CHAPTER 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. COVID-19 IMPACT ANALYSIS

3.2.1. COVID-19 Outbreak
3.2.2. Impact on market size
3.2.3. End user trends, preferences, and budget impact
3.2.4. Parent industry impact
3.2.5. Key player strategies to tackle negative impact

3.2.5.1. Limiting cuts to R&D expense:
3.2.5.2. Focusing on next-generation products
3.2.5.3. Shifting toward agile supply chain model

3.2.6. Opportunity window

3.3. KEY FINDINGS

3.3.1. Top impacting factors
3.3.2. Top investment pockets
3.3.3. Top winning strategies

3.4. PORTER;S FIVE FORCES ANALYSIS
3.5. KEY PLAYER POSITIONING (2019)
3.6. MARKET DYNAMICS

3.6.1. Drivers

3.6.1.1. Advantage of compound semiconductors over silicon-based technology
3.6.1.2. Increase in demand for compound semiconductor epitaxial wafer in LED technology
3.6.1.3. Emerging trends toward compound semiconductor wafers in the automotive industry

3.6.2. Restraints

3.6.2.1. High-cost associated with compound semiconductor materials and components

3.6.3. Opportunity

3.6.3.1. Emerging usage of compound semiconductors in smart technologies

CHAPTER 4: COMPOUND SEMICONDUCTOR MARKET, BY TYPE

4.1. OVERVIEW
4.2. III-V COMPOUND SEMICONDUCTOR

4.2.1. Gallium Nitride
4.2.2. Gallium Phosphide
4.2.3. Gallium Arsenide
4.2.4. Indium Phosphide
4.2.5. Indium Antimonide
4.2.6. Key market trends, growth factors, and opportunities
4.2.7. Market size and forecast, by region
4.2.8. Market analysis, by country

4.3. II-VI COMPOUND SEMICONDUCTOR

4.3.1. Cadmium Selenide
4.3.2. Cadmium Telluride
4.3.3. Zinc Selenide
4.3.4. Key market trends, growth factors, and opportunities
4.3.5. Market size and forecast, by region
4.3.6. Market analysis, by country

4.4. SAPPHIRE

4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis, by country

4.5. IV-IV COMPOUND SEMICONDUCTOR

4.5.1. Silicon Carbide
4.5.2. Silicon Germanium
4.5.3. Key market trends, growth factors, and opportunities
4.5.4. Market size and forecast, by region
4.5.5. Market analysis, by country

4.6. OTHERS

4.6.1. Aluminum Gallium Arsenide
4.6.2. Aluminum Indium Arsenide
4.6.3. Aluminum Gallium Nitride
4.6.4. Aluminum Gallium Phosphide
4.6.5. Indium Gallium Nitride
4.6.6. Cadmium Zinc Telluride
4.6.7. Mercury Cadmium Telluride
4.6.8. Key market trends, growth factors, and opportunities
4.6.9. Market size and forecast, by region
4.6.10. Market analysis, by country

CHAPTER 5: COMPOUND SEMICONDUCTORMARKET, BY DEPOSITION TECHNOLOGY

5.1. OVERVIEW
5.2. CHEMICAL VAPOR DEPOSITION

5.2.1. Metal Organic Chemical Vapor Deposition
5.2.2. Key market trends, growth factors, and opportunities
5.2.3. Market size and forecast, by region
5.2.4. Market analysis, by country

5.3. MOLECULAR BEAM EPITAXY

5.3.1. Metal Organic Molecular Beam Epitaxy
5.3.2. Key market trends, growth factors, and opportunities
5.3.3. Market size and forecast, by region
5.3.4. Market analysis, by country

5.4. HYDRIDE VAPOR PHASE EPITAXY

5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country

5.5. AMMONOTHERMAL

5.5.1. Liquid Phase Epitaxy
5.5.2. Key market trends, growth factors, and opportunities
5.5.3. Market size and forecast, by region
5.5.4. Market analysis, by country

5.6. ATOMIC LAYER DEPOSITION

5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis, by country

5.7. OTHERS

5.7.1. Key market trends, growth factors, and opportunities
5.7.2. Market size and forecast, by region
5.7.3. Market analysis, by country

CHAPTER 6: COMPOUND SEMICONDUCTOR MARKET, BY PRODUCT

6.1. OVERVIEW
6.2. POWER SEMICONDUCTOR

6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country

6.3. TRANSISTOR

6.3.1. High electron mobility transistor
6.3.2. Metal oxide semiconductor field-effect transistor
6.3.3. Metal semiconductor field-effect transistor
6.3.4. Key market trends, growth factors, and opportunities
6.3.5. Market size and forecast, by region
6.3.6. Market analysis, by country

6.4. INTEGRATED CIRCUITS

6.4.1. Monolithic microwave integrated circuits
6.4.2. Radio frequency integrated circuits
6.4.3. Key market trends, growth factors, and opportunities
6.4.4. Market size and forecast, by region
6.4.5. Market analysis, by country

6.5. DIODES & RECTIFIERS

6.5.1. PIN Diode
6.5.2. Zener Diode
6.5.3. Schokkty Diode
6.5.4. Light-Emitting Diode
6.5.5. Key market trends, growth factors, and opportunities
6.5.6. Market size and forecast, by region
6.5.7. Market analysis, by country

6.6. OTHERS

6.6.1. Key market trends, growth factors, and opportunities
6.6.2. Market size and forecast, by region
6.6.3. Market analysis, by country

CHAPTER 7: COMPOUND SEMICONDUCTOR MARKET, BY APPLICATION

7.1. OVERVIEW
7.2. IT & TELECOM

7.2.1. Signal Amplifiers & Switching System
7.2.2. Satellite Communication
7.2.3. Radar
7.2.4. RF
7.2.5. Key market trends, growth factors, and opportunities
7.2.6. Market size and forecast, by region
7.2.7. Market analysis, by country

7.3. INDUSTRIAL AND ENERGY & POWER

7.3.1. Smart Grid
7.3.2. Wind Turbine & Wind Power Systems
7.3.3. Photovoltaic Invertors
7.3.4. Motor Drives
7.3.5. Key market trends, growth factors, and opportunities
7.3.6. Market size and forecast, by region
7.3.7. Market analysis, by country

7.4. AEROSPACE & DEFENSE

7.4.1. Combat Vehicles
7.4.2. Ships & Vessels
7.4.3. Microwave Radiation
7.4.4. Key market trends, growth factors, and opportunities
7.4.5. Market size and forecast, by region
7.4.6. Market analysis, by country

7.5. AUTOMOTIVE

7.5.1. Electric Vehicle & Hybrid Electric Vehicle
7.5.2. Automotive Braking System
7.5.3. Rail Traction
7.5.4. Automobile Motor Drives
7.5.5. Key market trends, growth factors, and opportunities
7.5.6. Market size and forecast, by region
7.5.7. Market analysis, by country

7.6. CONSUMER ELECTRONICS

7.6.1. Inverters
7.6.2. LED Lighting
7.6.3. Switch Mode Consumer Power Supply System
7.6.4. Key market trends, growth factors, and opportunities
7.6.5. Market size and forecast, by region
7.6.6. Market analysis, by country

7.7. HEALTHCARE

7.7.1. Implantable Medical Devices
7.7.2. Biomedical Electronics
7.7.3. Key market trends, growth factors, and opportunities
7.7.4. Market size and forecast, by region
7.7.5. Market analysis, by country

CHAPTER 8: COMPOUND SEMICONDUCTOR MARKET, BY REGION

8.1. OVERVIEW
8.2. NORTH AMERICA

8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by type
8.2.3. Market size and forecast, by deposition technology
8.2.4. Market size and forecast, by product
8.2.5. Market size and forecast, by application
8.2.6. Market analysis, by country

8.2.6.1. U.S.

8.2.6.1.1. Market size and forecast, by type
8.2.6.1.2. Market size and forecast, by deposition technology
8.2.6.1.3. Market size and forecast, by product
8.2.6.1.4. Market size and forecast, by application

8.2.6.2. Canada

8.2.6.2.1. Market size and forecast, by type
8.2.6.2.2. Market size and forecast, by deposition technology
8.2.6.2.3. Market size and forecast, by product
8.2.6.2.4. Market size and forecast, by application

8.2.6.3. Mexico

8.2.6.3.1. Market size and forecast, by type
8.2.6.3.2. Market size and forecast, by deposition technology
8.2.6.3.3. Market size and forecast, by product
8.2.6.3.4. Market size and forecast, by application

8.3. EUROPE

8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by type
8.3.3. Market size and forecast, by deposition technology
8.3.4. Market size and forecast, by product
8.3.5. Market size and forecast, by application
8.3.6. Market analysis, by country

8.3.6.2. UK

8.3.6.2.1. Market size and forecast, by type
8.3.6.2.2. Market size and forecast, by deposition technology
8.3.6.2.3. Market size and forecast, by product
8.3.6.2.4. Market size and forecast, by application

8.3.6.3. Germany

8.3.6.3.1. Market size and forecast, by type
8.3.6.3.2. Market size and forecast, by deposition technology
8.3.6.3.3. Market size and forecast, by product
8.3.6.3.4. Market size and forecast, by application

8.3.6.4. France

8.3.6.4.1. Market size and forecast, by type
8.3.6.4.2. Market size and forecast, by deposition technology
8.3.6.4.3. Market size and forecast, by product
8.3.6.4.4. Market size and forecast, by application

8.3.6.5. Rest of Europe

8.3.6.5.1. Market size and forecast, by type
8.3.6.5.2. Market size and forecast, by deposition technology
8.3.6.5.3. Market size and forecast, by product
8.3.6.5.4. Market size and forecast, by application

8.4. ASIA-PACIFIC

8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by type
8.4.3. Market size and forecast, by deposition technology
8.4.4. Market size and forecast, by product
8.4.5. Market size and forecast, by application
8.4.6. Market analysis, by country

8.4.6.1. China

8.4.6.1.1. Market size and forecast, by type
8.4.6.1.2. Market size and forecast, by deposition technology
8.4.6.1.3. Market size and forecast, by product
8.4.6.1.4. Market size and forecast, by application

8.4.6.2. Japan

8.4.6.2.1. Market size and forecast, by type
8.4.6.2.2. Market size and forecast, by deposition technology
8.4.6.2.3. Market size and forecast, by product
8.4.6.2.4. Market size and forecast, by application

8.4.6.3. India

8.4.6.3.1. Market size and forecast, by type
8.4.6.3.2. Market size and forecast, by deposition technology
8.4.6.3.3. Market size and forecast, by product
8.4.6.3.4. Market size and forecast, by application

8.4.6.4. Australia

8.4.6.4.1. Market size and forecast, by type
8.4.6.4.2. Market size and forecast, by deposition technology
8.4.6.4.3. Market size and forecast, by product
8.4.6.4.4. Market size and forecast, by application

8.4.6.5. Rest of Asia-Pacific

8.4.6.5.1. Market size and forecast, by type
8.4.6.5.2. Market size and forecast, by deposition technology
8.4.6.5.3. Market size and forecast, by product
8.4.6.5.4. Market size and forecast, by application

8.5. LAMEA

8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by type
8.5.3. Market size and forecast, by deposition technology
8.5.4. Market size and forecast, by product
8.5.5. Market size and forecast, by application
8.5.6. Market analysis, by country

8.5.6.1. Latin America

8.5.6.1.1. Market size and forecast, by type
8.5.6.1.2. Market size and forecast, by deposition technology
8.5.6.1.3. Market size and forecast, by product
8.5.6.1.4. Market size and forecast, by application

8.5.6.2. Middle East

8.5.6.2.1. Market size and forecast, by type
8.5.6.2.2. Market size and forecast, by deposition technology
8.5.6.2.3. Market size and forecast, by product
8.5.6.2.4. Market size and forecast, by application

8.5.6.3. Africa

8.5.6.3.1. Market size and forecast, by type
8.5.6.3.2. Market size and forecast, by deposition technology
8.5.6.3.3. Market size and forecast, by product
8.5.6.3.4. Market size and forecast, by application

CHAPTER 9: COMPANY PROFILES

9.1. NICHIA CORPORATION

9.1.1. Company overview
9.1.2. Key Executive
9.1.3. Company snapshot
9.1.4. Product portfolio
9.1.5. Key strategic moves and developments

9.2. CREE, INC.

9.2.1. Company overview
9.2.2. Company snapshot
9.2.3. Operating business segments
9.2.4. Product portfolio
9.2.5. R&D Expenditure
9.2.6. Business performance
9.2.7. Key strategic moves and developments

9.3. SAMSUNG ELECTRONICS CO. LTD.

9.3.1. Company overview
9.3.2. Key Executives
9.3.3. Company snapshot
9.3.4. Operating business segments
9.3.5. Product portfolio
9.3.6. R&D Expenditure
9.3.7. Business performance
9.3.8. Key strategic moves and developments

9.4. RENESAS ELECTRONICS CORPORATION

9.4.1. Company overview
9.4.2. Key Executives
9.4.3. Company snapshot
9.4.4. Operating business segments
9.4.5. Product portfolio
9.4.6. R&D Expenditure
9.4.7. Business performance

9.5. NXP SEMICONDUCTOR

9.5.1. Company overview
9.5.2. Key Executives
9.5.3. Company snapshot
9.5.4. Product portfolio
9.5.5. R&D Expenditure
9.5.6. Business performance
9.5.7. Key strategic moves and developments

9.6. STMICROELECTRONICS N.V.

9.6.1. Company overview
9.6.2. Key Executives
9.6.3. Company snapshot
9.6.4. Operating business segments
9.6.5. Product portfolio
9.6.6. R&D Expenditure
9.6.7. Business performance
9.6.8. Key strategic moves and developments

9.7. INFINEON TECHNOLOGIES AG

9.7.1. Company overview
9.7.2. Key Executives
9.7.3. Company snapshot
9.7.4. Operating business segments
9.7.5. Product portfolio
9.7.6. R&D Expenditure
9.7.7. Business performance
9.7.8. Key strategic moves and developments

9.8. TEXAS INSTRUMENTS INCORPORATED

9.8.1. Company overview
9.8.2. Key Executives
9.8.3. Company snapshot
9.8.4. Operating business segments
9.8.5. Product portfolio
9.8.6. R&D Expenditure
9.8.7. Business performance
9.8.8. Key strategic moves and developments

9.9. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

9.9.1. Company overview
9.9.2. Key Executives
9.9.3. Company snapshot.
9.9.4. Product portfolio
9.9.5. R&D Expenditure
9.9.6. Business performance
9.9.7. Key strategic moves and developments

9.10. QORVO, INC.

9.10.1. Company overview
9.10.2. Key Executives
9.10.3. Company snapshot
9.10.4. Operating business segments
9.10.5. Product portfolio
9.10.6. R&D Expenditure
9.10.7. Business performance
9.10.8. Key strategic moves and developments