CHAPTER 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies

3.3. PORTERS FIVE FORCES ANALYSIS

3.3.1. Moderate to high bargaining power of suppliers
3.3.2. Moderate threat of new entrants
3.3.3. Moderate threat of substitutes
3.3.4. Moderate to high intensity of rivalry
3.3.5. Moderate to high bargaining power of buyers

3.4. KEY PLAYER POSITIONING, 2017 (%)
3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Advantages of compound semiconductors (SiC) over silicon-based technology.
3.5.1.2. Increase in demand of power electronics modules across various industry verticals.
3.5.1.3. Rise in installation of solar photovoltaic panels for electricity generation.
3.5.1.4. Growth in demand of electric vehicles, plug-in electric vehicles, and hybrid electric vehicles .

3.5.2. Restraints

3.5.2.1. High wafer cost of silicon carbide semiconductors.
3.5.2.2. Complexity in supply chain and designing process of SiC semiconductor technology.

3.5.3. Opportunities

3.5.3.1. Advent of 5G mobile communication.

CHAPTER 4: SILICON CARBIDE (SIC) POWER SEMICONDUCTORS MARKET, BY POWER MODULE

4.1. OVERVIEW
4.2. POWER PRODUCTS

4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country

4.3. DISCRETE PRODUCTS

4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country

CHAPTER 5: SILICON CARBIDE (SIC) POWER SEMICONDUCTORS MARKET, BY INDUSTRY VERTICAL

5.1. OVERVIEW
5.2. IT & TELECOM

5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country

5.3. AEROSPACE & DEFENSE

5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country

5.4. INDUSTRIAL

5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country

5.5. ENERGY & POWER

5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country

5.6. ELECTRONICS

5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis, by country

5.7. AUTOMOTIVE

5.7.1. Key market trends, growth factors, and opportunities
5.7.2. Market size and forecast, by region
5.7.3. Market analysis, by country

5.8. HEALTHCARE

5.8.1. Key market trends, growth factors, and opportunities
5.8.2. Market size and forecast, by region
5.8.3. Market analysis, by country

CHAPTER 6: SILICON CARBIDE (SIC) POWER SEMICONDUCTORS MARKET, BY REGION

6.1. OVERVIEW
6.2. NORTH AMERICA

6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by power module
6.2.3. Market size and forecast, by industry vertical
6.2.4. Market analysis, by country

6.2.4.1. U.S.

6.2.4.1.1. Market size and forecast, by Power module
6.2.4.1.2. Market size and forecast, by industry vertical

6.2.4.2. Canada

6.2.4.2.1. Market size and forecast, by Power module
6.2.4.2.2. Market size and forecast, by industry vertical

6.2.4.3. Mexico

6.2.4.3.1. Market size and forecast, by Power module
6.2.4.3.2. Market size and forecast, by industry vertical

6.3. EUROPE

6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by Power module
6.3.3. Market size and forecast, by industry vertical
6.3.4. Market analysis, by country

6.3.4.1. U.K.

6.3.4.1.1. Market size and forecast, by Power module
6.3.4.1.2. Market size and forecast, by industry vertical

6.3.4.2. Germany

6.3.4.2.1. Market size and forecast, by Power module
6.3.4.2.2. Market size and forecast, by industry vertical

6.3.4.3. France

6.3.4.3.1. Market size and forecast, by Power module
6.3.4.3.2. Market size and forecast, by industry vertical

6.3.4.4. Italy

6.3.4.4.1. Market size and forecast, by Power module
6.3.4.4.2. Market size and forecast, by industry vertical

6.3.4.5. Rest of Europe

6.3.4.5.1. Market size and forecast, by Power module
6.3.4.5.2. Market size and forecast, by industry vertical

6.4. ASIA-PACIFIC

6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by Power module
6.4.3. Market size and forecast, by industry vertical
6.4.4. Market analysis, by country

6.4.4.1. China

6.4.4.1.1. Market size and forecast, by Power module
6.4.4.1.2. Market size and forecast, by industry vertical

6.4.4.2. India

6.4.4.2.1. Market size and forecast, by Power module
6.4.4.2.2. Market size and forecast, by industry vertical

6.4.4.3. Japan

6.4.4.3.1. Market size and forecast, by Power module
6.4.4.3.2. Market size and forecast, by industry vertical

6.4.4.4. Australia

6.4.4.4.1. Market size and forecast, by Power module
6.4.4.4.2. Market size and forecast, by industry vertical

6.4.4.5. South Korea

6.4.4.5.1. Market size and forecast, by Power module
6.4.4.5.2. Market size and forecast, by industry vertical

6.4.4.6. Rest of Asia-Pacific

6.4.4.6.1. Market size and forecast, by Power module
6.4.4.6.2. Market size and forecast, by industry vertical

6.5. LAMEA

6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by Power module
6.5.3. Market size and forecast, by industry vertical
6.5.4. Market analysis by country

6.5.4.1. Brazil

6.5.4.1.1. Market size and forecast, by Power module
6.5.4.1.2. Market size and forecast, by industry vertical

6.5.4.2. Saudi Arabia

6.5.4.2.1. Market size and forecast, by Power module
6.5.4.2.2. Market size and forecast, by industry vertical

6.5.4.3. South Africa

6.5.4.3.1. Market size and forecast, by Power module
6.5.4.3.2. Market size and forecast, by industry vertical

6.5.4.4. Rest of LAMEA

6.5.4.4.1. Market size and forecast, by Power module
6.5.4.4.2. Market size and forecast, by industry vertical

CHAPTER 7: COMPANY PROFILES

7.1. INFINEON TECHNOLOGY

7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Operating business segments
7.1.4. Business performance
7.1.5. Key strategic moves and developments

7.2. MICROSEMI CORPORATION

7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Operating business segments
7.2.4. Business performance
7.2.5. Key strategic moves and developments

7.3. GENERAL ELECTRIC COMPANY

7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Operating business segments
7.3.4. Business performance
7.3.5. Key strategic moves and developments

7.4. POWER INTEGRATION, INC.

7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Business performance
7.4.5. Key strategic moves and developments

7.5. FAIRCHILD SEMICONDUCTOR (ON SEMICONDUCTOR)

7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Operating business segments
7.5.4. Business performance
7.5.5. Key strategic moves and developments

7.6. STMICROELECTRONICS

7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Business performance
7.6.5. Key strategic moves and developments

7.7. TOKYO ELECTRON LIMITED

7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Business performance
7.7.5. Key strategic moves and developments

7.8. RENESAS ELECTRONICS CORPORATION

7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Operating business segments
7.8.4. Business performance
7.8.5. Key strategic moves and developments

7.9. TOSHIBA CORPORATION

7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Operating business segments
7.9.4. Business performance
7.9.5. Key strategic moves and developments

7.10. CREE, INC.

7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Operating business segments
7.10.4. Business performance
7.10.5. Key strategic moves and developments

7.11. ROHM CORPORATION

7.11.1. Company overview
7.11.2. Company snapshot
7.11.3. Operating business segments
7.11.4. Business performance
7.11.5. Key strategic moves and developments

7.12. NXP SEMICONDUCTORS

7.12.1. Company overview
7.12.2. Company snapshot
7.12.3. Operating business segments
7.12.4. Business performance
7.12.5. Key strategic moves and developments