CHAPTER 1 INTRODUCTION

1.1 Report description
1.2 Key benefits
1.3 Key market segments
1.4 Research methodology

1.4.1 Secondary research
1.4.2 Primary research
1.4.3 Analyst tools and models

CHAPTER 2 EXECUTIVE SUMMARY

2.1 CXO perspective

CHAPTER 3 MARKET OVERVIEW

3.1 Market definition and scope
3.2 Key findings

3.2.1 Top factors impacting the market
3.2.2 Top investment pockets
3.2.3 Top winning strategies

3.3 Porters five force analysis

3.3.1 Adequate number of wafer level packaging suppliers leads to low bargaining power of suppliers
3.3.2 Ample number of suppliers leads to high bargaining power of buyers
3.3.3 Market being fully commercialized leads to low threats from the new entrants
3.3.4 Variations in the integration and packaging technology leads to high threats from quality manufacturing techniques by different companies
3.3.5 Profuse competitors lead to high rivalry

3.4 Value chain analysis
3.5 Primary findings
3.6 Market dynamics

3.6.1 Drivers

3.6.1.1 Trending Internet of Things (IoT): a submarket of the overall electronics market
3.6.1.2 Technological superiority over traditional packaging techniques
3.6.1.3 Impending need for circuit miniaturization in microelectronic devices

3.6.2 Restraints

3.6.2.1 High initial investment
3.6.2.2 Encapsulation poses a challenge for fan-out wafer level packaging

3.6.3 Opportunity

3.6.3.1 Thriving demand for small sizes, low cost, and high performance of packaging solutions

CHAPTER 4 WORLD WAFER LEVEL PACKAGING MARKET, BY INTEGRATION TYPE

4.1 Overview
4.2 Fan-in wafer level packaging

4.2.1 Key trends
4.2.2 Key growth factors and opportunities
4.2.3 Market size and forecast

4.3 Fan-out wafer level packaging

4.3.1 Key trends
4.3.2 Key growth factors and opportunities
4.3.3 Market size and forecast

CHAPTER 5 WORLD WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY

5.1 Overview
5.2 3D TSV WLP

5.2.1 Key trends
5.2.2 Key growth factors and opportunities
5.2.3 Market size and forecast

5.3 2.5D TSV WLP

5.3.1 Key trends
5.3.2 Key growth factors and opportunities
5.3.3 Market size and forecast

5.4 WLCSP

5.4.1 Key trends
5.4.2 Key growth factors and opportunities
5.4.3 Market size and forecast

5.5 Nano WLP

5.5.1 Key trends
5.5.2 Key growth factors and opportunities
5.5.3 Market size and forecast

5.6 Others

5.6.1 Key trends
5.6.2 Key growth factors and opportunities
5.6.3 Market size and forecast

CHAPTER 6 WORLD WAFER LEVEL PACKAGING MARKET, BY BUMPING TECHNOLOGY

6.1 Overview
6.2 Copper pillar

6.2.1 Key trends
6.2.2 Key growth factors and opportunities
6.2.3 Market size and forecast

6.3 Solder bumping

6.3.1 Key trends
6.3.2 Key growth factors and opportunities
6.3.3 Market size and forecast

6.4 Gold bumping

6.4.1 Key trends
6.4.2 Key growth factors and opportunities
6.4.3 Market size and forecast

6.5 Others

6.5.1 Key trends
6.5.2 Key growth factors and opportunities
6.5.3 Market size and forecast

CHAPTER 7 WORLD WAFER LEVEL PACKAGING MARKET, BY INDUSTRY

7.1 Overview
7.2 Electronics

7.2.1 Key trends
7.2.2 Key growth factors and opportunities
7.2.3 Market size and forecast

7.3 IT & Telecommunication

7.3.1 Key trends
7.3.2 Key growth factors and opportunities
7.3.3 Market size and forecast

7.4 Industrial

7.4.1 Key trends
7.4.2 Key growth factors and opportunities
7.4.3 Market size and forecast

7.5 Automotive

7.5.1 Key trends
7.5.2 Key growth factors and opportunities
7.5.3 Market size and forecast

7.6 Aerospace & Defense

7.6.1 Key trends
7.6.2 Key growth factors and opportunities
7.6.3 Market size and forecast

7.7 Healthcare

7.7.1 Key trends
7.7.2 Key growth factors and opportunities
7.7.3 Market size and forecast

7.8 Others

7.8.1 Key trends
7.8.2 Key growth factors and opportunities
7.8.3 Market size and forecast

CHAPTER 8 WORLD WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY

8.1 Overview
8.2 North America

8.2.1 Key trends
8.2.2 Key growth factors and opportunities
8.2.3 Market size and forecast
8.2.4 U.S.
8.2.5 Canada
8.2.6 Mexico

8.3 Europe

8.3.1 Key trends
8.3.2 Key growth factors and opportunities
8.3.3 Market size and forecast
8.3.4 Germany
8.3.5 UK
8.3.6 Netherland
8.3.7 France
8.3.8 Italy
8.3.9 Rest of Europe

8.4 Asia-Pacific

8.4.1 Key trends
8.4.2 Key growth factors and opportunities
8.4.3 Market size and forecast
8.4.4 China
8.4.5 India
8.4.6 Japan
8.4.7 South Korea
8.4.8 Taiwan
8.4.9 Rest of Asia-Pacific

8.5 LAMEA

8.5.1 Key trends
8.5.2 Key growth factors and opportunities
8.5.3 Market size and forecast
8.5.4 Latin America
8.5.5 Middle East
8.5.6 Africa

CHAPTER 9 COMPANY PROFILES

9.1 Amkor Technology, Inc.

9.1.1 Company overview
9.1.2 Company snapshot
9.1.3 Operating business segments
9.1.4 Business performance
9.1.5 Key strategic moves and developments

9.2 Fujitsu

9.2.1 Company overview
9.2.2 Company snapshot
9.2.3 Operating business segments
9.2.4 Business performance
9.2.5 Key strategic moves and developments

9.3 Jiangsu Changjiang Electronics Technology Co. Ltd.

9.3.1 Company overview
9.3.2 Company snapshot
9.3.3 Operating business segments
9.3.4 Business performance
9.3.5 Key strategic moves and developments

9.4 Deca Technologies

9.4.1 Company overview
9.4.2 Company snapshot
9.4.3 Operating business segments
9.4.4 Business performance
9.4.5 Key strategic moves and developments

9.5 Qualcomm Technologies, Inc.

9.5.1 Company overview
9.5.2 Company snapshot
9.5.3 Operating business segments
9.5.4 Business performance
9.5.5 Key strategic moves and developments

9.6 Toshiba Corporation

9.6.1 Company overview
9.6.2 Company snapshot
9.6.3 Operating business segments
9.6.4 Business performance
9.6.5 Key strategic moves and developments

9.7 Tokyo Electron Ltd.

9.7.1 Company overview
9.7.2 Company snapshot
9.7.3 Operating business segments
9.7.4 Business performance
9.7.5 Key strategic moves and developments

9.8 Applied Materials, Inc.

9.8.1 Company overview
9.8.2 Company snapshot
9.8.3 Operating business segments
9.8.4 Business performance
9.8.5 Key strategic moves and developments

9.9 ASML Holding N.V

9.9.1 Company overview
9.9.2 Company snapshot
9.9.3 Operating business segments
9.9.4 Business performance
9.9.5 Key strategic moves and developments

9.10 Lam Research Corporation

9.10.1 Company overview
9.10.2 Company snapshot
9.10.3 Operating business segments
9.10.4 Business performance
9.10.5 Key strategic moves and developments