CHAPTER 1: INTRODUCTION
1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO PERSPECTIVE
CHAPTER 3: MARKET OVERVIEW
3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies
3.3. PORTERS FIVE FORCES ANALYSIS
3.3.1. Moderate-to-high bargaining power of suppliers
3.3.2. Moderate threat of new entrants
3.3.3. Moderate threat of substitutes
3.3.4. Moderate-to-high intensity of rivalry
3.3.5. Moderate bargaining power of buyers
3.4. MARKET SHARE ANALYSIS, 2017
3.5. MARKET DYNAMICS
3.5.1. Drivers
3.5.1.1. Rise in demand of the modern System on Chip (SoC) design
3.5.1.2. Reduction in manufacturing and design cost
3.5.2. Restraint
3.5.2.1. Fluctuations in the development or functionality of the chips.
3.5.3. Opportunity
3.5.3.1. Rise in demand for the consumer electronics
3.5.3.2. New technological developments
CHAPTER 4: SEMICONDUCTOR IP MARKET, BY DESIGN IP
4.1. OVERVIEW
4.2. PROCESSOR IP
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Microprocessor unit
4.2.4. Microcontroller unit
4.2.5. Digital signal processor
4.2.6. Market analysis, by country
4.3. INTERFACE IP
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
4.4. MEMORY IP
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis, by country
4.5. OTHER IP
4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Analog-to-digital converter (ADC)
4.5.4. Digital-to-analog converter (DAC)
4.5.5. Market analysis, by country
CHAPTER 5: SEMICONDUCTOR IP MARKET, BY IP SOURCE
5.1. OVERVIEW
5.2. LICENSING
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. ROYALTY
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. SERVICING
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
CHAPTER 6: SEMICONDUCTOR IP MARKET, BY APPLICATION
6.1. OVERVIEW
6.2. CONSUMER ELECTRONICS
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country
6.3. TELECOM
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis, by country
6.4. AUTOMOTIVE
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis, by country
6.5. AEROSPACE
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis, by country
6.6. HEALTHCARE
6.6.1. Key market trends, growth factors, and opportunities
6.6.2. Market size and forecast, by region
6.6.3. Market analysis, by country
6.7. AGRICULTURE
6.7.1. Key market trends, growth factors, and opportunities
6.7.2. Market size and forecast, by region
6.7.3. Market analysis, by country
6.8. OTHERS
6.8.1. Key market trends, growth factors, and opportunities
6.8.2. Market size and forecast, by region
6.8.3. Market analysis, by country
CHAPTER 7: SEMICONDUCTOR IP MARKET, BY REGION
7.1. OVERVIEW
7.2. NORTH AMERICA
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by design IP
7.2.3. Market size and forecast, by IP source
7.2.4. Market size and forecast, by Application
7.2.5. Market analysis, by country
7.2.6. U.S.
7.2.6.1. Market size and forecast, by design IP
7.2.6.2. Market size and forecast, by IP source
7.2.6.3. Market size and forecast, by Application
7.2.7. Canada
7.2.7.1. Market size and forecast, by design IP
7.2.7.2. Market size and forecast, by IP source
7.2.7.3. Market size and forecast, by Application
7.2.8. Mexico
7.2.8.1. Market size and forecast, by design IP
7.2.8.2. Market size and forecast, by IP source
7.2.8.3. Market size and forecast, by Application
7.3. EUROPE
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by design IP
7.3.3. Market size and forecast, by IP source
7.3.4. Market size and forecast, by Application
7.3.5. Market analysis, by country
7.3.6. U.K.
7.3.6.1. Market size and forecast, by design IP
7.3.6.2. Market size and forecast, by IP source
7.3.6.3. Market size and forecast, by Application
7.3.7. Germany
7.3.7.1. Market size and forecast, by design IP
7.3.7.2. Market size and forecast, by IP source
7.3.7.3. Market size and forecast, by Application
7.3.8. France
7.3.8.1. Market size and forecast, by design IP
7.3.8.2. Market size and forecast, by IP source
7.3.8.3. Market size and forecast, by Application
7.3.9. Spain
7.3.9.1. Market size and forecast, by design IP
7.3.9.2. Market size and forecast, by IP source
7.3.9.3. Market size and forecast, by Application
7.3.10. Italy
7.3.10.1. Market size and forecast, by design IP
7.3.10.2. Market size and forecast, by IP source
7.3.10.3. Market size and forecast, by Application
7.3.11. Rest of Europe
7.3.11.1. Market size and forecast, by design IP
7.3.11.2. Market size and forecast, by IP source
7.3.11.3. Market size and forecast, by Application
7.4. ASIA-PACIFIC
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by design IP
7.4.3. Market size and forecast, by IP source
7.4.4. Market size and forecast, by Application
7.4.5. Market analysis, by country
7.4.6. China
7.4.6.1. Market size and forecast, by design IP
7.4.6.2. Market size and forecast, by IP source
7.4.6.3. Market size and forecast, by Application
7.4.7. Japan
7.4.7.1. Market size and forecast, by design IP
7.4.7.2. Market size and forecast, by IP source
7.4.7.3. Market size and forecast, by Application
7.4.8. India
7.4.8.1. Market size and forecast, by design IP
7.4.8.2. Market size and forecast, by IP source
7.4.8.3. Market size and forecast, by Application
7.4.9. Australia
7.4.9.1. Market size and forecast, by design IP
7.4.9.2. Market size and forecast, by IP source
7.4.9.3. Market size and forecast, by Application
7.4.10. South Korea
7.4.10.1. Market size and forecast, by design IP
7.4.10.2. Market size and forecast, by IP source
7.4.10.3. Market size and forecast, by Application
7.4.11. Rest of Asia-Pacific
7.4.11.1. Market size and forecast, by design IP
7.4.11.2. Market size and forecast, by IP source
7.4.11.3. Market size and forecast, by Application
7.5. LAMEA
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by design IP
7.5.3. Market size and forecast, by IP source
7.5.4. Market size and forecast, by Application
7.5.5. Market analysis, by country
7.5.6. Latin America
7.5.6.1. Market size and forecast, by design IP
7.5.6.2. Market size and forecast, by IP source
7.5.6.3. Market size and forecast, by Application
7.5.7. Middle East
7.5.7.1. Market size and forecast, by design IP
7.5.7.2. Market size and forecast, by IP source
7.5.7.3. Market size and forecast, by Application
7.5.8. Africa
7.5.8.1. Market size and forecast, by design IP
7.5.8.2. Market size and forecast, by IP source
7.5.8.3. Market size and forecast, by Application
CHAPTER 8: COMPANY PROFILES
8.1. ARM HOLDINGS PLC
8.1.1. Company overview
8.1.2. Company snapshot
8.1.3. Operating business segments
8.1.4. Business performance
8.1.5. Key strategic moves and developments
8.2. SYNOPSYS, INC.
8.2.1. Company overview
8.2.2. Company snapshot
8.2.3. Operating business segments
8.2.4. Business performance
8.2.5. Key strategic moves and developments
8.3. IMAGINATION TECHNOLOGIES GROUP PLC
8.3.1. Company overview
8.3.2. Company snapshot
8.3.3. Operating business segments
8.3.4. Product portfolio
8.3.5. Business performance
8.4. CADENCE DESIGN SYSTEMS, INC.
8.4.1. Company overview
8.4.2. Company snapshot
8.4.3. Operating business segments
8.4.4. Product portfolio
8.4.5. Business performance
8.4.6. Key strategic moves and developments
8.5. CEVA, INC.
8.5.1. Company overview
8.5.2. Company snapshot
8.5.3. Product portfolio
8.5.4. Business performance
8.5.5. Key strategic moves and developments
8.6. VERISILICON HOLDINGS CO., LTD.
8.6.1. Company overview
8.6.2. Company snapshot
8.6.3. Operating business segments
8.6.4. Key strategic moves and developments
8.7. EMEMORY TECHNOLOGY INC.
8.7.1. Company overview
8.7.2. Company snapshot
8.7.3. Operating business segments
8.7.4. Product portfolio
8.7.5. Business performance
8.7.6. Key strategic moves and developments
8.8. RAMBUS INC.
8.8.1. Company overview
8.8.2. Company snapshot
8.8.3. Operating business segments
8.8.4. Product portfolio
8.8.5. Business performance
8.8.6. Key strategic moves and developments
8.9. LATTICE SEMICONDUCTOR CORPORATION
8.9.1. Company overview
8.9.2. Company snapshot
8.9.3. Operating business segments
8.9.4. Product portfolio
8.9.5. Business performance
8.9.6. Key strategic moves and developments
8.10. SONICS, INC.
8.10.1. Company overview
8.10.2. Company snapshot
8.10.3. Operating business segments
8.10.4. Key strategic moves and developments