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Global New Packages and Materials for Power Devices Market Research Report Forecast to 2023

Global New Packages and Materials for Power Devices Market Research...

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Global New Packages and Materials for Power Devices Market Research Report Forecast to 2023
Global New Packages and Materials...
Report Code
RO6/111/1042

Publish Date
01/Apr/2019

Pages
111
PRICE
$ 1800/-
This is a single user license, allowing one specific user access to the product. The product is a PDF.
$ 2850/-
This is an enterprise license, allowing all employees within your organization access to the product. The product is a PDF..
Table of Contents:

1 Executive Summary
2 Market Introduction
2.1 Definition
2.2 Scope of the Study
2.3 Market Structure
3 Research Methodology
3.1 Research Process
3.2 Primary Research
3.3 Secondary Research
3.4 Market Size Estimation
3.5 List of Assumptions
4 Market Dynamics
4.1 Drivers
4.1.1 Application in High Voltage and Medium Voltage Power Devices
4.1.2 Adoption of GaN-Based Power Devices in Industries such as Military and Aerospace
4.1.3 Popularity of GaAs Photonics in the Electronics Sector
4.1.4 Need for Miniaturization in Semiconductor Devices
4.1.5 Driver Impact Analysis
4.2 Restraints
4.2.1 Volatility of Raw Material Prices
4.3 Opportunities
4.3.1 Demand for Hermetically Packaged Electronic Devices in Asia
4.4 Value Chain Analysis
4.4.1 Raw Material Supply
4.4.2 Processed Material Development
4.4.3 Power Wafers production
4.4.4 Power Module Manufacturing
4.4.5 End-use
4.5 Porter's Five Forces Model
4.5.1 Threat of New Entrants
4.5.2 Bargaining Power of Suppliers
4.5.3 Threat of Substitutes
4.5.4 Bargaining Power of Buyers
4.5.5 Rivalry
5 Global New Packages and Materials for Power Devices Market, By Package Type & Material
5.1 Overview
5.1.1 Chip-scale Packaging
5.1.2 Wire bonding Packaging
5.1.3 Others (Hermetic Packaging and Cu Clip Packaging)
5.1.4 Silicon carbide (SiC)
5.1.5 Gallium Nitride (GaN)
5.1.6 Gallium Arsenide (GaAs)
6 Global New Packages and Materials for Power Devices Market, by End-Use
6.1 Overview
6.1.1 Automotive
6.1.2 Telecommunications and Computing
6.1.3 Electronics
6.1.4 Industrial
6.1.5 Others
7 Global New Packages and Materials for Power Devices Market, by Region
7.1 Overview
7.2 North America
7.2.1 US
7.2.2 Canada
7.2.3 Mexico
7.3 Europe
7.3.1 Germany
7.3.2 France
7.3.3 Italy
7.3.4 UK
7.3.5 Rest of Europe
7.4 Asia Pacific
7.4.1 China
7.4.2 Japan
7.4.3 South Korea
7.4.4 India
7.4.5 Rest of Asia Pacific
7.5 Rest of the World
7.5.1 Middle East & Africa
7.5.2 South America
8 Competitive Landscape
8.1 Competitive Scenario
8.2 Market Share Analysis, 2017 (%)
8.3 Littelfuse and Amkor: The leading players in terms of number of developments in the market
8.4 New Product Development
8.5 Merger & Acquisition
9 Company Profiles
9.1 SEMIKRON
9.1.1 Company Overview
9.1.2 Financial Overview
9.1.3 Products/Services Offered
9.1.4 Key Developments
9.1.5 Key Strategies
9.2 STMicroelectronics
9.2.1 Company Overview
9.2.2 Financial Overview
9.2.3 Products/Services Offered
9.2.4 Key Developments
9.2.5 SWOT Analysis
9.2.6 Key Strategies
9.3 Exagan
9.3.1 Company Overview
9.3.2 Financial Overview
9.3.3 Products/Services Offered
9.3.4 Key Developments
9.3.5 SWOT Analysis
9.3.6 Key Strategies
9.4 Efficient Power Conversion Corporation
9.4.1 Company Overview
9.4.2 Financial Overview
9.4.3 Products/Services Offered
9.4.4 Key Developments
9.4.5 SWOT Analysis
9.4.6 Key Strategies
9.5 Littelfuse
9.5.1 Company Overview
9.5.2 Financial Overview
9.5.3 Products/Services Offered
9.5.4 Key Developments
9.5.5 SWOT Analysis
9.5.6 Key Strategies
9.6 ON Semiconductor
9.6.1 Company Overview
9.6.2 Financial Overview
9.6.3 Products/Services Offered
9.6.4 Key Developments
9.6.5 Key Strategies
9.7 NXP Semiconductors
9.7.1 Company Overview
9.7.2 Financial Overview
9.7.3 Products/Services Offered
9.7.4 Key Developments
9.7.5 SWOT Analysis
9.7.6 Key Strategies
9.8 Infineon Technologies AG
9.8.1 Company Overview
9.8.2 Financial Overview
9.8.3 Products/Services Offered
9.8.4 Key Developments
9.8.5 SWOT Analysis
9.8.6 Key Strategies
9.9 ROHM SEMICONDUCTOR
9.9.1 Company Overview
9.9.2 Financial Overview
9.9.3 Products/Services Offered
9.9.4 Key Developments
9.9.5 SWOT Analysis
9.9.6 Key strategies
9.10 Orient Semiconductor Electronics Ltd
9.10.1 Company Overview
9.10.2 Financial Overview
9.10.3 Products Offered
9.10.4 Key Developments
9.10.5 SWOT Analysis
9.10.6 Key Strategies
9.11 Amkor Technology
9.11.1 Company Overview
9.11.2 Financial Overview
9.11.3 Products Offered
9.11.4 Key Developments
9.11.5 SWOT Analysis
9.11.6 Key Strategies
9.12 MITSUBISHI ELECTRIC CORPORATION
9.12.1 Company Overview
9.12.2 Financial Overview
9.12.3 Products/Services Offered
9.12.4 Key Developments
9.12.5 SWOT Analysis
9.12.6 Key strategies
9.13 Remtec, Inc
9.13.1 Company Overview
9.13.2 Financial Overview
9.13.3 Products/Services Offered.
9.13.4 Key Developments
9.13.5 Key strategies

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