CHAPTER 1: INTRODUCTION

1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO perspective

CHAPTER 3: MARKET OVERVIEW

3.1. Market definition and scope
3.2. Key findings

3.2.1. Top impacting factors
3.2.2. Top investment pockets

3.3. Porter's five forces analysis
3.4. Market dynamics

3.4.1. Drivers

3.4.1.1. Increasing demand for EMS technology in telecom sector
3.4.1.2. Rising demand for electronics devices in developed and developing nations
3.4.1.3. Government Initiatives

3.4.2. Restraint

3.4.2.1. High labor costs in the manufacturing sector

3.4.3. Opportunities

3.4.3.1. Rising adoption of 5G Technology
3.4.3.2. Emerging Internet of Things (IoT) Technology

3.5. Customer-wise revenue, by services

CHAPTER 4: TELECOM ELECTRONIC MANUFACTURING SERVICE MARKET, BY PRODUCT TYPE

4.1. Overview
4.2. Computing Devices & Equipment

4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country

4.3. Servers & Routers

4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country

4.4. RF & Microwave

4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country

4.5. Fiber Optic Devices

4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country

4.6. Transceivers & Transmitters

4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country

4.7. Others

4.7.1. Key market trends, growth factors, and opportunities
4.7.2. Market size and forecast, by region
4.7.3. Market analysis by country

CHAPTER 5: GLOBAL TELECOM ELECTRONIC MANUFACTURING SERVICE MARKET, BY SERIVCE

5.1. Overview
5.2. Electronic Design and Engineering

5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country

5.3. Electronics Assembly

5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country

5.4. Electronic Manufacturing

5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country

5.5. Supply Chain Management

5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis by country

5.6. Others

5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis by country

CHAPTER 6: TELECOM ELECTRONIC MANUFACTURING SERVICE MARKET, BY REGION

6.1. Overview
6.2. North America

6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by product type
6.2.3. Market size and forecast, by service
6.2.4. Market analysis by country

6.2.4.1. U.S.

6.2.4.1.1. Market size and forecast, by product type
6.2.4.1.2. Market size and forecast, by service

6.2.4.2. Canada

6.2.4.2.1. Market size and forecast, by product type
6.2.4.2.2. Market size and forecast, by service

6.2.4.3. Mexico

6.2.4.3.1. Market size and forecast, by product type
6.2.4.3.2. Market size and forecast, by service

6.3. Europe

6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by product type
6.3.3. Market size and forecast, by service
6.3.4. Market analysis by country

6.3.4.1. Germany

6.3.4.1.1. Market size and forecast, by product type
6.3.4.1.2. Market size and forecast, by service

6.3.4.2. UK

6.3.4.2.1. Market size and forecast, by product type
6.3.4.2.2. Market size and forecast, by service

6.3.4.3. Rest of Europe

6.3.4.3.1. Market size and forecast, by product type
6.3.4.3.2. Market size and forecast, by service

6.4. Asia-Pacific

6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by product type
6.4.3. Market size and forecast, by service
6.4.4. Market analysis by country

6.4.4.1. China

6.4.4.1.1. Market size and forecast, by product type
6.4.4.1.2. Market size and forecast, by service

6.4.4.2. Japan

6.4.4.2.1. Market size and forecast, by product type
6.4.4.2.2. Market size and forecast, by service

6.4.4.3. India

6.4.4.3.1. Market size and forecast, by product type
6.4.4.3.2. Market size and forecast, by service

6.4.4.4. South Korea

6.4.4.4.1. Market size and forecast, by product type
6.4.4.4.2. Market size and forecast, by service

6.4.4.5. Taiwan

6.4.4.5.1. Market size and forecast, by product type
6.4.4.5.2. Market size and forecast, by service

6.4.4.6. Rest of Asia-Pacific

6.4.4.6.1. Market size and forecast, by product type
6.4.4.6.2. Market size and forecast, by service

6.5. LAMEA

6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by product type
6.5.3. Market size and forecast, by service
6.5.4. Market analysis by country

6.5.4.1. Latin America

6.5.4.1.1. Market size and forecast, by product type
6.5.4.1.2. Market size and forecast, by service

6.5.4.2. Middle East

6.5.4.2.1. Market size and forecast, by product type
6.5.4.2.2. Market size and forecast, by service

6.5.4.3. Africa

6.5.4.3.1. Market size and forecast, by product type
6.5.4.3.2. Market size and forecast, by service

CHAPTER 7: COMPETITIVE LANDSCAPE

7.1. Introduction

7.1.1. Market player positioning, 2020

7.2. Competitive dashboard
7.3. Competitive heatmap

CHAPTER 8: COMPANY PROFILES

8.1. BENCHMARK ELECTRONICS INC.

8.1.1. Company overview
8.1.2. Key Executives
8.1.3. Company snapshot
8.1.4. Operating business segments
8.1.5. Product portfolio
8.1.6. Business performance
8.1.7. Operating segment
8.1.8. Revenue share, by region
8.1.9. Key strategic moves and developments

8.2. CELESTICA INC.

8.2.1. Company overview
8.2.2. Key executives
8.2.3. Company snapshot
8.2.4. Operating business segments
8.2.5. Product portfolio
8.2.6. Business performance
8.2.7. Operating segment
8.2.8. Key strategic moves and developments

8.3. CREATION TECHNOLOGIES

8.3.1. Company overview
8.3.2. Key Executives
8.3.3. Company snapshot
8.3.4. Product portfolio

8.4. FLEX LTD.

8.4.1. Company overview
8.4.2. Key executives
8.4.3. Company snapshot
8.4.4. Operating business segments
8.4.5. Product portfolio
8.4.6. Business performance
8.4.7. Operating segment
8.4.8. Revenue share, by region
8.4.9. Key strategic moves and developments

8.5. SANMINA CORPORATION

8.5.1. Company overview
8.5.2. Company snapshot
8.5.3. Operating business segments
8.5.4. Product portfolio
8.5.5. Business performance
8.5.6. Revenue Share by Operating Segment
8.5.7. Key strategic moves and developments

8.6. HON HAI TECHNOLOGY GROUP (FOXCONN)

8.6.1. Company overview
8.6.2. Company snapshot
8.6.3. Product portfolio
8.6.4. Business performance
8.6.5. Key strategic moves and developments

8.7. JABIL INC.

8.7.1. Company overview
8.7.2. Key executives
8.7.3. Company snapshot
8.7.4. Operating business segments
8.7.5. Product portfolio
8.7.6. Business performance
8.7.7. Revenue Share by Operating Segment

8.8. PEGATRON CORP.

8.8.1. Company overview
8.8.2. Key executives
8.8.3. Company snapshot
8.8.4. Operating business segments
8.8.5. Product portfolio
8.8.6. Business performance
8.8.7. Operating segment
8.8.8. Revenue share, by region

8.9. PLEXUS CORP.

8.9.1. Company overview
8.9.2. Key executives
8.9.3. Company snapshot
8.9.4. Operating business segments
8.9.5. Product portfolio
8.9.6. Business performance
8.9.7. Operating segment
8.9.8. Revenue share, by region

8.10. WISTRON CORP.

8.10.1. Company overview
8.10.2. Key executives
8.10.3. Company snapshot
8.10.4. Product portfolio
8.10.5. Business performance
8.10.6. Revenue Share by Region