CHAPTER 1 Introduction
1.1. Report Description
1.2. Key Benefits for Stakeholders
1.3. Key Market Segments
1.4. Research Methodology
1.4.1. Secondary Research
1.4.2. Primary Research
1.4.3. Analyst Tools and Models
Chapter 2 Executive Summary
2.1. CXO Perspective
Chapter 3 Market Overview
3.1. Market Definition and Scope
3.2. Key Findings
3.2.1. Top Impacting Factors
3.2.2. Top Winning Strategies
3.2.3. Top Investment Pockets
3.3. Porters Five Forces Analysis
3.3.1. Porters Five Forces Analysis
3.4. Value Chain Analysis
3.4.1. Raw Material Providers
3.4.2. Manufacturers
3.4.3. Integrators
3.4.4. End Users
3.5. Pestle Analysis
3.6. Market Share Analysis, 2016
3.7. Competitive Analysis
3.8. Patent Analysis
3.9. Market Dynamics
3.9.1. Drivers
3.9.2. Restraint
3.9.3. Opportunity
CHAPTER 4 COMPOUND SEMICONDUCTOR MARKET, BY TYPE
4.1. INTRODUCTION
4.1.1. Key market trends, growth factors, and opportunities
4.1.2. Market size and forecast
4.2. III-V COMPOUND SEMICONDUCTORS
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast
4.2.3. Gallium nitride (GaN)
4.2.3.1. Market size and forecast
4.2.4. Gallium phosphide (GaP)
4.2.4.1. Market size and forecast
4.2.5. Gallium arsenide (GaAS)
4.2.5.1. Market size and forecast
4.2.6. Indium phosphide (InP)
4.2.6.1. Market size and forecast
4.2.7. Indium antimonide (InSb)
4.2.7.1. Market size and forecast
4.3. II-VI COMPOUND SEMICONDUCTORS
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast
4.3.3. Cadmium selenide (CdSe)
4.3.3.1. Market size and forecast
4.3.4. Cadmium telluride (CdTe)
4.3.4.1. Market size and forecast
4.3.5. Zinc selenide (ZnSe)
4.3.5.1. Market size and forecast
4.4. SAPPHIRE
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast
4.5. IV-IV COMPOUND SEMICONDUCTORS
4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast
4.5.3. Silicon carbide (SiC)
4.5.3.1. Market size and forecast
4.5.4. Silicon germanium (SiGe)
4.5.4.1. Market size and forecast
4.6. OTHERS
4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast
4.6.3. Aluminum gallium arsenide (AlGaAs)
4.6.3.1. Market size and forecast
4.6.4. Aluminum indium arsenide (AlInAs)
4.6.4.1. Market size and forecast
4.6.5. Aluminum gallium nitride (AlGaN)
4.6.5.1. Market size and forecast
4.6.6. Aluminum gallium phosphide (AlGaP)
4.6.6.1. Market size and forecast
4.6.7. Indium gallium nitride (InGaN)
4.6.7.1. Market size and forecast
4.6.8. Cadmium zinc telluride (CdZnTe)
4.6.8.1. Market size and forecast
4.6.9. Mercury cadmium telluride (HgCdTe)
4.6.9.1. Market size and forecast
CHAPTER 5 COMPOUND SEMICONDUCTOR MARKET, BY DEPOSITION TECHNOLOGY
5.1. INTRODUCTION
5.1.1. Key market trends, growth factors, and opportunities
5.1.2. Market size and forecast
5.2. CHEMICAL VAPOR DEPOSITION (CVD)
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast
5.2.3. Metal organic chemical vapor deposition (MOCVD)
5.2.3.1. Market size and forecast
5.3. MOLECULAR BEAM EPITAXY (MBE)
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast
5.3.3. Metal organic molecular beam epitaxy (MOMBE)
5.3.3.1. Market size and forecast
5.4. HYDRIDE VAPOR PHASE EPITAXY (HVPE)
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast
5.5. AMMONOTHERMAL
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast
5.5.2.1. Liquid Phase Epitaxy (LPE)
5.5.3. Key market trends, growth factors, and opportunities
5.5.4. Market size and forecast
5.6. ATOMIC LAYER DEPOSITION (ALD)
5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast
5.7. OTHERS
5.7.1. Key market trends, growth factors, and opportunities
5.7.2. Market size and forecast
CHAPTER 6 COMPOUND SEMICONDUCTOR MARKET, BY PRODUCT
6.1. INTRODUCTION
6.1.1. Key market trends, growth factors, and opportunities
6.1.2. Market size and forecast
6.2. POWER SEMICONDUCTOR
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast
6.3. TRANSISTOR
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast
6.3.3. High electron mobility transistors (HEMTs)
6.3.3.1. Market size and forecast
6.3.4. Metal oxide semiconductor field-effect transistors (MOSFETs)
6.3.4.1. Market size and forecast
6.3.5. Metal semiconductor field-effect transistors (MESFETs)
6.3.5.1. Market size and forecast
6.4. INTEGRATED CIRCUITS (ICS)
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast
6.4.3. Monolithic microwave integrated circuits (MMICs)
6.4.3.1. Market size and forecast
6.4.4. Radio frequency integrated circuits (RFICs)
6.4.4.1. Market size and forecast
6.5. DIODES & RECTIFIERS
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast
6.5.3. PIN diode
6.5.3.1. Market size and forecast
6.5.4. Zener diode
6.5.4.1. Market size and forecast
6.5.5. Schottky diode
6.5.5.1. Market size and forecast
6.5.6. Light-emitting diode (LED)
6.5.6.1. Market size and forecast
6.6. OTHERS
6.6.1. Key market trends, growth factors, and opportunities
6.6.2. Market size and forecast
CHAPTER 7 COMPOUND SEMICONDUCTOR MARKET, BY APPLICATION
7.1. INTRODUCTION
7.1.1. Key market trends, key growth factors, and opportunities
7.1.2. Market size and forecast
7.2. IT & TELECOM
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast
7.2.3. Signal amplifiers & switching systems
7.2.3.1. Market size and forecast
7.2.4. Satellite communication
7.2.4.1. Market size and forecast
7.2.5. Radar
7.2.5.1. Market size and forecast
7.2.6. RF
7.2.6.1. Market size and forecast
7.3. INDUSTRIAL AND ENERGY & POWER
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast
7.3.3. Smart grid
7.3.3.1. Market size and forecast
7.3.4. Wind turbines & wind power systems
7.3.4.1. Market size and forecast
7.3.5. Photovoltaic inverters
7.3.6. Motor drives
7.3.6.1. Market size and forecast
7.4. AEROSPACE & DEFENSE
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast
7.4.3. Combat vehicles
7.4.3.1. Market size and forecast
7.4.4. Ships & vessels
7.4.4.1. Market size and forecast
7.4.5. Microwave radiation
7.4.5.1. Market size and forecast
7.5. AUTOMOTIVE
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast
7.5.3. Electric vehicles & hybrid electric vehicles
7.5.3.1. Market size and forecast
7.5.4. Automotive braking systems
7.5.4.1. Market size and forecast
7.5.5. Rail traction
7.5.5.1. Market size and forecast
7.5.6. Automobile motor drives
7.5.6.1. Market size and forecast
7.6. CONSUMER ELECTRONICS
7.6.1. Key market trends, growth factors, and opportunities
7.6.2. Market size and forecast
7.6.3. Inverters
7.6.3.1. Market size and forecast
7.6.4. LED lighting
7.6.4.1. Market size and forecast
7.6.5. Switch mode consumer power supply system (SMPS)
7.6.5.1. Market size and forecast
7.7. HEALTHCARE
7.7.1. Key market trends, growth factors, and opportunities
7.7.2. Market size and forecast
7.7.3. Implantable medical devices (IMDs)
7.7.3.1. Market size and forecast
7.7.4. Biomedical electronics
7.7.4.1. Market size and forecast
CHAPTER 8 COMPOUND SEMICONDUCTOR MARKET, BY GEOGRAPHY
8.1. INTRODUCTION
8.2. NORTH AMERICA
8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast
8.2.3. U.S.
8.2.3.1. Market size and forecast
8.2.4. Canada
8.2.4.1. Market size and forecast
8.2.5. Mexico
8.2.5.1. Market size and forecast
8.3. EUROPE
8.3.1. Introduction
8.3.2. Key market trends, growth factors, and opportunities
8.3.3. Market size and forecast
8.3.4. UK
8.3.4.1. Market size and forecast
8.3.5. Germany
8.3.5.1. Market size and forecast
8.3.6. France
8.3.6.1. Market size and forecast
8.3.7. Rest of Europe
8.3.7.1. Market size and forecast
8.4. ASIA-PACIFIC
8.4.1. Introduction
8.4.2. Key market trends, growth factors, and opportunities
8.4.3. Market size and forecast
8.4.4. China
8.4.4.1. Market size and forecast
8.4.5. Japan
8.4.5.1. Market size and forecast
8.4.6. India
8.4.6.1. Market size and forecast
8.4.7. Australia
8.4.7.1. Market size and forecast
8.4.8. Rest of Asia-Pacific
8.5. LAMEA
8.5.1. Introduction
8.5.2. Key market trends, growth factors, and opportunities
8.5.3. Market size and forecast
8.5.4. Latin America
8.5.4.1. Market size and forecast
8.5.5. Middle East
8.5.5.1. Market size and forecast
8.5.6. Africa
8.5.6.1. Market size and forecast
CHAPTER 9 COMPANY PROFILE
9.1. CREE INC.
9.1.1. Company overview
9.1.2. Operating business segments
9.1.3. Business performance
9.2. INFINEON TECHNOLOGIES AG
9.2.1. Company overview
9.2.2. Operating business segments
9.2.3. Business performance
9.2.4. Key strategic moves and developments
9.3. INTERNATIONAL QUANTUM EPITAXY PLC.
9.3.1. Company overview
9.3.2. Operating business segments
9.3.3. Business performance
9.3.4. Key strategic moves and developments
9.4. TOSHIBA CORPORATION
9.4.1. Company overview
9.4.2. Operating business segments
9.4.3. Business performance
9.4.4. Key strategic moves and developments
9.5. LM ERICSSON TELEFON AB
9.5.1. Company overview
9.5.2. Operating business segments
9.5.3. Business performance
9.6. NXP SEMICONDUCTORS
9.6.1. Company overview
9.6.2. Operating business segments
9.6.3. Business performance
9.6.4. Key strategic moves and developments
9.7. RENESAS ELECTRONICS CORPORATION
9.7.1. Company overview
9.7.2. Operating business segments
9.7.3. Business performance
9.8. STMICROELECTRONICS NV
9.8.1. Company overview
9.8.2. Operating business segments
9.8.3. Business performance
9.8.4. Key strategic moves and developments
9.9. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
9.9.1. Company overview
9.9.2. Operating business segments
9.9.3. Business performance
9.9.4. Key strategic moves and developments
9.10. TEXAS INSTRUMENTS
9.10.1. Company overview
9.10.2. Operating business segments
9.10.3. Business performance
9.10.4. Key strategic moves and developments