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Field Programmable Gate Array Market by technology (EEPROM, Antifuse, SRAM, Flash, and others (EPROM and PROM), by Application (data processing, consumer electronics, industrial, military & aerospace, automotive, telecom, and others), and by Type (high-end, mid-end, and low-end FPGA) - Global Opportunity Analysis and Industry Forecast, 2017-2023

Field Programmable Gate Array Market by technology (EEPROM, Antifuse, SRAM,...

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Field Programmable Gate Array Market by technology (EEPROM, Antifuse, SRAM, Flash, and others (EPROM and PROM), by Application (data processing, consumer electronics, industrial, military & aerospace, automotive, telecom, and others), and by Type (high-end, mid-end, and low-end FPGA) - Global Opportunity Analysis and Industry Forecast, 2017-2023
Field Programmable Gate Array Market...
Report Code
RO11/113/1083

Publish Date
01/Nov/2017

Pages
185
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CHAPTER 1 INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2 EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3 MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top winning strategies

3.2.2.1. Competitive intelligence and strategies of companies

3.2.3. Top investment pockets

3.3. PORTERS FIVE FORCES

3.3.1. Bargaining power of suppliers
3.3.2. Bargaining power of buyers
3.3.3. Threat of substitutes
3.3.4. Threat of new entrants
3.3.5. Competitive rivalry

3.4. MARKET SHARE ANALYSIS, 2016 (%)
3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Low/no non-recurring expenses (NRE)
3.5.1.2. Reusability
3.5.1.3. Simple design cycle

3.5.2. Restraint

3.5.2.1. High power consumption

3.5.3. Opportunity

3.5.3.1. Surge in demand of higher bandwidth devices for high-end applications

CHAPTER 4 FPGA MARKET, BY TYPE

4.1. OVERVIEW
4.2. HIGH-END FPGA

4.2.1. Key market trends
4.2.2. Key growth factors and opportunities
4.2.3. Market size and forecast

4.3. MID-END FPGA

4.3.1. Key market trends
4.3.2. Key growth factors and opportunities
4.3.3. Market size and forecast

4.4. LOW-END FPGA

4.4.1. Key market trends
4.4.2. Key growth factors and opportunities
4.4.3. Market size and forecast

CHAPTER 5 FPGA MARKET, BY TECHNOLOGY

5.1. OVERVIEW
5.2. EEPROM

5.2.1. Key market trends
5.2.2. Key growth factors and opportunities
5.2.3. Market size and forecast

5.3. ANTIFUSE

5.3.1. Key market trends
5.3.2. Key growth factors and opportunities
5.3.3. Market size and forecast

5.4. SRAM

5.4.1. Key market trends
5.4.2. Key growth factors and opportunities
5.4.3. Market size and forecast

5.5. FLASH

5.5.1. Key market trends
5.5.2. Key growth factors and opportunities
5.5.3. Market size and forecast

5.6. OTHERS (EPROM AND PROM)

5.6.1. Key market trends
5.6.2. Key growth factors and opportunities
5.6.3. Market size and forecast

CHAPTER 6 FPGA MARKET, BY APPLICATION

6.1. OVERVIEW
6.2. DATA PROCESSING

6.2.1. Key market trends
6.2.2. Key growth factors and opportunities
6.2.3. Market size and forecast

6.3. CONSUMER ELECTRONICS

6.3.1. Key market trends
6.3.2. Key growth factors and opportunities
6.3.3. Market size and forecast

6.4. INDUSTRIAL

6.4.1. Key market trends
6.4.2. Key growth factors and opportunities
6.4.3. Market size and forecast

6.5. MILITARY & AEROSPACE

6.5.1. Key market trends
6.5.2. Key growth factors and opportunities
6.5.3. Market size and forecast

6.6. AUTOMOTIVE

6.6.1. Key market trends
6.6.2. Key growth factors and opportunities
6.6.3. Market size and forecast

6.7. TELECOM

6.7.1. Key market trends
6.7.2. Key growth factors and opportunities
6.7.3. Market size and forecast

6.8. OTHERS (HEALTHCARE, TEST, AND MEASUREMENT & EMULATION)

6.8.1. Key market trends
6.8.2. Key growth factors and opportunities
6.8.3. Market size and forecast

CHAPTER 7 FPGA MARKET, BY GEOGRAPHY

7.1. OVERVIEW
7.2. NORTH AMERICA

7.2.1. Key market trends
7.2.2. Key growth factors and opportunities
7.2.3. Market size and forecast, by country
7.2.4. Market size and forecast, by type
7.2.5. U.S.

7.2.5.1. Market size and forecast

7.2.6. Canada

7.2.6.1. Market size and forecast

7.2.7. Mexico

7.2.7.1. Market size and forecast

7.3. EUROPE

7.3.1. Key market trends
7.3.2. Key growth factors and opportunities
7.3.3. Market size and forecast, by country
7.3.4. Market size and forecast, by type
7.3.5. Germany

7.3.5.1. Market size and forecast

7.3.6. UK

7.3.6.1. Market size and forecast

7.3.7. France

7.3.7.1. Market size and forecast

7.3.8. Russia

7.3.8.1. Market size and forecast

7.3.9. Rest of Europe

7.3.9.1. Market size and forecast

7.4. ASIA-PACIFIC

7.4.1. Key market trends
7.4.2. Key growth factors and opportunities
7.4.3. Market size and forecast, by country
7.4.4. Market size and forecast, by type
7.4.5. China

7.4.5.1. Market size and forecast

7.4.6. Japan

7.4.6.1. Market size and forecast

7.4.7. India

7.4.7.1. Market size and forecast

7.4.8. Australia

7.4.8.1. Market size and forecast

7.4.9. Rest of Asia-Pacific

7.4.9.1. Market size and forecast

7.5. LAMEA

7.5.1. Key market trends
7.5.2. Key growth factors and opportunities
7.5.3. Market size and forecast, by country
7.5.4. Market size and forecast, by type
7.5.5. Latin America

7.5.5.1. Market size and forecast

7.5.6. The Middle East

7.5.6.1. Market size and forecast

7.5.7. Africa

7.5.7.1. Market size and forecast

CHAPTER 8 COMPANY PROFILES

8.1. ACHRONIX SEMICONDUCTOR CORPORATION

8.1.1. Company overview
8.1.2. Company snapshot
8.1.3. Product portfolio

8.2. COBHAM PLC

8.2.1. Company overview
8.2.2. Company snapshot
8.2.3. Operating business segments
8.2.4. Product portfolio
8.2.5. Business performance

8.3. CYPRESS SEMICONDUCTOR CORPORATION

8.3.1. Company overview
8.3.2. Company snapshot
8.3.3. Operating business segments
8.3.4. Product portfolio
8.3.5. Business performance

8.4. INTEL CORPORATION

8.4.1. Company overview
8.4.2. Company snapshot
8.4.3. Operating business segments
8.4.4. Product portfolio
8.4.5. Business performance
8.4.6. Key strategic moves and developments

8.5. QUICKLOGIC CORPORATION

8.5.1. Company overview
8.5.2. Company snapshot
8.5.3. Product portfolio
8.5.4. Business performance
8.5.5. Key strategic moves and developments

8.6. MICROSEMI CORPORATION

8.6.1. Company overview
8.6.2. Company snapshot
8.6.3. Operating business segments
8.6.4. Product portfolio
8.6.5. Business performance
8.6.6. Key strategic moves and developments

8.7. TAIWAN SEMICONDUCTOR MANUFACTURING

8.7.1. Company overview
8.7.2. Company snapshot
8.7.3. Operating business segments
8.7.4. Product portfolio
8.7.5. Business performance

8.8. UNITED MICROELECTRONICS CORPORATION

8.8.1. Company overview
8.8.2. Company snapshot
8.8.3. Operating business segments
8.8.4. Product portfolio
8.8.5. Business performance
8.8.6. Key strategic moves and developments

8.9. XILINX INC.

8.9.1. Company overview
8.9.2. Company snapshot
8.9.3. Operating business segments
8.9.4. Product portfolio
8.9.5. Business performance
8.9.6. Key strategic moves and developments

8.10. LATTICE SEMICONDUCTOR CORPORATION

8.10.1. Company overview
8.10.2. Company snapshot
8.10.3. Operating business segments
8.10.4. Product portfolio
8.10.5. Business performance
8.10.6. Key strategic moves and developments

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