Asia-Pacific Wi-Fi chipset market is expected to register a substantial CAGR in the forecast period of 2019-2026. The new market report contains data for historic year 2017, the base year of calculation is 2018 and the forecast period is 2019 to 2026
Market Segmentation
By Devices (Smartphones, Connected Home Devices, Access Point Equipment, PCs, Tablets, Others), Band (Single Band, Dual Band, Tri Band), Wi-Fi Standard (802.11n, 802.11ac, Wave 2, 802.11ac, Wave 1, 802.11ax, 802.11ad, 802.11ay, 802.11b, 802.11g, Others), MIMO Configuration (MU-MIMO, 4x4 MU-MIMO, 8x8 MU-MIMO, SU-MIMO, 3x3 MU-MIMO, 2x2 MU-MIMO, 1x1 MU-MIMO), Country (Japan, China, South Korea, India, Hong Kong, Australia, Singapore, Thailand, Malaysia, Taiwan, Indonesia, Philippines, Rest of Asia Pacific)

Major growing sectors under the market segmentation are as follows:

> Growing demand for electronic components
> Increasing usage of smartphones

Key Market Players

The key market players of Asia-Pacific Wi-Fi chipset market are:
> Intel Corporation
> Qualcomm Technologies, Inc.
> Broadcom
> Altair Semiconductor
> Celeno Communications
> STMicroelectronics
> MediaTek Inc.
> Cypress Semiconductor Corporation
> PERASO TECHNOLOGIES INC.
> Semiconductor Components Industries, LLC
> Texas Instruments Incorporated