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Automotive Integrated Circuit (ICs) Market by Type (Monolithic Integrated Circuits and Hybrid Integrated Circuits) and Application (Advance Driver Assistance System, In-vehicle Networking, Engine Management, Transmission Control System, and Others) - Global Opportunity Analysis and Industry Forecast, 2018-2025

Automotive Integrated Circuit (ICs) Market by Type (Monolithic Integrated Circuits...

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Automotive Integrated Circuit (ICs) Market by Type (Monolithic Integrated Circuits and Hybrid Integrated Circuits) and Application (Advance Driver Assistance System, In-vehicle Networking, Engine Management, Transmission Control System, and Others) - Global Opportunity Analysis and Industry Forecast, 2018-2025
Automotive Integrated Circuit (ICs) Market...
Report Code
RO10/113/1070

Publish Date
01/Jul/2018

Pages
259
PRICE
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CHAPTER 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY MARKET SEGMENTS
1.3. RESEARCH METHODOLOGY

1.3.1. Secondary research
1.3.2. Primary research
1.3.3. Analyst tools & models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top Winning Strategies

3.3. PORTER'S FIVE FORCES ANALYSIS
3.4. MARKET SHARE ANALYSIS, 2017
3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Rapid electrification of automobiles
3.5.1.2. Emergence of internet of things (IoT) in integrated circuits
3.5.1.3. Growing adoption of sensors and real-time tracking system

3.5.2. Restraint

3.5.2.1. Design complexities of ICs

3.5.3. Opportunities

3.5.3.1. Surge in demand of intelligent transportation system

CHAPTER 4: GLOBAL AUTOMOTIVE IC MARKET, BY TYPE

4.1. OVERVIEW
4.2. MONOLITHIC INTEGRATED CIRCUITS

4.2.1. Key market trends and opportunities
4.2.2. Market size and forecast by region
4.2.3. Market analysis by country

4.3. HYBRID OR MULTICHIP INTEGRATED CIRCUIT

4.3.1. Key market trends and opportunities
4.3.2. Market size and forecast by region
4.3.3. Market size and forecast by type

4.3.3.1 Analog IC
4.3.3.1 Digital IC
4.3.3.1 Mixed IC

4.3.4. Market analysis by country

CHAPTER 5: GLOBAL AUTOMOTIVE IC MARKET, BY APPLICATION

5.1. OVERVIEW
5.2. ADVANCED DRIVER ASSISTANCE SYSTEM (ADAS)

5.2.1. Key market trends and opportunities
5.2.2. Market size and forecast by region
5.2.3. Market analysis by country

5.3. IN-VEHICLE NETWORKING

5.3.1. Key market trends and opportunities
5.3.2. Market size and forecast by region
5.3.3. Market analysis by country

5.4. ENGINE MANAGEMENT

5.4.1. Key market trends and opportunities
5.4.2. Market size and forecast by region
5.4.3. Market analysis by country

5.5. TRANSMISSION CONTROL SYSTEM

5.5.1. Key market trends and opportunities
5.5.2. Market size and forecast by region
5.5.3. Market analysis by country

5.6. OTHERS

5.6.1. Key market trends and opportunities
5.6.2. Market size and forecast by region
5.6.3. Market analysis by country

CHAPTER 6: GLOBAL AUTOMOTIVE IC MARKET, BY REGION

6.1. OVERVIEW
6.2. NORTH AMERICA

6.2.1. Key market trends and opportunities.
6.2.2. Market size and forecast, by product type
6.2.3. Market size and forecast by application
6.2.4. Market analysis by country

6.2.4.1. U.S.

6.2.4.1.1. Market size and forecast, by type
6.2.4.1.2. Market size and forecast, by application

6.2.4.2. Canada

6.2.4.2.1. Market size and forecast, by type
6.2.4.2.2. Market size and forecast, by application

6.2.4.3. Mexico

6.2.4.3.1. Market size and forecast, by type
6.2.4.3.2. Market size and forecast, by application

6.3. EUROPE

6.3.1. Key market trends
6.3.2. Market size and forecast by type
6.3.3. Market size and forecast by application
6.3.4. Market analysis by country

6.3.4.1. UK

6.3.4.1.1. Market size and forecast, by type
6.3.4.1.2. Market size and forecast, by application

6.3.4.2. Germany

6.3.4.2.1. Market size and forecast, by type
6.3.4.2.2. Market size and forecast, by application

6.3.4.3. France

6.3.4.3.1. Market size and forecast, by type
6.3.4.3.2. Market size and forecast, by application

6.3.4.4. Rest of Europe

6.3.4.4.1. Market size and forecast, by type
6.3.4.4.2. Market size and forecast, by application

6.4. ASIA-PACIFIC

6.4.1. Key market trends and opportunities
6.4.2. Market size and forecast by type
6.4.3. Market size and forecast by application
6.4.4. Market analysis by country

6.4.4.1. China

6.4.4.1.1. Market size and forecast, by type
6.4.4.1.2. Market size and forecast, by application

6.4.4.2. India

6.4.4.2.1. Market size and forecast, by type
6.4.4.2.2. Market size and forecast, by application

6.4.4.3. Japan

6.4.4.3.1. Market size and forecast, by type
6.4.4.3.2. Market size and forecast, by application

6.4.4.4. South Korea

6.4.4.4.1. Market size and forecast, by type
6.4.4.4.2. Market size and forecast, by application

6.4.4.5. Rest of Asia-Pacific

6.4.4.5.1. Market size and forecast, by type
6.4.4.5.2. Market size and forecast, by application

6.5. LAMEA

6.5.1. Key market trends and opportunities
6.5.2. Market size and forecast by type
6.5.3. Market size and forecast by application
6.5.4. Market analysis by Region

6.5.4.1. Latin America

6.5.4.1.1. Market size and forecast, by type
6.5.4.1.2. Market size and forecast, by application

6.5.4.2. Middle East

6.5.4.2.1. Market size and forecast, by type
6.5.4.2.2. Market size and forecast, by application

6.5.4.3. Africa

6.5.4.3.1. Market size and forecast, by type
6.5.4.3.2. Market size and forecast, by application

CHAPTER 7: COMPANY PROFILE

7.1. INTEL CORPORATION

7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Operating business segments
7.1.4. Business performance
7.1.5. Key strategic moves and developments

7.2. SAMSUNG

7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Operating business segments
7.2.4. Business performance
7.2.5. Key strategic moves and developments

7.3. ROBERT BOSCH

7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Operating business segments
7.3.4. Business performance
7.3.5. Key strategic moves and developments

7.4. QUALCOMM

7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Business performance
7.4.5. Key strategic moves and developments

7.5. RENESAS ELECTRONICS CORPORATION

7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Operating business segments
7.5.4. Product portfolio
7.5.5. Business performance
7.5.6. Key strategic moves and developments

7.6. INFINEON TECHNOLOGIES AG

7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance
7.6.6. Key strategic moves and developments

7.7. STMICROELECTRONICS N.V.

7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Business performance
7.7.5. Key strategic moves and developments

7.8. ROHM SEMICONDUCTOR

7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Operating business segments
7.8.4. Business performance
7.8.5. Key strategic moves and developments

7.9. TEXAS INSTRUMENTS

7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Operating business segments
7.9.4. Product portfolio
7.9.5. Business performance
7.9.6. Key strategic moves and developments

7.10. NXP SEMICONDUCTORS N.V.

7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Product portfolio
7.10.4. Product portfolio
7.10.5. Business performance
7.10.6. Key strategic moves and developments

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