As the global economy recovers in 2021 and the supply of the industrial chain improves, the BGA Package Substrate market will undergo major changes. The latest research shows that the BGA Package Substrate industry market size will be million US dollars in 2021, and will grow to million US dollars in 2028, with an average annual growth rate of %.

The global BGA Package Substrate industry report provides top-notch qualitative and quantitative information including: Market size (2017-2021 value and 2022 forecast). The report also contains descriptions of key players, including key financial indicators and market competitive pressure analysis.

The report also assesses key opportunities in the market and outlines the factors that are and will drive the growth of the industry. Taking into account previous growth patterns, growth drivers, and current and future trends, we also forecast the overall growth of the global BGA Package Substrate market during the next few years. The global BGA Package Substrate market size will reach USD million in 2028, growing at a CAGR of % during the analysis period.

Highlights-Regions

The BGA Package Substrate market can be split based on product types, major applications, and important regions as follows:

North America
Europe
Asia Pacific
Latin America

Player list
IBIDEN
SHINKO
SimmTech
Korea Circuit
SAMSUNG ELECTRO-MECHANICS
SEP Co ., Ltd
Nan Ya PCB Corporation
Siliconware Precision Industries
LG Innotek
TOPPAN INC
Kyocera
QP Technologies
FICT Limited
Shenzhen Hemeijingyi
Zhen Ding Technology
AT&S
KINSUS
Daeduck Electronics
ASE Technology
ACCESS

Types list
WB BGA
FC-BGA

Application list
MPU/CPU/Chipset
GPU and CPU
ASIC/DSP Chip/FPGA
Others