CHAPTER 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies

3.3. PORTERS FIVE FORCES ANALYSIS

3.3.1. Moderate-to-high bargaining power of suppliers
3.3.2. Moderate-to-high threat of new entrants
3.3.3. Low-to-Moderate threat of substitutes
3.3.4. High-to-moderate intensity of rivalry
3.3.5. High-to-moderate bargaining power of buyers

3.4. MARKET SHARE ANALYSIS (2017)
3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Increase in demand for smart homes & smart cities
3.5.1.2. Rise in investments in AI startups
3.5.1.3. Emergence of quantum computing
3.5.1.4. Growth in number of AI applications

3.5.2. Restraints

3.5.2.1. Dearth of skilled workforce

3.5.3. Opportunities

3.5.3.1. Increased adoption of deep learning chips in the developing regions
3.5.3.2. Development of smarter robots

CHAPTER 4: DEEP LEARNING CHIP MARKET, BY CHIP TYPE

4.1. OVERVIEW
4.2. GPU

4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country

4.3. ASIC

4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country

4.4. FPGA

4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country

4.5. CPU

4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country

4.6. OTHERS (NPU & HYBRID CHIP)

4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country

CHAPTER 5: DEEP LEARNING CHIP MARKET, BY TECHNOLOGY

5.1. OVERVIEW
5.2. SYSTEM-ON-CHIP (SOC)

5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country

5.3. SYSTEM-IN-PACKAGE (SIP)

5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country

5.4. MULTI-CHIP MODULE

5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country

5.5. OTHERS (PACKAGE IN PACKAGE, TSV)

5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis by country

CHAPTER 6: DEEP LEARNING CHIP MARKET, BY INDUSTRY VERTICAL

6.1. OVERVIEW
6.2. MEDIA & ADVERTISING

6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis by country

6.3. BFSI

6.3.1. Key market trends, growth factors and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis by country

6.4. IT & TELECOM

6.4.1. Key market trends, growth factors and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis by country

6.5. RETAIL

6.5.1. Key market trends, growth factors and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis by country

6.6. HEALTHCARE

6.6.1. Key market trends, growth factors and opportunities
6.6.2. Market size and forecast, by region
6.6.3. Market analysis by country

6.7. AUTOMOTIVE

6.7.1. Key market trends, growth factors and opportunities
6.7.2. Market size and forecast, by region
6.7.3. Market analysis by country

6.8. OTHERS

6.8.1. Key market trends, growth factors and opportunities
6.8.2. Market size and forecast, by region
6.8.3. Market analysis by country

CHAPTER 7: DEEP LEARNING CHIP MARKET, BY REGION

7.1. OVERVIEW
7.2. NORTH AMERICA

7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by chip type
7.2.3. Market size and forecast, by technology
7.2.4. Market size and forecast, by industry vertical
7.2.5. Market analysis by country

7.2.5.1. U.S.

7.2.5.1.1. Market size and forecast, by chip type
7.2.5.1.2. Market size and forecast, by technology
7.2.5.1.3. Market size and forecast, by industry vertical

7.2.5.2. Canada

7.2.5.2.1. Market size and forecast, by chip type
7.2.5.2.2. Market size and forecast, by technology
7.2.5.2.3. Market size and forecast, by industry vertical

7.2.5.3. Mexico

7.2.5.3.1. Market size and forecast, by chip type
7.2.5.3.2. Market size and forecast, by technology
7.2.5.3.3. Market size and forecast, by industry vertical

7.3. EUROPE

7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by chip type
7.3.3. Market size and forecast, by technology
7.3.4. Market size and forecast, by industry vertical
7.3.5. Market analysis by country

7.3.5.1. U.K.

7.3.5.1.1. Market size and forecast, by chip type
7.3.5.1.2. Market size and forecast, by technology
7.3.5.1.3. Market size and forecast, by industry vertical

7.3.5.2. Germany

7.3.5.2.1. Market size and forecast, by chip type
7.3.5.2.2. Market size and forecast, by technology
7.3.5.2.3. Market size and forecast, by industry vertical

7.3.5.3. France

7.3.5.3.1. Market size and forecast, by chip type
7.3.5.3.2. Market size and forecast, by technology
7.3.5.3.3. Market size and forecast, by industry vertical

7.3.5.4. Russia

7.3.5.4.1. Market size and forecast, by chip type
7.3.5.4.2. Market size and forecast, by technology
7.3.5.4.3. Market size and forecast, by industry vertical

7.3.5.5. Rest of Europe

7.3.5.5.1. Market size and forecast, by chip type
7.3.5.5.2. Market size and forecast, by technology
7.3.5.5.3. Market size and forecast, by industry vertical

7.4. ASIA-PACIFIC

7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by chip type
7.4.3. Market size and forecast, by technology
7.4.4. Market size and forecast, by industry vertical
7.4.5. Market analysis by country

7.4.5.1. China

7.4.5.1.1. Market size and forecast, by chip type
7.4.5.1.2. Market size and forecast, by technology
7.4.5.1.3. Market size and forecast, by industry vertical

7.4.5.2. Japan

7.4.5.2.1. Market size and forecast, by chip type
7.4.5.2.2. Market size and forecast, by technology
7.4.5.2.3. Market size and forecast, by industry vertical

7.4.5.3. India

7.4.5.3.1. Market size and forecast, by chip type
7.4.5.3.2. Market size and forecast, by technology
7.4.5.3.3. Market size and forecast, by industry vertical

7.4.5.4. Australia

7.4.5.4.1. Market size and forecast, by chip type
7.4.5.4.2. Market size and forecast, by technology
7.4.5.4.3. Market size and forecast, by industry vertical

7.4.5.5. Rest of Asia-Pacific

7.4.5.5.1. Market size and forecast, by chip type
7.4.5.5.2. Market size and forecast, by technology
7.4.5.5.3. Market size and forecast, by industry vertical

7.5. LAMEA

7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by chip type
7.5.3. Market size and forecast, by technology
7.5.4. Market size and forecast, by industry vertical
7.5.5. Market analysis by country

7.5.5.1. Latin America

7.5.5.1.1. Market size and forecast, by chip type
7.5.5.1.2. Market size and forecast, by technology
7.5.5.1.3. Market size and forecast, by industry vertical

7.5.5.2. Middle East

7.5.5.2.1. Market size and forecast, by chip type
7.5.5.2.2. Market size and forecast, by technology
7.5.5.2.3. Market size and forecast, by industry vertical

7.5.5.3. Africa

7.5.5.3.1. Market size and forecast, by chip type
7.5.5.3.2. Market size and forecast, by technology
7.5.5.3.3. Market size and forecast, by industry vertical

CHAPTER 8: COMPANY PROFILES

8.1. ALPHABET INC. (GOOGLE INC.)

8.1.1. Company overview
8.1.2. Company snapshot
8.1.3. Operating business segments
8.1.4. Product portfolio
8.1.5. Business performance
8.1.6. Key strategic moves and developments
8.1.7. Technological insights and key architecture

8.2. AMAZON.COM, INC.

8.2.1. Company overview
8.2.2. Company snapshot
8.2.3. Operating business segments
8.2.4. Product portfolio
8.2.5. Business performance
8.2.6. Key strategic moves and developments
8.2.7. Technological insights and key architecture

8.3. ADVANCED MICRO DEVICES, INC.

8.3.1. Company overview
8.3.2. Company snapshot
8.3.3. Operating business segments
8.3.4. Product portfolio
8.3.5. Business performance
8.3.6. Key strategic moves and developments
8.3.7. Technological insights and key architecture

8.4. BAIDU, INC.

8.4.1. Company overview
8.4.2. Company snapshot
8.4.3. Operating business segments
8.4.4. Product portfolio
8.4.5. Business performance
8.4.6. Key strategic moves and developments
8.4.7. Technological insights and key architecture

8.5. BITMAIN TECHNOLOGIES LTD.

8.5.1. Company overview
8.5.2. Company snapshot
8.5.3. Product portfolio
8.5.4. Key strategic moves and developments
8.5.5. Technological insights and key architecture

8.6. INTEL CORPORATION

8.6.1. Company overview
8.6.2. Company snapshot
8.6.3. Operating business segments
8.6.4. Product portfolio
8.6.5. Business performance
8.6.6. Key strategic moves and developments
8.6.7. Technological insights and key architecture

8.7. NVIDIA CORPORATION

8.7.1. Company overview
8.7.2. Company snapshot
8.7.3. Operating business segments
8.7.4. Product portfolio
8.7.5. Business performance
8.7.6. Key strategic moves and developments
8.7.7. Technological insights and key architecture

8.8. QUALCOMM INCORPORATED

8.8.1. Company overview
8.8.2. Company snapshot
8.8.3. Operating business segments
8.8.4. Product portfolio
8.8.5. Business performance
8.8.6. Key strategic moves and developments
8.8.7. Technological insights and key architecture

8.9. SAMSUNG ELECTRONICS CO. LTD.

8.9.1. Company overview
8.9.2. Company snapshot
8.9.3. Operating business segments
8.9.4. Product portfolio
8.9.5. Business performance
8.9.6. Key strategic moves and developments
8.9.7. Technological insights and key architecture

8.10. XILINX, INC.

8.10.1. Company overview
8.10.2. Company snapshot
8.10.3. Operating business segments
8.10.4. Product portfolio
8.10.5. Business performance
8.10.6. Key strategic moves and developments
8.10.7. Technological insights and key architecture