CHAPTER 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies

3.3. PORTERS FIVE FORCES ANALYSIS

3.3.1. Moderate bargaining power of suppliers
3.3.2. Moderate threat of new entrants
3.3.3. Moderate threat of substitutes
3.3.4. High-to-moderate intensity of rivalry
3.3.5. Moderate bargaining power of buyers

3.4. KEY PLAYER POSITIONING (2016)
3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Compact nature
3.5.1.2. Surge in demand for smart and power-efficient electronic devices
3.5.1.3. Rising adoption of IoT

3.5.2. Restraint

3.5.2.1. High initial cost of design & development and maintenance

3.5.3. Opportunity

3.5.3.1. Rising demand of compact and scalable ICs in global electronic industry

CHAPTER 4: SYSTEM ON CHIP MARKET, BY TYPE

4.1. OVERVIEW
4.2. DIGITAL

4.2.1. Key market trends
4.2.2. Key growth factors and opportunities
4.2.3. Market size and forecast, by region
4.2.4. Market analysis by country

4.3. ANALOG

4.3.1. Key market trends
4.3.2. Key growth factors and opportunities
4.3.3. Market size and forecast, by region
4.3.4. Market analysis by country

4.4. MIXED SIGNAL

4.4.1. Key market trends
4.4.2. Key growth factors and opportunities
4.4.3. Market size and forecast, by region
4.4.4. Market analysis by country

CHAPTER 5: SYSTEM ON CHIP MARKET, BY APPLICATION

5.1. OVERVIEW
5.2. CONSUMER ELECTRONICS

5.2.1. Key market trends
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country

5.3. TELECOMMUNICATION

5.3.1. Key market trends
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country

5.4. AUTOMOTIVE

5.4.1. Key market trends
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country

CHAPTER 6: SYSTEM ON CHIP MARKET, BY REGION

6.1. OVERVIEW
6.2. NORTH AMERICA

6.2.1. Key market trends
6.2.2. Key growth factors and opportunities
6.2.3. Market size and forecast, by type
6.2.4. Market size and forecast, by application
6.2.5. Market analysis by country
6.2.6. U.S.

6.2.6.1. Market size and forecast, by type
6.2.6.2. Market size and forecast, by application

6.2.7. Canada

6.2.7.1. Market size and forecast, by type
6.2.7.2. Market size and forecast, by application

6.2.8. Mexico

6.2.8.1. Market size and forecast, by type
6.2.8.2. Market size and forecast, by application

6.3. EUROPE

6.3.1. Key market trends
6.3.2. Key growth factors and opportunities
6.3.3. Market size and forecast, by type
6.3.4. Market size and forecast, by application
6.3.5. Market analysis by country
6.3.6. UK

6.3.6.1. Market size and forecast, by type
6.3.6.2. Market size and forecast, by application

6.3.7. Germany

6.3.7.1. Market size and forecast, by type
6.3.7.2. Market size and forecast, by application

6.3.8. France

6.3.8.1. Market size and forecast, by type
6.3.8.2. Market size and forecast, by application

6.3.9. Rest of Europe

6.3.9.1. Market size and forecast, by type
6.3.9.2. Market size and forecast, by application

6.4. ASIA-PACIFIC

6.4.1. Key market trends
6.4.2. Key growth factors and opportunities
6.4.3. Market size and forecast, by type
6.4.4. Market size and forecast, by application
6.4.5. Market analysis by country
6.4.6. China

6.4.6.1. Market size and forecast, by type
6.4.6.2. Market size and forecast, by application

6.4.7. Japan

6.4.7.1. Market size and forecast, by type
6.4.7.2. Market size and forecast, by application

6.4.8. India

6.4.8.1. Market size and forecast, by type
6.4.8.2. Market size and forecast, by application

6.4.9. Australia

6.4.9.1. Market size and forecast, by type
6.4.9.2. Market size and forecast, by application

6.4.10. Rest of Asia-Pacific

6.4.10.1. Market size and forecast, by type
6.4.10.2. Market size and forecast, by application

6.5. LAMEA

6.5.1. Key market trends
6.5.2. Key growth factors and opportunities
6.5.3. Market size and forecast, by type
6.5.4. Market size and forecast, by application
6.5.5. Market analysis by country
6.5.6. Latin America

6.5.6.1. Market size and forecast, by type
6.5.6.2. Market size and forecast, by application

6.5.7. Middle East

6.5.7.1. Market size and forecast, by type
6.5.7.2. Market size and forecast, by application

6.5.8. Africa

6.5.8.1. Market size and forecast, by type
6.5.8.2. Market size and forecast, by application

CHAPTER 7: COMPANY PROFILES

7.1. APPLE INC.

7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Operating business segments
7.1.4. Product portfolio
7.1.5. Business performance
7.1.6. Key strategic moves and developments

7.2. BROADCOM LIMITED

7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Operating business segments
7.2.4. Product portfolio
7.2.5. Business performance
7.2.6. Key strategic moves and developments

7.3. NXP SEMICONDUCTORS N.V. (FREESCALE SEMICONDUCTOR, LTD.)

7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Operating business segments
7.3.4. Product portfolio
7.3.5. Business performance
7.3.6. Key strategic moves and developments

7.4. INTEL CORPORATION

7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Product portfolio
7.4.5. Business performance
7.4.6. Key strategic moves and developments

7.5. MEDIATEK INC.

7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Product portfolio
7.5.4. Business performance
7.5.5. Key strategic moves and developments

7.6. QUALCOMM INCORPORATED

7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance
7.6.6. Key strategic moves and developments

7.7. SAMSUNG ELECTRONICS CO. LTD.

7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Product portfolio
7.7.5. Business performance
7.7.6. Key strategic moves and developments

7.8. STMICROELECTRONICS N.V.

7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Operating business segments
7.8.4. Product portfolio
7.8.5. Business performance
7.8.6. Key strategic moves and developments

7.9. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Operating business segments
7.9.4. Product portfolio
7.9.5. Business performance

7.10. TOSHIBA CORPORATION

7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Operating business segments
7.10.4. Product portfolio
7.10.5. Business performance