Table of Contents:

1 Executive Summary
2 Market Dynamics
2.1 Market Drivers
2.2 Market Challenges
2.3 3D ICs Supply Chain
2.4 Porter's Five Forces Analysis

3 Global 3D ICs Market, By Technology
3.1 3D IC Technology Type Market
3.1.1 Market by Sub-segment
3.1.1.1 3D Stacked ICs
3.1.1.2 Monolithic 3D ICs
3.2 3D IC Packaging & Integration Type
3.2.1.1 3D system in package (3D Sip)
3.2.1.2 3D wafer level package (3D WLP)
3.2.1.3 2.5D & 3D interposer
3.2.1.4 3D Heterogeneous Integration

4 Global 3D IC Market, By Component
4.1 Introduction
4.2 Market by Sub-Segment
4.2.1 through Silicon Vias (TSVs)
4.2.2 through Glass Vias (TGVs)

5 Global 3D IC Market, by Products
5.1 Introduction
5.2 Market by Sub-Segment
5.2.1 CMOS Image Sensors
5.2.2 3D Memory
5.2.3 MEMS & Sensors
5.2.4 Light Emitting Diodes (LEDs)
6 Global 3D ICs Market, By Applications
6.1 Introduction
6.2 Market by Sub-Segment
6.2.1 IT/Telecommunications
6.2.2 Consumer Electronics
6.2.3 Industrial
6.2.4 Aerospace & Defence
6.2.5 Automotive
6.2.6 Medical
7 Global 3D ICs Market, By Region
7.1 Introduction
7.2 Market by Regions
7.2.1 North America
7.2.2 Europe
7.2.3 Asia-Pacific
7.2.4 Middle East & Africa

8 Competitive Landscape
8.1 Introduction
8.2 Competitive Scenario
8.3 Market Share Analysis
8.4 Company Profiles

8.4.1 Xilinx Inc.
8.4.1.1 Company Overview
8.4.1.2 Product/Services Offering
8.4.1.3 Strategy
8.4.1.4 SWOT Analysis

8.4.2 Tezzaron Semiconductor Corporation
8.4.2.1 Company Overview
8.4.2.2 Product/Services Offering
8.4.2.3 Business Strategy
8.4.2.4 SWOT Analysis

8.4.3 BeSang Inc.
8.4.3.1 Company Overview
8.4.3.2 Product/Services Offering
8.4.3.3 Business Strategy
8.4.3.4 SWOT Analysis

8.4.4 Monolithic 3D Inc.
8.4.4.1 Company Overview
8.4.4.2 Product/Services Offering
8.4.4.3 Business Strategy
8.4.4.4 SWOT Analysis

8.4.5 United Microelectronics Corporation
8.4.5.1 Company Overview
8.4.5.2 Product/Services Offering
8.4.5.3 Business Strategy
8.4.5.4 SWOT Analysis

8.4.6 3M Company
8.4.6.1 Overview

8.4.7 Intel Corporation
8.4.7.1 Company Overview
8.4.7.2 Product/Services Offering

8.4.8 IBM Corporation
8.4.8.1 Company Overview