CHAPTER 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. INDUSTRY ROADMAP
2.2. CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies

3.3. PORTERS FIVE FORCES ANALYSIS
3.4. MARKET SHARE ANALYSIS, 2017 (%)
3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Increase in demand for smart homes & smart cities
3.5.1.2. Rise in investments in AI startups
3.5.1.3. Emergence of quantum computing

3.5.2. Restraint

3.5.2.1. Dearth of skilled workforce

3.5.3. Opportunities

3.5.3.1. Increased adoption of AI chips in the developing regions
3.5.3.2. Development of smarter robots

CHAPTER 4: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY CHIP TYPE

4.1. OVERVIEW
4.2. GPU

4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country

4.3. ASIC

4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country

4.4. FPGA

4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country

4.5. CPU

4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country

4.6. OTHERS (NPU & HYBRID CHIP)

4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country

CHAPTER 5: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY APPLICATION

5.1. OVERVIEW
5.2. MACHINE LEARNING

5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Deep learning (Image recognition, Computer vision)
5.2.4. Predictive analysis
5.2.5. Others (Decision tree learning, Inductive logic programming, Reinforcement learning, and others)
5.2.6. Market analysis by country

5.3. NATURAL LANGUAGE PROCESSING (NLP)

5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Translation
5.3.4. Classification & clustering
5.3.5. Information extraction
5.3.6. Market analysis by country

5.4. ROBOTIC PROCESS AUTOMATION

5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country

5.5. SPEECH RECOGNITION

5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Speech to text
5.5.4. Text to speech
5.5.5. Market analysis by country

5.6. OTHERS

5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis by country

CHAPTER 6: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY TECHNOLOGY

6.1. OVERVIEW
6.2. SYSTEM-ON-CHIP (SOC)

6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis by country

6.3. SYSTEM-IN-PACKAGE (SIP)

6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis by country

6.4. MULTI-CHIP MODULE

6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis by country

6.5. OTHERS (PACKAGE IN PACKAGE, TSV)

6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis by country

CHAPTER 7: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY PROCESSING TYPE

7.1. OVERVIEW
7.2. EDGE

7.2.1. Key market trends, growth factors and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market analysis by country

7.3. CLOUD

7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market analysis by country

CHAPTER 8: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY INDUSTRY VERTICAL

8.1. OVERVIEW
8.2. MEDIA & ADVERTISING

8.2.1. Key market trends, growth factors and opportunities
8.2.2. Market size and forecast, by region
8.2.3. Market analysis by country
8.2.4. Market size and forecast, by processing type

8.3. BFSI

8.3.1. Key market trends, growth factors and opportunities
8.3.2. Market size and forecast, by region
8.3.3. Market analysis by country
8.3.4. Market size and forecast, by processing type

8.4. IT & TELECOM

8.4.1. Key market trends, growth factors and opportunities
8.4.2. Market size and forecast, by region
8.4.3. Market analysis by country
8.4.4. Market size and forecast, by processing type

8.5. RETAIL

8.5.1. Key market trends, growth factors and opportunities
8.5.2. Market size and forecast, by region
8.5.3. Market analysis by country
8.5.4. Market size and forecast, by processing type

8.6. HEALTHCARE

8.6.1. Key market trends, growth factors and opportunities
8.6.2. Market size and forecast, by region
8.6.3. Market analysis by country
8.6.4. Market size and forecast, by processing type

8.7. AUTOMOTIVE

8.7.1. Key market trends, growth factors and opportunities
8.7.2. Market size and forecast, by region
8.7.3. Market analysis by country
8.7.4. Market size and forecast, by processing type

8.8. OTHERS

8.8.1. Key market trends, growth factors and opportunities
8.8.2. Market size and forecast, by region
8.8.3. Market analysis by country
8.8.4. Market size and forecast, by processing type

CHAPTER 9: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY REGION

9.1. OVERVIEW
9.2. NORTH AMERICA

9.2.1. Key market trends, growth factors, and opportunities
9.2.2. Market size and forecast, by chip type
9.2.3. Market size and forecast, by application
9.2.4. Market size and forecast, by technology
9.2.5. Market size and forecast, by processing type
9.2.6. Market size and forecast, by industry vertical
9.2.7. Market analysis by country

9.2.7.1. U.S.

9.2.7.1.1. Market size and forecast, by chip type
9.2.7.1.2. Market size and forecast, by application
9.2.7.1.3. Market size and forecast, by technology
9.2.7.1.4. Market size and forecast, by processing type
9.2.7.1.5. Market size and forecast, by industry vertical

9.2.7.2. Canada

9.2.7.2.1. Market size and forecast, by chip type
9.2.7.2.2. Market size and forecast, by application
9.2.7.2.3. Market size and forecast, by technology
9.2.7.2.4. Market size and forecast, by processing type
9.2.7.2.5. Market size and forecast, by industry vertical

9.2.7.3. Mexico

9.2.7.3.1. Market size and forecast, by chip type
9.2.7.3.2. Market size and forecast, by application
9.2.7.3.3. Market size and forecast, by technology
9.2.7.3.4. Market size and forecast, by processing type
9.2.7.3.5. Market size and forecast, by industry vertical

9.3. EUROPE

9.3.1. Key market trends, growth factors, and opportunities
9.3.2. Market size and forecast, by chip type
9.3.3. Market size and forecast, by application
9.3.4. Market size and forecast, by technology
9.3.5. Market size and forecast, by processing type
9.3.6. Market size and forecast, by industry vertical
9.3.7. Market analysis by country

9.3.7.1. U.K.

9.3.7.1.1. Market size and forecast, by chip type
9.3.7.1.2. Market size and forecast, by application
9.3.7.1.3. Market size and forecast, by technology
9.3.7.1.4. Market size and forecast, by processing type
9.3.7.1.5. Market size and forecast, by industry vertical

9.3.7.2. Germany

9.3.7.2.1. Market size and forecast, by chip type
9.3.7.2.2. Market size and forecast, by application
9.3.7.2.3. Market size and forecast, by technology
9.3.7.2.4. Market size and forecast, by processing type
9.3.7.2.5. Market size and forecast, by industry vertical

9.3.7.3. France

9.3.7.3.1. Market size and forecast, by chip type
9.3.7.3.2. Market size and forecast, by application
9.3.7.3.3. Market size and forecast, by technology
9.3.7.3.4. Market size and forecast, by processing type
9.3.7.3.5. Market size and forecast, by industry vertical

9.3.7.4. Russia

9.3.7.4.1. Market size and forecast, by chip type
9.3.7.4.2. Market size and forecast, by application
9.3.7.4.3. Market size and forecast, by technology
9.3.7.4.4. Market size and forecast, by processing type
9.3.7.4.5. Market size and forecast, by industry vertical

9.3.7.5. Rest of Europe

9.3.7.5.1. Market size and forecast, by chip type
9.3.7.5.2. Market size and forecast, by application
9.3.7.5.3. Market size and forecast, by technology
9.3.7.5.4. Market size and forecast, by processing type
9.3.7.5.5. Market size and forecast, by industry vertical

9.4. ASIA-PACIFIC

9.4.1. Key market trends, growth factors, and opportunities
9.4.2. Market size and forecast, by chip type
9.4.3. Market size and forecast, by application
9.4.4. Market size and forecast, by technology
9.4.5. Market size and forecast, by processing type
9.4.6. Market size and forecast, by industry vertical
9.4.7. Market analysis by country

9.4.7.1. China

9.4.7.1.1. Market size and forecast, by chip type
9.4.7.1.2. Market size and forecast, by application
9.4.7.1.3. Market size and forecast, by technology
9.4.7.1.4. Market size and forecast, by processing type
9.4.7.1.5. Market size and forecast, by industry vertical

9.4.7.2. Japan

9.4.7.2.1. Market size and forecast, by chip type
9.4.7.2.2. Market size and forecast, by application
9.4.7.2.3. Market size and forecast, by technology
9.4.7.2.4. Market size and forecast, by processing type
9.4.7.2.5. Market size and forecast, by industry vertical

9.4.7.3. India

9.4.7.3.1. Market size and forecast, by chip type
9.4.7.3.2. Market size and forecast, by application
9.4.7.3.3. Market size and forecast, by technology
9.4.7.3.4. Market size and forecast, by processing type
9.4.7.3.5. Market size and forecast, by industry vertical

9.4.7.4. Australia

9.4.7.4.1. Market size and forecast, by chip type
9.4.7.4.2. Market size and forecast, by application
9.4.7.4.3. Market size and forecast, by technology
9.4.7.4.4. Market size and forecast, by processing type
9.4.7.4.5. Market size and forecast, by industry vertical

9.4.7.5. Rest of Asia-Pacific

9.4.7.5.1. Market size and forecast, by chip type
9.4.7.5.2. Market size and forecast, by application
9.4.7.5.3. Market size and forecast, by technology
9.4.7.5.4. Market size and forecast, by processing type
9.4.7.5.5. Market size and forecast, by industry vertical

9.5. LAMEA

9.5.1. Key market trends, growth factors, and opportunities
9.5.2. Market size and forecast, by chip type
9.5.3. Market size and forecast, by application
9.5.4. Market size and forecast, by technology
9.5.5. Market size and forecast, by processing type
9.5.6. Market size and forecast, by industry vertical
9.5.7. Market analysis by country

9.5.7.1. Latin America

9.5.7.1.1. Market size and forecast, by chip type
9.5.7.1.2. Market size and forecast, by application
9.5.7.1.3. Market size and forecast, by technology
9.5.7.1.4. Market size and forecast, by processing type
9.5.7.1.5. Market size and forecast, by industry vertical

9.5.7.2. Middle East

9.5.7.2.1. Market size and forecast, by chip type
9.5.7.2.2. Market size and forecast, by application
9.5.7.2.3. Market size and forecast, by technology
9.5.7.2.4. Market size and forecast, by processing type
9.5.7.2.5. Market size and forecast, by industry vertical

9.5.7.3. Africa

9.5.7.3.1. Market size and forecast, by chip type
9.5.7.3.2. Market size and forecast, by application
9.5.7.3.3. Market size and forecast, by technology
9.5.7.3.4. Market size and forecast, by processing type
9.5.7.3.5. Market size and forecast, by industry vertical

CHAPTER 10: COMPANY PROFILES

10.1. ADAPTEVA, INC.

10.1.1. Company overview
10.1.2. Company snapshot
10.1.3. Product portfolio
10.1.4. Key strategic moves and developments
10.1.5. Technological insights and key architecture

10.2. ADVANCED MICRO DEVICES, INC.

10.2.1. Company overview
10.2.2. Company snapshot
10.2.3. Operating business segments
10.2.4. Product portfolio
10.2.5. Business performance
10.2.6. Key strategic moves and developments
10.2.7. Technological insights and key architecture

10.3. ALPHABET INC. (GOOGLE INC.)

10.3.1. Company overview
10.3.2. Company snapshot
10.3.3. Operating business segments
10.3.4. Product portfolio
10.3.5. Business performance
10.3.6. Key strategic moves and developments
10.3.7. Technological insights and key architecture

10.4. AMAZON.COM, INC.

10.4.1. Company overview
10.4.2. Company snapshot
10.4.3. Operating business segments
10.4.4. Product portfolio
10.4.5. Business performance
10.4.6. Key strategic moves and developments
10.4.7. Technological insights and key architecture

10.5. ANALOG DEVICES, INC.

10.5.1. Company overview
10.5.2. Company snapshot
10.5.3. Operating business segments
10.5.4. Product portfolio
10.5.5. Business performance
10.5.6. Technological insights and key architecture

10.6. APPLIED MATERIALS, INC.

10.6.1. Company overview
10.6.2. Company snapshot
10.6.3. Operating business segments
10.6.4. Product portfolio
10.6.5. Business performance
10.6.6. Key strategic moves and developments
10.6.7. Technological insights and key architecture

10.7. BAIDU, INC.

10.7.1. Company overview
10.7.2. Company snapshot
10.7.3. Operating business segments
10.7.4. Product portfolio
10.7.5. Business performance
10.7.6. Key strategic moves and developments
10.7.7. Technological insights and key architecture

10.8. BITMAIN TECHNOLOGIES LTD.

10.8.1. Company overview
10.8.2. Company snapshot
10.8.3. Product portfolio
10.8.4. Key strategic moves and developments
10.8.5. Technological insights and key architecture

10.9. BROADCOM LIMITED

10.9.1. Company overview
10.9.2. Company snapshot
10.9.3. Operating business segments
10.9.4. Product portfolio
10.9.5. Business performance
10.9.6. Technological insights and key architecture

10.10. CAMBRICON TECHNOLOGIES CORPORATION LIMITED

10.10.1. Company overview
10.10.2. Company snapshot
10.10.3. Operating business segments
10.10.4. Product portfolio
10.10.5. Technological insights and key architecture

10.11. DEEPHI TECHNOLOGY CO., LTD.

10.11.1. Company overview
10.11.2. Company snapshot
10.11.3. Operating business segments
10.11.4. Product portfolio
10.11.5. Key strategic moves and developments
10.11.6. Technological insights and key architecture

10.12. GRAPHCORE LTD.

10.12.1. Company overview
10.12.2. Company snapshot
10.12.3. Operating business segments
10.12.4. Product portfolio
10.12.5. Key strategic moves and developments
10.12.6. Technological insights and key architecture

10.13. GROQ

10.13.1. Company overview
10.13.2. Company snapshot
10.13.3. Product portfolio
10.13.4. Technological insights and key architecture

10.14. GYRFALCON TECHNOLOGY INC.

10.14.1. Company overview
10.14.2. Company snapshot
10.14.3. Operating business segments
10.14.4. Product portfolio
10.14.5. Technological insights and key architecture

10.15. HORIZON ROBOTICS, INC.

10.15.1. Company overview
10.15.2. Company snapshot
10.15.3. Product portfolio
10.15.4. Technological insights and key architecture

10.16. HUAWEI TECHNOLOGIES CO. LTD.

10.16.1. Company overview
10.16.2. Company snapshot
10.16.3. Operating business segments
10.16.4. Product portfolio
10.16.5. Business performance
10.16.6. Key strategic moves and developments
10.16.7. Technological insights and key architecture

10.17. INTEL CORPORATION

10.17.1. Company overview
10.17.2. Company snapshot
10.17.3. Operating business segments
10.17.4. Product portfolio
10.17.5. Business performance
10.17.6. Key strategic moves and developments
10.17.7. Technological insights and key architecture

10.18. INTERNATIONAL BUSINESS MANAGEMENT CORPORATION

10.18.1. Company overview
10.18.2. Company snapshot
10.18.3. Operating business segments
10.18.4. Product portfolio
10.18.5. Business performance
10.18.6. Key strategic moves and developments
10.18.7. Technological insights and key architecture

10.19. KNUEDGE, INC.

10.19.1. Company overview
10.19.2. Company snapshot
10.19.3. Product portfolio
10.19.4. Technological insights and key architecture

10.20. KRTKL INC.

10.20.1. Company overview
10.20.2. Company snapshot
10.20.3. Product portfolio
10.20.4. Technological insights and key architecture

10.21. MEDIATEK, INC.

10.21.1. Company overview
10.21.2. Company snapshot
10.21.3. Operating business segments
10.21.4. Product portfolio
10.21.5. Business performance
10.21.6. Key strategic moves and developments
10.21.7. Technological insights and key architecture

10.22. MICRON TECHNOLOGY, INC.

10.22.1. Company overview
10.22.2. Company snapshot
10.22.3. Operating business segments
10.22.4. Product portfolio
10.22.5. Business performance
10.22.6. Technological insights and key architecture

10.23. MICROSEMI CORPORATION

10.23.1. Company overview
10.23.2. Company snapshot
10.23.3. Operating business segments
10.23.4. Product portfolio
10.23.5. Business performance
10.23.6. Key strategic moves and developments
10.23.7. Technological insights and key architecture

10.24. MYTHIC, INC.

10.24.1. Company overview
10.24.2. Company snapshot
10.24.3. Product portfolio
10.24.4. Key strategic moves and developments
10.24.5. Technological insights and key architecture

10.25. NEC CORPORATION

10.25.1. Company overview
10.25.2. Company snapshot
10.25.3. Operating business segments
10.25.4. Product portfolio
10.25.5. Business performance
10.25.6. Key strategic moves and developments
10.25.7. Technological insights and key architecture

10.26. KOREA ELECTRONIC CERTIFICATION AUTHORITY, INC. (AI BRAIN, INC.)

10.26.1. Company overview
10.26.2. Company snapshot
10.26.3. Operating business segments
10.26.4. Product portfolio
10.26.5. Technological insights and key architecture

10.27. NVIDIA CORPORATION

10.27.1. Company overview
10.27.2. Company snapshot
10.27.3. Operating business segments
10.27.4. Product portfolio
10.27.5. Business performance
10.27.6. Key strategic moves and developments
10.27.7. Technological insights and key architecture

10.28. NXP SEMICONDUCTORS N.V.

10.28.1. Company overview
10.28.2. Company snapshot
10.28.3. Operating business segments
10.28.4. Product portfolio
10.28.5. Business performance
10.28.6. Key strategic moves and developments
10.28.7. Technological insights and key architecture

10.29. QUALCOMM INCORPORATED

10.29.1. Company overview
10.29.2. Company snapshot
10.29.3. Operating business segments
10.29.4. Product portfolio
10.29.5. Business performance
10.29.6. Key strategic moves and developments
10.29.7. Technological insights and key architecture

10.30. SAMSUNG ELECTRONICS CO. LTD.

10.30.1. Company overview
10.30.2. Company snapshot
10.30.3. Operating business segments
10.30.4. Product portfolio
10.30.5. Business performance
10.30.6. Key strategic moves and developments
10.30.7. Technological insights and key architecture

10.31. SHANGHAI THINK-FORCE ELECTRONIC TECHNOLOGY CO. LTD.

10.31.1. Company overview
10.31.2. Company snapshot
10.31.3. Product portfolio
10.31.4. Technological insights and key architecture

10.32. SK HYNIX, INC.

10.32.1. Company overview
10.32.2. Company snapshot
10.32.3. Operating business segments
10.32.4. Product portfolio
10.32.5. Business performance
10.32.6. Technological insights and key architecture

10.33. SOFTBANK GROUP CORP. (ARM HOLDINGS PLC)

10.33.1. Company overview
10.33.2. Company snapshot
10.33.3. Operating business segments
10.33.4. Product portfolio
10.33.5. Business performance
10.33.6. Key strategic moves and developments
10.33.7. Technological insights and key architecture

10.34. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

10.34.1. Company overview
10.34.2. Company snapshot
10.34.3. Operating business segments
10.34.4. Product portfolio
10.34.5. Business performance
10.34.6. Technological insights and key architecture

10.35. TENSTORRENT INC.

10.35.1. Company overview
10.35.2. Company snapshot
10.35.3. Product portfolio
10.35.4. Technological insights and key architecture

10.36. TEXAS INSTRUMENTS INCORPORATED

10.36.1. Company overview
10.36.2. Company snapshot
10.36.3. Operating business segments
10.36.4. Product portfolio
10.36.5. Business performance
10.36.6. Technological insights and key architecture

10.37. TOSHIBA CORPORATION

10.37.1. Company overview
10.37.2. Company snapshot
10.37.3. Operating business segments
10.37.4. Product portfolio
10.37.5. Business performance
10.37.6. Key strategic moves and developments
10.37.7. Technological insights and key architecture

10.38. UNIVERSITY OF CALIFORNIA SYSTEM (UNIVERSITY OF CALIFORNIA, DAVIS)

10.38.1. Company overview
10.38.2. Company snapshot
10.38.3. Operating business segments
10.38.4. Product portfolio
10.38.5. Business performance
10.38.6. Technological insights and key architecture

10.39. WAVE COMPUTING, INC.

10.39.1. Company overview
10.39.2. Company snapshot
10.39.3. Product portfolio
10.39.4. Key strategic moves and developments
10.39.5. Technological insights and key architecture

10.40. XILINX, INC.

10.40.1. Company overview
10.40.2. Company snapshot
10.40.3. Operating business segments
10.40.4. Product portfolio
10.40.5. Business performance
10.40.6. Technological insights and key architecture