CHAPTER 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies

3.3. PORTERS FIVE FORCES ANALYSIS
3.4. MARKET SHARE ANALYSIS (2020)
3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Proliferation of M2M/IoT connections
3.5.1.2. Increase in demand for mobile broadband services

3.5.2. Restraint

3.5.2.1. High investment and Technological & Infrastructure challenges in the implementation of 5G network
3.5.2.2. Privacy and Security Concern

3.5.3. Opportunities

3.5.3.1. Rise in government initiatives for building smart cities in Asia-Pacific

CHAPTER 4: 5G CHIPSET MARKET, BY IC TYPE

4.1. OVERVIEW
4.2. ASIC

4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country

4.3. RFIC

4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country

4.4. CELLULAR IC

4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country

4.5. MMWAVE IC

4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country

CHAPTER 5: 5G CHIPSET MARKET, BY OPERATIONAL FREQUENCY

5.1. OVERVIEW
5.2. SUB 6GHZ

5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country

5.3. BETWEEN 26 & 39 GHZ

5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country

5.4. ABOVE 39 GHZ

5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country

CHAPTER 6: 5G CHIPSET MARKET, BY PRODUCT

6.1. OVERVIEW
6.2. DEVICES

6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis by country

6.3. CUSTOMER PREMISES EQUIPMENT

6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis by country

6.4. NETWORK INFRASTRUCTURE EQUIPMENT

6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis by country

CHAPTER 7: 5G CHIPSET MARKET, BY INDUSTRY VERTICAL

7.1. OVERVIEW
7.2. AUTOMOTIVE & TRANSPORTATION

7.2.1. Key market trends, growth factors and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market analysis by country

7.3. ENERGY & UTILITIES

7.3.1. Key market trends, growth factors and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market analysis by country

7.4. HEALTHCARE

7.4.1. Key market trends, growth factors and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market analysis by country

7.5. RETAIL

7.5.1. Key market trends, growth factors and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market analysis by country

7.6. CONSUMER ELECTRONICS

7.6.1. Key market trends, growth factors and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market analysis by country

7.7. INDUSTRIAL AUTOMATION

7.7.1. Key market trends, growth factors and opportunities
7.7.2. Market size and forecast, by region
7.7.3. Market analysis by country

7.8. OTHERS

7.8.1. Key market trends, growth factors and opportunities
7.8.2. Market size and forecast, by region
7.8.3. Market analysis by country

CHAPTER 8: 5G CHIPSET MARKET, BY REGION

8.1. OVERVIEW
8.2. NORTH AMERICA

8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by IC Type
8.2.3. Market size and forecast, by Operational Frequency
8.2.4. Market size and forecast, by product
8.2.5. Market size and forecast, by industry vertical
8.2.6. Market analysis by country

8.2.6.1. U.S.

8.2.6.1.1. Market size and forecast, by IC Type
8.2.6.1.2. Market size and forecast, by Operational Frequency
8.2.6.1.3. Market size and forecast, by product
8.2.6.1.4. Market size and forecast, by industry vertical

8.2.6.2. Canada

8.2.6.2.1. Market size and forecast, by IC Type
8.2.6.2.2. Market size and forecast, by Operational Frequency
8.2.6.2.3. Market size and forecast, by product
8.2.6.2.4. Market size and forecast, by industry vertical

8.2.6.3. Mexico

8.2.6.3.1. Market size and forecast, by IC Type
8.2.6.3.2. Market size and forecast, by Operational Frequency
8.2.6.3.3. Market size and forecast, by product
8.2.6.3.4. Market size and forecast, by industry vertical

8.3. EUROPE

8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by IC Type
8.3.3. Market size and forecast, by Operational Frequency
8.3.4. Market size and forecast, by product
8.3.5. Market size and forecast, by industry vertical
8.3.6. Market analysis by country

8.3.6.1. U.K.

8.3.6.1.1. Market size and forecast, by IC Type
8.3.6.1.2. Market size and forecast, by Operational Frequency
8.3.6.1.3. Market size and forecast, by product
8.3.6.1.4. Market size and forecast, by industry vertical

8.3.6.2. Germany

8.3.6.2.1. Market size and forecast, by IC Type
8.3.6.2.2. Market size and forecast, by Operational Frequency
8.3.6.2.3. Market size and forecast, by product
8.3.6.2.4. Market size and forecast, by industry vertical

8.3.6.3. France

8.3.6.3.1. Market size and forecast, by IC Type
8.3.6.3.2. Market size and forecast, by Operational Frequency
8.3.6.3.3. Market size and forecast, by product
8.3.6.3.4. Market size and forecast, by industry vertical

8.3.6.4. Russia

8.3.6.4.1. Market size and forecast, by IC Type
8.3.6.4.2. Market size and forecast, by Operational Frequency
8.3.6.4.3. Market size and forecast, by product
8.3.6.4.4. Market size and forecast, by industry vertical

8.3.6.5. Rest of Europe

8.3.6.5.1. Market size and forecast, by IC Type
8.3.6.5.2. Market size and forecast, by Operational Frequency
8.3.6.5.3. Market size and forecast, by product
8.3.6.5.4. Market size and forecast, by industry vertical

8.4. ASIA-PACIFIC

8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by IC Type
8.4.3. Market size and forecast, by Operational Frequency
8.4.4. Market size and forecast, by product
8.4.5. Market size and forecast, by industry vertical
8.4.6. Market analysis by country

8.4.6.1. China

8.4.6.1.1. Market size and forecast, by IC Type
8.4.6.1.2. Market size and forecast, by Operational Frequency
8.4.6.1.3. Market size and forecast, by product
8.4.6.1.4. Market size and forecast, by industry vertical

8.4.6.2. Japan

8.4.6.2.1. Market size and forecast, by IC Type
8.4.6.2.2. Market size and forecast, by Operational Frequency
8.4.6.2.3. Market size and forecast, by product
8.4.6.2.4. Market size and forecast, by industry vertical

8.4.6.3. India

8.4.6.3.1. Market size and forecast, by IC Type
8.4.6.3.2. Market size and forecast, by Operational Frequency
8.4.6.3.3. Market size and forecast, by product
8.4.6.3.4. Market size and forecast, by industry vertical

8.4.6.4. South Korea

8.4.6.4.1. Market size and forecast, by IC Type
8.4.6.4.2. Market size and forecast, by Operational Frequency
8.4.6.4.3. Market size and forecast, by product
8.4.6.4.4. Market size and forecast, by industry vertical

8.4.6.5. Rest of Asia-Pacific

8.4.6.5.1. Market size and forecast, by IC Type
8.4.6.5.2. Market size and forecast, by Operational Frequency
8.4.6.5.3. Market size and forecast, by product
8.4.6.5.4. Market size and forecast, by industry vertical

8.5. LAMEA

8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by IC Type
8.5.3. Market size and forecast, by Operational Frequency
8.5.4. Market size and forecast, by product
8.5.5. Market size and forecast, by industry vertical
8.5.6. Market analysis by country

8.5.6.1. Latin America

8.5.6.1.1. Market size and forecast, by IC Type
8.5.6.1.2. Market size and forecast, by Operational Frequency
8.5.6.1.3. Market size and forecast, by product
8.5.6.1.4. Market size and forecast, by industry vertical

8.5.6.2. Middle East

8.5.6.2.1. Market size and forecast, by IC Type
8.5.6.2.2. Market size and forecast, by Operational Frequency
8.5.6.2.3. Market size and forecast, by product
8.5.6.2.4. Market size and forecast, by industry vertical

8.5.6.3. Africa

8.5.6.3.1. Market size and forecast, by IC Type
8.5.6.3.2. Market size and forecast, by Operational Frequency
8.5.6.3.3. Market size and forecast, by product
8.5.6.3.4. Market size and forecast, by industry vertical

CHAPTER 9: COMPANY PROFILES

9.1. BROADCOM

9.1.1. Company overview
9.1.2. Company snapshot
9.1.3. Operating business segments
9.1.4. Product portfolio
9.1.5. Business performance
9.1.6. Key strategic moves and developments

9.2. HUAWEI TECHNOLOGIES CO., LTD.

9.2.1. Company overview
9.2.2. Company snapshot
9.2.3. Operating business segments
9.2.4. Product portfolio
9.2.5. Business performance
9.2.6. Key strategic moves and developments

9.3. INFINEON TECHNOLOGIES AG

9.3.1. Company overview
9.3.2. Company snapshot
9.3.3. Operating business segments
9.3.4. Product portfolio
9.3.5. Business performance
9.3.6. Key strategic moves and developments

9.4. INTEL CORPORATION

9.4.1. Company overview
9.4.2. Company snapshot
9.4.3. Operating business segments
9.4.4. Product portfolio
9.4.5. Business performance
9.4.6. Key strategic moves and developments

9.5. MEDIATEK INC

9.5.1. Company overview
9.5.2. Company snapshot
9.5.3. Product portfolio
9.5.4. Business performance
9.5.5. Key strategic moves and developments

9.6. NOKIA CORPORATION

9.6.1. Company overview
9.6.2. Company snapshot
9.6.3. Operating business segments
9.6.4. Product portfolio
9.6.5. Business performance
9.6.6. Key strategic moves and developments

9.7. QUALCOMM TECHNOLOGIES, INC.

9.7.1. Company overview
9.7.2. Company snapshot
9.7.3. Operating business segments
9.7.4. Product portfolio
9.7.5. Business performance
9.7.6. Key strategic moves and developments

9.8. QORVO

9.8.1. Company overview
9.8.2. Company snapshot
9.8.3. Operating business segments
9.8.4. Product portfolio
9.8.5. Business performance
9.8.6. Key strategic moves and developments

9.9. SAMSUNG ELECTRONICS CO. LTD.

9.9.1. Company overview
9.9.2. Company snapshot
9.9.3. Operating business segments
9.9.4. Product portfolio
9.9.5. Business performance
9.9.6. Key strategic moves and developments

9.10. XILINX INC.

9.10.1. Company overview
9.10.2. Company snapshot
9.10.3. Operating business segments
9.10.4. Product portfolio
9.10.5. Business performance
9.10.6. Key strategic moves and developments