According to this latest study, the 2021 growth of ABF Substrate (FC-BGA) will have significant change from previous year. By the most conservative estimates of global ABF Substrate (FC-BGA) market size (most likely outcome) will be a year-over-year revenue growth rate of % in 2021, from US$ 3135.3 million in 2020. Over the next five years the ABF Substrate (FC-BGA) market will register a 7.8% CAGR in terms of revenue, the global market size will reach US$ 4230.9 million by 2026.

This report presents a comprehensive overview, market shares, and growth opportunities of ABF Substrate (FC-BGA) market by product type, application, key manufacturers and key regions and countries.

Segmentation by number of layer: breakdown data from 2016 to 2021, in Section 2.3; and forecast to 2026 in section 11.7.
4-8 Layers
8-16 Layers
Others

Segmentation by application: breakdown data from 2016 to 2021, in Section 2.4; and forecast to 2026 in section 11.8.
PCs
Server & Switch
Game Consoles
AI Chip
Communication Base Station
Others

This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in Chapter 3.
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech
ACCESS
National Center for Advanced Packaging (NCAP China)