IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
This industry is affected by the economy and policy, so it?s important to put an eye to economic indexes and leaders? prefer. With the global economic recovery, more and more people pay attention to rising environment standards, especially in underdevelopment regions that have a large population and fast economic growth, the need will increase.
The industry is a high-technology and high-profit industry, the research team maintain a very optimistic attitude. It is suggested that the new enterprises to enter the field.
We tend to believe this industry now is close to mature, and the consumption increasing degree will show a smooth curve. On product prices, the slow downward trend in recent years will maintain in the future, as competition intensifies, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.

According to this study, over the next five years the IC Packaging market will register a xx% CAGR in terms of revenue, the global market size will reach USD xx million by 2024, from USD xx million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in IC Packaging business, shared in Chapter 3.

This report presents a comprehensive overview, market shares, and growth opportunities of IC Packaging market by product type, application, key manufacturers and key regions and countries.

This study considers the IC Packaging value and volume generated from the sales of the following segments-

Segmentation by product type- breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
DIP
SOP
QFP
QFN
BGA
CSP
LGA
WLP
FC
Segmentation by application- breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
CIS
MEMS
Others

This report also splits the market by region- Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report- Breakdown data in in Chapter 3.
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond

In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.

Research objectives
To study and analyze the global IC Packaging consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of IC Packaging market by identifying its various subsegments.
Focuses on the key global IC Packaging manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the IC Packaging with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of IC Packaging submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.