In this report, global IC-Substrate Market will reach 9968 Million USD by the end of 2022 with a CAGR of 3.8%

In 2016, global IC substrate production was 17.4 million square meter and it will reach 22.4 square meter in 2022; while the IC substrate revenue was 7986 million USD in 2016 and it will be 9968 million USD in 2022, with a CAGR of 3.8% between 2016 and 2022.

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.

IC-Substrate can be divided into five categories: FC-CSP type, FC-BGA type, CSP type, BGA type and other types. FC-CSP type accounted for the highest proportion in output market, with a figure of 34.65% in 2017, followed by CSP type, account for 21.85%.

The consumption market share of global IC-Substrate in PC (Tablet, Laptop) use, Smart Phone use, Wearable Devices use and other applications have been stable year by year, at 45.21%, 37.77%, 8.50% and 8.52% respectively in 2017, and for several consecutive years, the amplitude was within one percent. This indicates that the segment of the IC-Substrate in the global market tends to be fixed without great changes. Among them, the IC-Substrate market has the most promising sales prospects in PC (Tablet, Laptop) use.

The global IC-Substrate market is dominated by few players from Japan, Korea and Taiwan, like Ibiden(JP), Shinko Electric Industries(JP), Kyocera(JP) and Eastern(JP) from Japan, Unimicron(TW), Kinsus(TW), Nanya(TW), Zhen Ding Technology(TW) and ASE(TW) from Taiwan, Semco(KR), LG Innotek(KR), Simmtech(KR), Daeduck(KR) and KCC(KR) from Korea.
China is also an important producer, the Taiwanese manufacturers Unimicron, Kinsus and Nanya have manufacturing factories in Suzhou and Kunshan; there are also four local producers AT&S (a Austrian company, has IC substrate factories in Chongqing, China), Shennan Circuit(CN), ACCESS(CN) and Shenzhen Fastprint Circuit Tech(CN).

This report focuses on top manufacturers in global market, Involved the assessment of Sales, price, revenue and market share for each manufacturer, covering
Ibiden(JP)
Shinko Electric Industries(JP)
Kyocera(JP)
Eastern(JP)
TTM Technologies(US)
Unimicron(TW)
Kinsus(TW)
Nanya(TW)
ASE(TW)
Semco(KR)
LG Innotek(KR)
Simmtech(KR)
Daeduck(KR)
KCC(KR)
Zhen Ding Technology(TW)
AT&S (a Austrian company, has IC substrate factories in Chongqing, China)
Shennan Circuit(CN)
ACCESS(CN)
Shenzhen Fastprint Circuit Tech(CN)
...

On the basis of product, this report displays the Sales, revenue, price, market share and growth rate of each type, primarily split into
FC-CSP
FC-BGA
CSP
BGA

By Application, this report focuses on Sales, Market share and Growth Rate of each application, can be divided into
PC (Tablet, Laptop)
Smart Phone
Wearable Devices
Others

By Regions, this report splits global market into several key regions, with Sales, Revenue, Price and Gross Margin market share of top players in these regions, from 2014 to 2026 (forecast), like
China
USA
Europe
Japan
Korea
India
Southeast Asia
South America

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