9.5.1.Key market trends, growth factors, and opportunities
9.5.2.Market size and forecast, by wafer size
9.5.3.Market size and forecast, by wafer type
9.5.4.Market size and forecast, by technology
9.5.5.Market size and forecast, by product
9.5.6.Market size and forecast, by application
9.5.7.Market analysis, by country

9.5.7.1.Latin America

9.5.7.1.2.Market size and forecast, by wafer size
9.5.7.1.3.Market size and forecast, by wafer type
9.5.7.1.4.Market size and forecast, by technology
9.5.7.1.5.Market size and forecast, by product
9.5.7.1.6.Market size and forecast, by application

9.5.7.2.Middle East & Africa

9.5.7.2.2.Market size and forecast, by wafer size
9.5.7.2.3.Market size and forecast, by wafer type
9.5.7.2.4.Market size and forecast, by technology
9.5.7.2.5.Market size and forecast, by product
9.5.7.2.6.Market size and forecast, by application

Chapter 10:COMPETITIVE LANDSCAPE

10.1.Introduction

10.1.1.Market player positioning, 2019

10.2.Competitive dashboard
10.3.Competitive heatmap
10.4.Key developments

10.4.1.New product launches
10.4.2.Collaborations
10.4.3.Other Developments

Chapter 11:COMPANY PROFILES

11.1.TOWER SEMICONDUCTOR LTD.

11.1.1.Company overview
11.1.2.Key Executive
11.1.3.Company snapshot
11.1.4.Operating business segments
11.1.5.Product portfolio
11.1.6.R&D Expenditure
11.1.7.Business performance
11.1.8.Key strategic moves and developments

11.2.GLOBAL WAFERS CO., LTD.

11.2.1.Company overview
11.2.2.Key Executive
11.2.3.Company snapshot
11.2.4.Operating business segments
11.2.5.Product portfolio
11.2.6.R&D Expenditure
11.2.7.Business performance

11.3.MagnaChip Semiconductor Corporation

11.3.1.Company overview
11.3.2.Key Executive
11.3.3.Company snapshot
11.3.4.Operating business segments
11.3.5.Product portfolio
11.3.6.R&D Expenditure
11.3.7.Business performance
11.3.8.Key strategic moves and developments

11.4.MURATA MANUFACTURING COMPANY, LTD.

11.4.1.Company overview
11.4.2.Key Executive
11.4.3.Company snapshot
11.4.4.Operating business segments
11.4.5.Product portfolio
11.4.6.R&D Expenditure
11.4.7.Business performance
11.4.8.Key strategic moves and developments

11.5.NXP Semiconductor

11.5.1.Company overview
11.5.2.Key Executives
11.5.3.Company snapshot
11.5.4.Product portfolio
11.5.5.R&D Expenditure
11.5.6.Business performance
11.5.7.Key strategic moves and developments

11.6.SHIN-ETSU CHEMICAL CO., LTD

11.6.1.Company overview
11.6.2.Key Executives
11.6.3.Company snapshot
11.6.4.Operating business segments
11.6.5.Product portfolio
11.6.6.R&D Expenditure
11.6.7.Business performance
11.6.8.Key strategic moves and developments

11.7.Shanghai Simgui Technology Co., Ltd.

11.7.1.Company overview
11.7.2.Key Executive
11.7.3.Company snapshot
11.7.4.Product portfolio

11.8.Soitec

11.8.1.Company overview
11.8.2.Key Executive
11.8.3.Company snapshot
11.8.4.Operating business segments
11.8.5.Product portfolio
11.8.6.R&D Expenditure
11.8.7.Business performance
11.8.8.Key strategic moves and developments

11.9.STMicroelectronics N.V.

11.9.1.Company overview
11.9.2.Key Executives
11.9.3.Company snapshot
11.9.4.Operating business segments
11.9.5.Product portfolio
11.9.6.R&D Expenditure
11.9.7.Business performance
11.9.8.Key strategic moves and developments

11.10.SUMCO CORPORATION

11.10.1.Company overview
11.10.2.Key Executives
11.10.3.Company snapshot
11.10.4.Operating business segments
11.10.5.Product portfolio
11.10.6.R&D Expenditure
11.10.7.Business performance