Global 3D IC market report includes comprehensive and profound analysis on the global and regional level. The study gives historic data of the year 2015 and forecast for 2017-2022 on the basis of revenue (USD Million). Assessment of market dynamics gives a brief thought about the drivers, restraints, and opportunities of global 3D IC market.
In order to give a comprehensive view of the 3D IC market, we have incorporated competitive landscape, value chain analysis, and analysis of Porters Five Forces model for this market. The study includes a market attractiveness analysis, in which product segments and application segments are assessed on the basis of their market size, general attractiveness, and growth rate.
The report provides company market share analysis in order to give a broader overview of the key players in the market. Additionally, the report also covers strategic developments of the market including acquisitions mergers, new product launch, agreements, partnerships, collaborations joint ventures and research development, product regional expansion.
The study provides a decisive view on the 3D IC market by segmenting the market based on product substrate type, substrate, applications, and regions. All the segments have been analyzed based on present and future trends and the market is estimated from 2016 to 2022. Based on the product the market is segmented into LED, memories, MEMS, sensor, logic and others. Key application market covered under this study includesinformation and communication technology, military, consumer electronics and others applications. The regional segmentation includes the current and forecast demand for Asia-Pacific, Europe, North America, Latin America and Middle East Africa.
Some of the key players in 3D IC market include 3M Company, Tezzaron Semiconductor Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., Xilinx, United Microelectronics Corporation, STMicroelectronics and amongst others.
This report segments the global 3D IC market as follows:
3D IC Market:Product Segment Analysis
LED
Memories
MEMS
Sensor
Logic
Others
3D IC Market:Substrate Type Segment Analysis
Silicon on Insulator (SOI)
Bulk Silicon
3D IC Market:Application Segment Analysis
Information and Communication Technology
Military
Consumer Electronics
Others
3D IC Market: Regional Segment Analysis
North America
U.S.
Europe
UK
France
Germany
Asia Pacific
China
Japan
India
Latin America
Brazil
Middle East and Africa