CHAPTER 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies

3.3. PORTERS FIVE FORCES ANALYSIS
3.4. MARKET SHARE ANALYSIS (2017)
3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Growth in Cloud Computing
3.5.1.2. Advancement in chip technology
3.5.1.3. Government Regulations regarding localization of Data centers

3.5.2. Restraint

3.5.2.1. High data center operational cost

3.5.3. Opportunity

3.5.3.1. Increase in smart computing devices

CHAPTER 4: DATA CENTER CHIP MARKET, BY CHIP TYPE

4.1. OVERVIEW
4.2. GPU

4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country

4.3. ASIC

4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country

4.4. FPGA

4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country

4.5. CPU

4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country

4.6. OTHERS

4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country

CHAPTER 5: DATA CENTER CHIP MARKET, BY DATA CENTER SIZE

5.1. OVERVIEW
5.2. SMALL & MEDIUM SIZE

5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country

5.3. LARGE SIZE

5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country

CHAPTER 6: DATA CENTER CHIP MARKET, BY INDUSTRY VERTICAL

6.1. OVERVIEW
6.2. BFSI

6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis by country

6.3. MANUFACTURING

6.3.1. Key market trends, growth factors and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis by country

6.4. GOVERNMENT

6.4.1. Key market trends, growth factors and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis by country

6.5. IT & TELECOM

6.5.1. Key market trends, growth factors and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis by country

6.6. RETAIL

6.6.1. Key market trends, growth factors and opportunities
6.6.2. Market size and forecast, by region
6.6.3. Market analysis by country

6.7. TRANSPORTATION

6.7.1. Key market trends, growth factors and opportunities
6.7.2. Market size and forecast, by region
6.7.3. Market analysis by country

6.8. ENERGY & UTILITIES

6.8.1. Key market trends, growth factors and opportunities
6.8.2. Market size and forecast, by region
6.8.3. Market analysis by country

6.9. OTHERS

6.9.1. Key market trends, growth factors and opportunities
6.9.2. Market size and forecast, by region
6.9.3. Market analysis by country

CHAPTER 7: DATA CENTER CHIP MARKET, BY REGION

7.1. OVERVIEW
7.2. NORTH AMERICA

7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by chip type
7.2.3. Market size and forecast, by data center size
7.2.4. Market size and forecast, by industry vertical
7.2.5. Market analysis by country

7.2.5.1. U.S.

7.2.5.1.1. Market size and forecast, by chip type
7.2.5.1.2. Market size and forecast, by data center size
7.2.5.1.3. Market size and forecast, by industry vertical

7.2.5.2. Canada

7.2.5.2.1. Market size and forecast, by chip type
7.2.5.2.2. Market size and forecast, by data center size
7.2.5.2.3. Market size and forecast, by industry vertical

7.2.5.3. Mexico

7.2.5.3.1. Market size and forecast, by chip type
7.2.5.3.2. Market size and forecast, by data center size
7.2.5.3.3. Market size and forecast, by industry vertical

7.3. EUROPE

7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by chip type
7.3.3. Market size and forecast, by data center size
7.3.4. Market size and forecast, by industry vertical
7.3.5. Market analysis by country

7.3.5.1. U.K.

7.3.5.1.1. Market size and forecast, by chip type
7.3.5.1.2. Market size and forecast, by data center size
7.3.5.1.3. Market size and forecast, by industry vertical

7.3.5.2. Germany

7.3.5.2.1. Market size and forecast, by chip type
7.3.5.2.2. Market size and forecast, by data center size
7.3.5.2.3. Market size and forecast, by industry vertical

7.3.5.3. France

7.3.5.3.1. Market size and forecast, by chip type
7.3.5.3.2. Market size and forecast, by data center size
7.3.5.3.3. Market size and forecast, by industry vertical

7.3.5.4. Russia

7.3.5.4.1. Market size and forecast, by chip type
7.3.5.4.2. Market size and forecast, by data center size
7.3.5.4.3. Market size and forecast, by industry vertical

7.3.5.5. Rest of Europe

7.3.5.5.1. Market size and forecast, by chip type
7.3.5.5.2. Market size and forecast, by data center size
7.3.5.5.3. Market size and forecast, by industry vertical

7.4. ASIA-PACIFIC

7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by chip type
7.4.3. Market size and forecast, by data center size
7.4.4. Market size and forecast, by industry vertical
7.4.5. Market analysis by country

7.4.5.1. China

7.4.5.1.1. Market size and forecast, by chip type
7.4.5.1.2. Market size and forecast, by data center size
7.4.5.1.3. Market size and forecast, by industry vertical

7.4.5.2. India

7.4.5.2.1. Market size and forecast, by chip type
7.4.5.2.2. Market size and forecast, by data center size
7.4.5.2.3. Market size and forecast, by industry vertical

7.4.5.3. Japan

7.4.5.3.1. Market size and forecast, by chip type
7.4.5.3.2. Market size and forecast, by data center size
7.4.5.3.3. Market size and forecast, by industry vertical

7.4.5.4. Australia

7.4.5.4.1. Market size and forecast, by chip type
7.4.5.4.2. Market size and forecast, by data center size
7.4.5.4.3. Market size and forecast, by industry vertical

7.4.5.5. Rest of Asia-Pacific

7.4.5.5.1. Market size and forecast, by chip type
7.4.5.5.2. Market size and forecast, by data center size
7.4.5.5.3. Market size and forecast, by industry vertical

7.5. LAMEA

7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by chip type
7.5.3. Market size and forecast, by data center size
7.5.4. Market size and forecast, by industry vertical
7.5.5. Market analysis by country

7.5.5.1. Latin America

7.5.5.1.1. Market size and forecast, by chip type
7.5.5.1.2. Market size and forecast, by data center size
7.5.5.1.3. Market size and forecast, by industry vertical

7.5.5.2. Middle East

7.5.5.2.1. Market size and forecast, by chip type
7.5.5.2.2. Market size and forecast, by data center size
7.5.5.2.3. Market size and forecast, by industry vertical

7.5.5.3. Africa

7.5.5.3.1. Market size and forecast, by chip type
7.5.5.3.2. Market size and forecast, by data center size
7.5.5.3.3. Market size and forecast, by industry vertical

CHAPTER 8: COMPANY PROFILES

8.1. ADVANCED MICRO DEVICES, INC.

8.1.1. Company overview
8.1.2. Company snapshot
8.1.3. Operating business segments
8.1.4. Product portfolio
8.1.5. Business performance
8.1.6. Key strategic moves and developments

8.2. ARM LIMITED (SOFTBANK GROUP CORP.)

8.2.1. Company overview
8.2.2. Company snapshot
8.2.3. Operating business segments
8.2.4. Product portfolio
8.2.5. Business performance
8.2.6. Key strategic moves and developments

8.3. BROADCOM

8.3.1. Company overview
8.3.2. Company snapshot
8.3.3. Operating business segments
8.3.4. Product portfolio
8.3.5. Business performance
8.3.6. Key strategic moves and developments

8.4. GLOBALFOUNDRIES

8.4.1. Company overview
8.4.2. Company snapshot
8.4.3. Product portfolio
8.4.4. Key strategic moves and developments

8.5. HUAWEI TECHNOLOGIES CO., LTD.

8.5.1. Company overview
8.5.2. Company snapshot
8.5.3. Operating business segments
8.5.4. Product portfolio
8.5.5. Business performance
8.5.6. Key strategic moves and developments

8.6. INTEL CORPORATION

8.6.1. Company overview
8.6.2. Company snapshot
8.6.3. Operating business segments
8.6.4. Product portfolio
8.6.5. Business performance
8.6.6. Key strategic moves and developments

8.7. NVIDIA CORPORATION

8.7.1. Company overview
8.7.2. Company snapshot
8.7.3. Operating business segments
8.7.4. Product portfolio
8.7.5. Business performance
8.7.6. Key strategic moves and developments

8.8. SAMSUNG ELECTRONICS CO. LTD.

8.8.1. Company overview
8.8.2. Company snapshot
8.8.3. Operating business segments
8.8.4. Product portfolio
8.8.5. Business performance
8.8.6. Key strategic moves and developments

8.9. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

8.9.1. Company overview
8.9.2. Company snapshot
8.9.3. Operating business segments
8.9.4. Product portfolio
8.9.5. Business performance
8.9.6. Key strategic moves and developments

8.10. XILINX INC.

8.10.1. Company overview
8.10.2. Company snapshot
8.10.3. Operating business segments
8.10.4. Product portfolio
8.10.5. Business performance
8.10.6. Key strategic moves and developments