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Semiconductor Assembly Equipment Market by Product Type (Inspection & dicing equipment, Die-attach equipment, Wire bonding equipment, Plating equipment); by Supply Chain Process (IDM, OSAT, Foundry); by End-user Industry (Consumer electronics, Healthcare, Automotive, IT & telecommunication, Others); by Region (North America, Europe, Asia Pacific, Middle East & Africa (MEA), South America) : Global opportunity analysis and industry forecast 2021-2027

Semiconductor Assembly Equipment Market by Product Type (Inspection & dicing...

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Semiconductor Assembly Equipment Market by Product Type (Inspection & dicing equipment, Die-attach equipment, Wire bonding equipment, Plating equipment); by Supply Chain Process (IDM, OSAT, Foundry); by End-user Industry (Consumer electronics, Healthcare, Automotive, IT & telecommunication, Others); by Region (North America, Europe, Asia Pacific, Middle East & Africa (MEA), South America) : Global opportunity analysis and industry forecast 2021-2027
Semiconductor Assembly Equipment Market by...
Report Code
RO14/128/1783

Publish Date
30/Sep/2021

Pages
190
PRICE
$ 4570 /-
$ 5450 /-
$ 7695 /-

The valued size of the global semiconductor assembly equipment market was more than $3,599 million in 2020. The market is likely to grow at a CAGR of 8.2% during the forecast period from 2021 to 2027. 

Semiconductor assembly is a process taken out to ensure the working of semiconductor devices. The equipment has significant use in developing semiconductor part assembly, water fabrication, and device testing. Semiconductors are made of crystalline materials to control the current in the product. The materials possess free electrons in the body that allows the smooth flow of electricity between atoms.

The semiconductor manufacturing process requires water fabrication equipment at the primary stage. Meanwhile, the process then requires the use of the assembly equipment to wind it up after testing. 

Factors affecting

Due to the growing investments by Integrated Device manufacturer companies, the R&D sector is likely to grow new technologies in the upcoming years. The companies are making advancements with energy-efficient and miniaturized products like low-power microcontrollers, RFID circuits, integrated circuits, and high-level sensors for automotive, electronics, and industrial applications. The growth in technology and investments can accelerate the growth of the global semiconductor assembly equipment market. 

Companies have been working on developing advanced semiconductor assembly equipment. The up-gradation of the product portfolio will certainly, sustain the growth of the semiconductor assembly equipment market. In 2021, Applied Materials, Inc. launched Alx TM, a device to stimulate the assembly and manufacturing process of the existing technology chip. Furthermore, Applies Material and BE semiconductor Industries N.V partnered to produce a solution for die-based hybrid connection with chip-to-chip technology to amend the performance.

Such growing strategies will fuel the extension of the semiconductor assembly equipment market during the forecast period.

COVID-19 Impact

The spread of COVID-19 infection inhibited the operations of the semiconductor assembly equipment business. 

The lifting of lockdown restriction and decline in the COVID-19 cases are likely to reduce the deceleration of the market. Thus, the global semiconductor assembly equipment market may recover by the beginning of 2022. 

The introduction of COVID-19 vaccines will further recuperate the previous growing stage if companies re-initiate with the full-scale capacities again. 

Regional Analysis

Asia-Pacific dominated the global semiconductor assembly equipment market by acquiring the highest market share and is expected to grow by registering the highest CAGR during the forecast period. 

Due to the high involvement of Integrated circuits makers, the region will witness the growing requirement of semiconductor assembly equipment. 

Integrated circuits are exerted in industrial sectors like electronics, telecommunications, data centers, and automotive. Worldwide advancement in the chip fabrication facilities will strengthen the expansion of the semiconductor industry in Asia during the forecast period.

Key Segments

By Product Type

  • Inspection & dicing equipment
  • Die-attach equipment
  • Wire bonding equipment
  • Plating equipment

By Supply Chain Process

  • IDM
  • OSAT
  • Foundry

By End-user Industry

  • Consumer electronics
  • Healthcare
  • Automotive
  • IT & telecommunication
  • Others

By Region

  • North America
  • The U.S.
  • Canada
  • Mexico
  • Europe
  • Western Europe
  • The UK
  • Germany
  • France
  • Italy
  • Spain
  • Rest of Western Europe
  • Eastern Europe
  • Poland
  • Russia
  • Rest of Eastern Europe
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia & New Zealand
  • ASEAN
  • Rest of Asia Pacific
  • Middle East & Africa (MEA)
  • UAE
  • Saudi Arabia
  • South Africa
  • Rest of MEA
  • South America
  • Brazil
  • Argentina
  • Rest of South America

Key Players

  • AlsilMaterial
  • Applied Materials Inc.
  • ASML Holdings N.V.
  • Intel Corporation
  • Micron Technology Inc.
  • Qualcomm Technologies, Inc.
  • Samsung Group
  • Screen Holdings Co., Ltd.
  • Teradyne Inc.
  • Tokyo Electron Limited.
  • Other Prominent Players

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